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高温成形

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Effect of Heat Treatment on Microstructure and Mechanical Properties of Laser Solid Forming Inconel 718 Superalloy.

热处理对激光立体成形Inconel 718高温合金组织和力学性能的影响。

Heat resistant resin for RTM process is prepared,which could be used for missile radomes.

以某飞行器透波结构件对材料的要求为背景,研制了可用于RTM 成形工艺的耐高温树脂SH。

In order to fabricate high–silicon aluminum alloy electronic packaging materials, the oxidating processes in high temperature oxygenation was applied to the Al-30Si and Al-40Si high-silicon aluminum alloys which were prepared through extrusion process. Scanning electron microscope, optical microscopy, thermal physical tester and universal material testing machine were used to study the microstructure, density, hermeticity, coefficient of thermal expansion, thermal conductivity and compressive strength.

摘 要:针对应用广泛的高硅铝合金电子封装材料,采用高温充氧氧化工艺,对已挤压成形的Al-30Si及Al-40Si高硅铝合金材料进行后续处理,通过扫描电镜、金相显微镜、热物性测试仪及电子万能拉伸试验机等,对材料显微组织、密度、气密性、热膨胀系数、热导率及抗压强度进行了分析比较。

In order to fabricate high–silicon aluminum alloy electronic packaging materials,the oxidating processes in high temperature oxygenation was applied to the Al-30Si and Al-40Si high-silicon aluminum alloy s which were prepared through extrusion process.

针对应用广泛的高硅铝合金电子封装材料,采用高温充氧氧化工艺,对已挤压成形的Al-30Si及Al-40Si 高硅铝合金材料进行后续处理,通过扫描电镜、金相显微镜、热物性测试仪及电子万能拉伸试验机等,对材料显微组织、密度、气密性、热膨胀系数、热导率及抗压强度进行了分析比较。

In order to fabricate high–silicon aluminum alloy electronic packaging materials,the oxidating processes in high temperature oxygenation was applied to the Al-30Si and Al-40Si high-silicon aluminum alloys which were prepared through extrusion process.

针对应用广泛的高硅铝合金电子封装材料,采用高温充氧氧化工艺,对已挤压成形的Al-30Si及Al-40Si高硅铝合金材料进行后续处理,通过扫描电镜、金相显微镜、热物性测试仪及电子万能拉伸试验机等,对材料显微组织、密度、气密性、热膨胀系数、热导率及抗压强度进行了分析比较。

The strain hardening coefficient n and deformation activation energy Q were evaluated by linear regression analysis.

因此,超高强铝合金的高温变形特性对制订该类合金的成形工艺具有重要的工程意义。

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本文从逻辑设计的角度讨论遥测输出接口的设计及实现方法。

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