金属化

Three methods including the atomic resolved density of state, charge difference density, and the transition density matrix are used to visualize metal to ligand charge transfer in ruthenium ammine complex.

利用三种方法可视化化了Ru ammine的金属到配体的电荷转移。

In this paper, the corrosion of materials in carbonaceous atmospheres at high temperatures is reviewed, including metal dusting and internal carburization.

本文综述了材料在高温含碳气氛中的腐蚀，包括金属粉化和碳化，讨论了材料在含碳气氛中的腐蚀机理和腐蚀动力学。

This paper expounds the oxyacetylene flare overlaying welding technology of tungsten carbide rod made to be metal matrix carbide ceramal compound overlaying welding layers.

介绍碳化钨条氧乙炔火焰堆焊制备金属基碳化物陶瓷复合耐磨堆焊层的工艺方法，结合碳化钨条氧乙炔火焰堆焊工艺过程、堆焊层性能特点、泥沙磨损实验结果及显微组织形貌，分析讨论了热源性质对堆焊层性能的影响以及复合耐磨堆焊层的抗泥沙磨损特性。

Compared with prior art, the method of the invention carries out the cineration process under low temperature, so concave defects on the metal interconnection lines near the through hole during the cineration process under high temperature can be avoided, thus improving finished product rate.

与现有技术相比，本发明的制造方法通过在低温条件下进行灰化步骤，避免了因高温条件的灰化步骤造成通孔附近的金属互连线出现凹形缺陷的现象，从而提高产品的成品率。

In chapter 2,the main research contents and typical works in theoretical research area on amino acids and oligopeptides were introduced.This includes studies performed on structures,electronic properties,weak intramolecular interactions,protonation and deprotonation,conformer conversion,metal ion binding,solution effects and etc.

第2章给出了氨基酸和寡肽分子体系理论计算领域的主要研究内容和研究热点，这包括氨基酸和寡肽分子的稳定结构，电子性质，内部弱相互作用，质子化和去质子化过程，构象转换，金属离子结合及溶液效应等多方面的研究。

With the electrical connections at the top and bottom side of the wafer-level IC packaging Lead-frame structure and composition of the surface-mount semiconductor package structure Multi-layer printed circuit board Antifuse and its formation method and with the anti-fuse non-volatile memory device unit cell Tandem electric signal processing circuit and electronic device Light-emitting diode packaging structure and encapsulation method Electronic Packaging Structure Flip-chip high-speed optoelectronic components and structure Pairs of piezoelectric friction side by side to promote the three-step device and scanning probe microscope Light-emitting diode and its manufacturing method, the production base of light-emitting diode method Three or four parallel advance of stepping piezoelectric device and scanning probe microscope lens body Silicon substrate and its manufacturing method Semiconductor device and voltage-divider A polysilicon layer and the microcrystalline silicon layer of the double-substrate active layer structure, methods and devices The edge of the thickness of silicon controlled Of a lateral semiconductor devices and high-voltage devices With a vertical-channel transistors semiconductor device Of a memory array and for the manufacture of a memory array method Read-only memory cell array structure Active-matrix substrate and display device High-voltage semiconductor integrated circuit devices, dielectric isolated type semiconductor device Image sensing devices Lens module and its manufacturing methods Solid-state imaging device and camera Injection angle for the trench isolation Organic Light-Emitting Display Device Organic light-emitting display device Bipolar transistor structure of the surface passivation Double-triggered silicon-controlled rectifier HFET Metal-oxide semiconductor transistors Self-aligned trench accumulation mode field effect transistor structure Thin-film transistors and Display Devices TFT Lead Diode Low-frequency, low noise, low-flashing diode Used for thin-film solar cells trap light structure Transparent sun solar cells Quaternary semiconductor heterojunction photovoltaic cells heat Si nano-pillar array heterojunction thin-film solar cells GaN-based micro-composite solar cells isotope Optical sensor Semiconductor by optical components Imaging Detector Transparent conductive oxide coating Silicon-based high-performance dual-junction solar cells Thin-film solar cells Alien LED Devices

非专业，不在行，求高手帮忙。谢谢！具有顶部及底部侧电连接的晶片级集成电路封装导线架结构及其构成的表面黏着型半导体封装结构多层印刷电路板反熔丝及其形成方法和具有该反熔丝的非易失性存储器件的单位单元串联用电式信号处理电路及电子装置发光二极管的封装结构及其封装方法电子封装结构高速光电组件及其芯片倒装结构双压电体并排推动的三摩擦力步进器与扫描探针显微镜发光二极管及其制作方法、发光二极管的底座的制作方法三或四压电体并行推进的步进器及其扫描探针显微镜镜体硅衬底及其制造方法半导体装置与分压电路具多晶硅层及微晶硅层的双底材主动层结构、方法及装置硅晶片的受控边缘厚度一种半导体横向器件和高压器件具有垂直沟道晶体管的半导体器件一种记忆体阵列及其用于制造一记忆体阵列的方法只读内存单元阵列结构有源矩阵基板和显示装置高耐压半导体集成电路装置、电介质分离型半导体装置图像感测装置透镜模块及其制造方法固态成像装置和照相机用于沟道隔离的斜角注入有机电致发光显示装置有机发光显示装置双极晶体管的表面钝化结构双触发型可控硅整流器异质结场效应晶体管金属氧化物半导体晶体管自对准沟槽累加模式场效应晶体管结构薄膜晶体管及显示器件薄膜晶体管无铅二极管低频、低噪音、低闪烁的二极管用于薄膜太阳电池的陷光结构透明遮阳太阳能电池片四元半导体的异质结热光伏电池硅基纳米柱阵列异质结薄膜太阳能电池氮化镓太阳能同位素复合型微电池光学传感器半导体受光元件成像探测器透明导电氧化物涂层硅基高效双结太阳能电池薄膜太阳能电池异形LED器件

It is very difficult to eliminate these influence factors completely by conventional treatment. Surface properties and surface treatment of ultrafine red phosphorus and MMT and their interface properties with polymer matrices were studied in this thesis. The results were characterized by GC, FTIR, XRD, DTA, TG, XPS, UV, SEM, TEM and other physical and chemical methods. The main contents are as following: 1. The study of factors influencing ultrafine red phosphorus's invariability and phosphine liberation indicated red phosphorus undergone oxidation and dismutation reaction in air, and trace ion of iron, copper and nickel fastened water absorption and oxidation, in which the effect of copper ion was the most, while aluminium and zinc ion could slow down red phosphorus'oxidation, and silver ion had the best effect on red phosphorus moisture absorption. Inhibitors such as aluminium hydroxide, magnesium hydroxide, organic phenol and ferrous potassuim cyanide had a good effect on reducing red phosphorus moisture absorption and restraining phosphine liberation.

本文围绕纳微米材料的表面处理及其在高聚物基体中的应用这一主题，系统地研究了超细红磷和蒙脱土两种常见材料的表面特性、表面处理方法及其与高聚物基体的界面特性，通过气相色谱、红外光谱、X射线衍射、差热、热重、X射线光电子能谱仪、紫外光谱、扫描电镜、透射电镜等现代分析仪器以及其它物理、化学方法对实验结果进行了表征和分析，全文主要内容如下： 1、对影响超细红磷安定性的因素以及磷化氢的缓释研究表明：红磷在空气中发生缓慢氧化、歧化反应，微量的铜、铁、镍等金属离子增加了它的吸水和氧化速度，其中铜离子的作用最为明显，而铝、锌等离子减慢了红磷的氧化速度，银离子对减少红磷的吸湿性效果最好。

The companies design and manufacture of paint production line to complete all kinds of metal or non-metallic materials to the surface of oil products, derusting, passivation, phosphate, rinse, electrostatic powder coating, drencher spray paint, paint electrophoresis, drying, curing Such as painting technology.

本公司设计制造的涂装生产线能完成各类金属或非金属材料产品表面的去油、除锈、钝化、磷化、漂洗、静电粉末喷涂、水帘喷漆、电泳漆、烘干、固化等涂装工艺。

It is a vapour discharge lamp containing a mixture of dysprosium iodide and halmium iodide.

镝灯是一种稀土金属卤化物灯，是利用在碘化镝、碘化钬的蒸汽中放电发光而制成。

The results shows that all these elements are enriched in the glass phase except for Al and Mn, and all the elements are depleted in the mullite-corundum phase except for Al.The iron group elementsand the ore-forming metalsare enriched in the ferruginous spheres, but the rest elements are depleted.

结果表明，除Al、Mn外，其他元素均在玻璃相中有不同程度的富集；除Al外，其他元素则在莫来石-刚玉相中有不同程度的贫化；除Ti以外的铁族元素以及除Ga、Pb以外的金属成矿元素均在铁质微珠中富集，其他元素则在其中贫化。

According to the clear water experiment, aeration performance of the new equipment is good with high total oxygen transfer coefficient and oxygen utilization ratio.

曝气设备的动力效率在叶轮转速为120rpm～150rpm时取得最大值，此时氧利用率和充氧能力也具有较高值。

The environmental stability of that world - including its crushing pressures and icy darkness - means that some of its most famous inhabitants have survived for eons as evolutionary throwbacks, their bodies undergoing little change.

稳定的海底环境─包括能把人压扁的压力和冰冷的黑暗─意谓海底某些最知名的栖居生物已以演化返祖的样态活了万世，形体几无变化。