铅锡合金

The electroplate technology of the series of fluoroborate plating liquid and lead-tin alloys are used diffusely in traditional plating industry.

传统工业上多采用氟硼酸盐电镀液系列和锡铅合金电镀工艺。

In view of the improvement on environmental protection and the reduction of costs for PCB fabrication, emphasis has been placed on the use of corrosion inhibitors as replacements for conventional tin -lead electrodeposits for the preservation of solderability.

鉴于电路板生产过程中环保和成本的要求，采用唑类缓蚀剂取代传统的锡铅合金镀层以保证可焊性。

The effects of bath composition, cathodic current density and temperature of alkylsulfonate base tin-lead alloy electroplating on tin content and thickness of electrodeposits were studied through Hull cell test.

利用赫尔槽试验研究了烷基磺酸盐电镀锡铅合金工艺中电流密度、主盐浓度、游离酸浓度及温度对镀层厚度和组成的影响。

The formation of Au-Sn-Ni IMC at solder joint degrades ball shear strength, however, this phenomenon can not be observed in lead free system.

分析表明有两种可能的原因使得无铅产品在焊点附近不能生成金－锡－镍合金。

And Pharaoh spoke to Joseph, saying, Your father and your brothers have come to you.

47：5 法老对约瑟说，你父亲和你弟兄们到你这里来了。

Additionally, the approximate flattening of surface strip using lines linking midpoints on perpendicular lines between geodesic curves and the unconditional extreme value method are discussed.

提出了用测地线方程、曲面上两点间短程线来计算膜结构曲面测地线的方法，同时，采用测地线间垂线的中点连线和用无约束极值法进行空间条状曲面近似展开的分析。