钎焊

Gas welding of brass, also braze welding of copper, steel and cast iron.

熔点约900℃。黄铜气焊用，也可钎焊铜、钢、铸铁

GEA Ecoflex is the direct successor to the company of Eduard Ahlborn that was pioneering in the invention of plate heat exchangers in 1928.Since 1995 it is the competence center within the GEA Group for gasketed, brazed and fullywelded plate heat exchangers.

GEA Ecoflex前身为Eduard Ahlborn公司——世界第一台板式换热器的发明者。1995年起，它是GEA集团中生产密封圈式，钎焊式，和全焊式的板式换热器的核心。

Using a simple analytical model equilibrium, the dependence of tokamak edge safetyf actor qedge which can be understood as q~ for a limiter device or q95 for a divertor device, and the shear value are calculated and compared with the ITR~recommended formula.

重点讨论了适合于磁约束核聚变实验装置第一壁上W／Cu复合材料连接的几种方法：电子束焊、钎焊、热等静压连接、烧结熔渗法、等离子体喷涂法，并列举了第一壁材料与热沉材料成功连接时电子束辐照热负荷实验的情况。

Resistance welding and brazing possibly become the development trend.

电阻焊和钎焊有可能成为铝／铜焊接的发展方向。

FL-1 type shunt is made of precision alloy board, it's copper terminals spot weled by siller alloy ensure extremely high electric capable.

FL-1 型分流器由精密合金板制成，银合金钎焊的铜端焊脚保证了接点极高的电气性能。

The cathode phenomena in hollow cathode arc discharge in vacuum wereinvestigated systematically. The influence of welding parameters on active zone ofhollow cathode , arc appearance and voltage-ampere curve was investigated.

小电流的发散态电弧能量密度低，柔性大，可作为局部加热热源进行真空钎焊；大电流的可作为理想的熔焊热源，进行各种难熔易氧化金属在真空条件下的高质量焊接。

Main process flow of aluminium heat exchange is as follows: dewinging→spare parts cleaning→core installation→braze welding→final argon-arc welding→ leak test→curb plate and accessory assemblage→lacquering→packaging.

铝换热器主要工艺流程是：冲翅→零部件清洗→装芯→钎焊→总成氩弧焊（总成装配→密封性检测→侧板及附件装配→喷漆→包装。

Its are main the task is to produce welding flux kind product -- the recipe dissolvent that will come from French flounder and metal (lead - stannic alloy or stannum - silver-colored - copper alloy) mix and become, in order to passes drill rod solder will yuan parts of an apparatus is fixed in printed circuit board on.

其首要任务是出产焊剂类产物——将从法国辗转而来的配方溶剂和金属(铅-锡合金或者锡-银-铜合金)同化而成，用以经由过程钎焊将元器件固定在印刷电路板上。

The use of active filler metalAg_(70-Cu_(28)-Ti_2in the vacuum brazes welding of AlN with Cu is examined.

研究了在真空条件下AlN/Cu活性钎焊的情况，使用的活性焊料是Ag_(70)-Cu_(28)-Ti_2焊片。

This company is a scitech enterprise mainly involved in researching, developing, and producing tin solder thread,tin solder bar,tin solder paste, solder, environment-oriented detergent, and industrial soft solder materials.

本公司是一家主营焊锡丝、焊锡条、无铅焊料、焊锡膏、助焊剂、环保型清洗剂等电子、电工业用软钎焊用材料研发与生产的科技型企业。

This one mode pays close attention to network credence foundation of the businessman very much.

这一模式非常关注商人的网络信用基础。

Cell morphology of bacterial ghost of Pasteurella multocida was observed by scanning electron microscopy and inactivation ratio was estimated by CFU analysi.

扫描电镜观察多杀性巴氏杆菌细菌幽灵和菌落形成单位评价遗传灭活率。