锡

I plant perennial supply of chemical plating material: nickel sulphate, chloride nickel, nickel nitrate, ammonium chloride, sodium hypophosphite, sodium citrate, ammonium citrate, potassium citrate, chromium oxide, red Lead oxide, palladium chloride, SnCl2, crystal tin tetrachloride, the resistance of fuse, lithium fluoride, sulfuric acid cadmium, Na2HPO4, bismuth chloride, bismuth oxide, oxide Thallium sulfate Cobalt, cobalt nitrate, cobalt chloride, barium hydroxide, calcium hydroxide, fine chemical products.

我厂常年供应化学镀材料：硫酸镍、氯化镍、硝酸镍、氯化铵、次亚磷酸钠、柠檬酸三钠、柠檬酸三铵、柠檬酸钾、三氧化铬、红色氧化铅、氯化钯、氯化亚锡、结晶四氯化锡、电阻熔断剂、氟化锂、硫酸镉、磷酸氢二钠、氯化铋、三氧化二铋、三氧化二铊、硫酸钴、硝酸钴、氯化钴、氢氧化钡、氢氧化钙等精细化工产品。

The orthogonal experiment also indicates that the speed of cylinder., the speed of licker-in, the output speed of the carding sliver and the neps and short fibre. To further optimize the above four factors , a regress equation can be moleculed by the neps and the first three factors, Which can provide a theory for analyzhg neps controlling.

正交试验结果表明：锡林速度、刺辊速度、道夫速度、出条速度对棉结与短绒的影响不完全一致，在对这四个参数进行优化组合基础上，进一步建立棉结与锡林速度、刺辊速度、出条速度三个因素间的回归方程，为生条棉结控制提供了定性分析的理论依据。

My company is a company specializing in electronic assembly equipment and service providers, the overwhelming majority of the electronics industry to provide customers screen printing machine, SMT machine, reflow oven, wave soldering, solder paste mixer, solder paste printer, connected to Detect Units, on board machines, under the board machine, a plate feeder Electronics Units SMT production lines, such as the preparation, installation, debugging and so on.

我公司是一家专业电子组装设备及服务提供商，为电子行业的广大客户提供丝印机、贴片机、回流焊炉、波峰焊、锡膏搅拌机、锡膏印刷机、检测接驳台、上板机、下板机、出板接驳台等SMT电子生产线的筹建、安装、调试等。

Tiro the robot assisted at the wedding of Seok Gyeong-Jae, one of the engineers who designed it, and his bride at Daejeon, 130 kilometres (78 miles) south of Seoul.

这个名叫泰罗的机器人为它的设计工程师之一锡京载的婚礼担任了司仪，锡工程师的婚礼在位于首尔以南130公里的大田市举行。

This is Tiro , master of ceremonies for today's wedding, the robot-- featuring a cone-shaped body, two arms and a dark-glassed face with eyes and a mouth of flashing lights-- said in front of smiling guests.

这个名叫泰罗的机器人为它的设计工程师之一锡京载的婚礼担任了司仪，锡工程师的婚礼在位于首尔以南130公里的大田市举行。

Some novel alkaline earth stannates with unusual 1D, 2D and 3D frameworks have been developed and some of them show microporous features.

利用水热法合成了具有一维孔道、二维层状、三维骨架结构的新颖碱土锡酸盐，拓宽了碱土锡酸盐的化学物种，并且某些化合物具有微孔性能。

ABSTRACT in the first part of this thesis, the interaction between cu-sn and ni-sn interfacial reactions in a soldering system has been studied by using a ni-sn3.5ag-cu sandwich structure. a layer of cu-sn intermetallic compound was observed at the interface of the ni foil after 30 seconds reflowing.

在电子元件高功率及及轻、薄、短、小化的要求下，热一直是造成电子元件失效的原因之一，BGA封装的主要失效原因是作为接点的锡铅共熔合金（63Sn-37Pb；或称锡球）的疲劳破裂，这是导因於封装体不同材料间热膨胀系数的差异所造成的热应变。

As solder paste is printed through the stencil apertures, it forms deposits that hold the components in place and, when reflowed, secures them to the substrate.

由于锡膏通过钢网进行印刷。印刷的锡膏将部品固定，回流时，将部品固定于基板。

In the microstructure of solder matrix, Ce-dope results in the formation of precipitated CeSn3 clusters in the reflowed solder matrix and the oxidation of CeSn3 clusters makes the tin whisker grow.

在添加稀土元素后，锡球内部可观察到CeSn3介金属，CeSn3氧化后可观察到锡须形成，导致此种无铅焊锡在使用上将因可靠度而受到限制。

At points to which a wiring system is to be connected, thickness is min 0.78 mm for uncoated steel, min 0.88 mm for a zinc-coated steel and min 1.16 mm fornonferrous metal.

在电线连接的地方，不镀锡钢材的最小厚度为0.78mm，，对于镀锡钢材，其最小厚度为0.88mm，对于有色金属，其最小厚度为1.16mm。

The split between the two groups can hardly be papered over.

这两个团体间的分歧难以掩饰。

This approach not only encourages a greater number of responses, but minimizes the likelihood of stale groupthink.

这种做法不仅鼓励了更多的反应，而且减少跟风的可能性。