镍

But the existed references only gave some partial and simple researches on this composite. So, a systematic research about the effect of each factor on the composite electrodeposit was performed in this thesis.

但已有文献仅对碳纳米管增强镍基复合镀层的部分性能有所简单描述，本文系统研究了各种工艺参数对碳纳米管增强镍基复合镀层性能的影响。

The purpose of the study was to investigate the mechanism of nickel-tungsten electrodeposition.

为进一步探讨镍钨合金的电沉积机理，采用循环伏安法和电位阶跃法研究了玻碳电极上镍钨电沉积的循环伏安特性和初期行为。

Finally, the performance of the electroforming nickel layer accords with our use requirements using the optimum process parameters to electroform nickel in a model ship.

最后，采用本文研究得出的最佳工艺参数在一模型船上电铸镍，得到镍铸层的性能符合使用要求。

Using nickel aminosulfonic bath as a study system of electroform ing and by adding cobalt aminosulfonic,the internal stress,composition,hardness and tensile strength of the electroform ed nickel-cobalt deposit were tested.

采用氨基磺酸镍镀液作为电铸的研究体系，并在镀液中加入氨基磺酸钴，对镍钴合金电铸层的内应力、组成、硬度、抗拉强度等进行了测试。

In this paper,the electroforming technique summarized by our laboratory for making holographic Nickel Dies is reported.

本文介绍了我们在实验中总结出的电铸全息镍压模的工艺，并详细讨论了该工艺对镍层性能的影响，最后给出了杂质对镀层的影响及去除方法。

Alloy electroforming of nickel and manganese with average grain sizes below 100nm were carried out.

开展了镍锰合金纳米晶电铸研究，获得了晶粒尺寸在60-100nm范围的镍锰合金电铸层。

It has been well established that metals present in trace amount in raw materials have great influence not only on the anode quality but also on the performance of anodes in the electrolytic cell and on the quality of aluminum liquids.

测定了抚顺铝厂所用的4种炭电极原材料中铁、钙和镍的含量，结果表明，仅从铁、钙、镍三种微量元素含量的角度来选择原材料，辽阳3号延迟焦和改质沥青在提高产出铝的质量，降低阳极消耗方面来说是较好的选择。

The two most common methods for treating spent baths have been either to precipitate the nickel or to reduce the nickel ions electrolytically/chemically.

两种最常用的治疗方法已被用于洗澡或沉淀的镍或减少镍离子电解/化学。

The sludge volume generated by precipitation can be reduced by 99% by first stripping out the nickel ion electrolytically and then precipitating the remaining nickel with sulfur-containing precipitating agents such as sodium sulfide.

沉淀的污泥产生量可减少99％，先剥离出电解镍离子沉淀，然后用含硫的沉淀剂，如硫化钠其余镍。

According to IS theory as well as die bond requirement in reality, Au/In was chosen by virtue of appropriate equilibrium diagram and high reaction rate from a variety of binary alloy systems as die bond media. To match CET of chip material of silicon, alloy 42 (Iron-Nickel) rather than copper—2 kinds of lead-frame materials in most common usage, was selected as substrate.

根据等温凝固原理和芯片焊接的实际需要，从多组二元合金中选出了共熔点低、反应速度快的金和铟作为焊接材料；并以硅片作为芯片，从目前最常用的框架材料—铜和铁镍四十二合金中，选出了与硅的热膨胀系数相近的铁镍四十二合金作为衬底材料。

The split between the two groups can hardly be papered over.

这两个团体间的分歧难以掩饰。

This approach not only encourages a greater number of responses, but minimizes the likelihood of stale groupthink.

这种做法不仅鼓励了更多的反应，而且减少跟风的可能性。