风板

Considering the characteristics of linear grill which is widely used in vertical display cases, a two-fluid model for the air supply opening was set up.

摘 要根据立式陈列柜风幕广泛采用的蜂窝板风口的特点，提出了基于双流体模型的风口模型。

Encapsulant was driven by capillary force into the space between the chip and substrate. Underfill technique can protect the electrical device and prevent the device from destroying because of external force. Underfill has many defects including the fill time is too long, the situation of short shot and air trap are caused easily, the yield of product of Flip-Chip is not highest and the products are universal. Therefore, there are many factors being studied in this paper to sum up the influence of underfill of Flip-Chip process cause by model parameters.

覆晶接合技术为先进电子讯号连接技术中的一种，具有高I/O数、电子讯号路径短以及尺寸小等优点，而采用覆晶接合之电子元件大部分均以底部充填技术进行封装；底部充填是一种以毛细作用为驱动力在晶片与基板之间的间隙充填底胶的封装技术，可以确保晶片不受到外力的影响而损及封装体，但此技术具有充填时间长、容易产生短射与包风等缺点，使得覆晶封装制程良率不高，间接影响覆晶封装产品的普及率，因此本文将依各种可能之参数模型对覆晶封装底部充填制程的影响，以供业界参考。

A surface evaporating air cooler heat exchange tube with membrane plate can improve the water membrane area and improve the evaporation heat transmission, without significant wind resistance.

带有增膜板的表面蒸发空冷器换热管束，属于表面蒸发式空冷器的组成部件，特别涉及表面蒸发空冷器换热管束，以有效扩大水膜面积，强化蒸发传热，且不明显增加风阻。

Plunder melds and run with this jewel!

掠夺melds和运行与此宝石！

My dream is to be a crazy growing tree and extend at the edge between the city and the forest.

此刻，也许正是在通往天国的路上，我体验着这白色的晕旋。