连接体

Two implant was connected in the connection group 1 month later.

连接实验组在种植体植入1个月后固定连接种植体。

With the electrical connections at the top and bottom side of the wafer-level IC packaging Lead-frame structure and composition of the surface-mount semiconductor package structure Multi-layer printed circuit board Antifuse and its formation method and with the anti-fuse non-volatile memory device unit cell Tandem electric signal processing circuit and electronic device Light-emitting diode packaging structure and encapsulation method Electronic Packaging Structure Flip-chip high-speed optoelectronic components and structure Pairs of piezoelectric friction side by side to promote the three-step device and scanning probe microscope Light-emitting diode and its manufacturing method, the production base of light-emitting diode method Three or four parallel advance of stepping piezoelectric device and scanning probe microscope lens body Silicon substrate and its manufacturing method Semiconductor device and voltage-divider A polysilicon layer and the microcrystalline silicon layer of the double-substrate active layer structure, methods and devices The edge of the thickness of silicon controlled Of a lateral semiconductor devices and high-voltage devices With a vertical-channel transistors semiconductor device Of a memory array and for the manufacture of a memory array method Read-only memory cell array structure Active-matrix substrate and display device High-voltage semiconductor integrated circuit devices, dielectric isolated type semiconductor device Image sensing devices Lens module and its manufacturing methods Solid-state imaging device and camera Injection angle for the trench isolation Organic Light-Emitting Display Device Organic light-emitting display device Bipolar transistor structure of the surface passivation Double-triggered silicon-controlled rectifier HFET Metal-oxide semiconductor transistors Self-aligned trench accumulation mode field effect transistor structure Thin-film transistors and Display Devices TFT Lead Diode Low-frequency, low noise, low-flashing diode Used for thin-film solar cells trap light structure Transparent sun solar cells Quaternary semiconductor heterojunction photovoltaic cells heat Si nano-pillar array heterojunction thin-film solar cells GaN-based micro-composite solar cells isotope Optical sensor Semiconductor by optical components Imaging Detector Transparent conductive oxide coating Silicon-based high-performance dual-junction solar cells Thin-film solar cells Alien LED Devices

非专业，不在行，求高手帮忙。谢谢！具有顶部及底部侧电连接的晶片级集成电路封装导线架结构及其构成的表面黏着型半导体封装结构多层印刷电路板反熔丝及其形成方法和具有该反熔丝的非易失性存储器件的单位单元串联用电式信号处理电路及电子装置发光二极管的封装结构及其封装方法电子封装结构高速光电组件及其芯片倒装结构双压电体并排推动的三摩擦力步进器与扫描探针显微镜发光二极管及其制作方法、发光二极管的底座的制作方法三或四压电体并行推进的步进器及其扫描探针显微镜镜体硅衬底及其制造方法半导体装置与分压电路具多晶硅层及微晶硅层的双底材主动层结构、方法及装置硅晶片的受控边缘厚度一种半导体横向器件和高压器件具有垂直沟道晶体管的半导体器件一种记忆体阵列及其用于制造一记忆体阵列的方法只读内存单元阵列结构有源矩阵基板和显示装置高耐压半导体集成电路装置、电介质分离型半导体装置图像感测装置透镜模块及其制造方法固态成像装置和照相机用于沟道隔离的斜角注入有机电致发光显示装置有机发光显示装置双极晶体管的表面钝化结构双触发型可控硅整流器异质结场效应晶体管金属氧化物半导体晶体管自对准沟槽累加模式场效应晶体管结构薄膜晶体管及显示器件薄膜晶体管无铅二极管低频、低噪音、低闪烁的二极管用于薄膜太阳电池的陷光结构透明遮阳太阳能电池片四元半导体的异质结热光伏电池硅基纳米柱阵列异质结薄膜太阳能电池氮化镓太阳能同位素复合型微电池光学传感器半导体受光元件成像探测器透明导电氧化物涂层硅基高效双结太阳能电池薄膜太阳能电池异形LED器件

Both crystallographically unique Zn atoms exit as an octahedral geometry. The four equatorial positions of Zn1 atom are occupied by the carboxylate-oxygen atoms of the two tartrates, and the two oxygens of the left four carboxylate-oxygen atoms coordinate to two different Zn2 atoms, respectively, forming infinite coordination polymer chains. The left two of the trans equatorial positions of Zn2 atom are completed with two oxygen atoms of two water molecules. The axial positions of both Zn atoms are occupied by the nitrogen atoms from different 4,4'-bipyridine molecules to give a 2D rectangular-grid layers with a cavity dimension of 0.51165(3)nm×1.13896(5) nm. A three dimensional network is formed by the crystallization water chains joined by the carboxylate-oxygen atoms through hydrogen-bonding interactions.

两个晶体学独立的Zn原子均为八面体构型，其中Zn1原子赤道配位点被2个酒石酸根中的4个羧酸根氧螯合配位， 2个酒石酸根中剩下的4个羧酸根氧中的2个分别与2个Zn2原子连接形成无限一维链， Zn2原子的另外2个反式赤道配位点被2个水分子氧占据，同时这两种Zn原子的轴向配位点均被4，4'-联吡啶的氮原子占据，形成具有矩形格子[0.51165(3) nm×1.13896(5) nm]的二维层状结构，游离的2个水分子通过氢键作用形成二聚体，并与酒石酸根中未与Zn配位的羧酸氧连接，把二维层状结构连接成三维网状的超分子结构。

Methods A wet hip joint's sample from corpse was scaned by CT and all images of every cross-section hip joint's layer was obtained, and an hip joint's model was contructed with Unigraphics NX 2.0 and Solid Works 2006 SP 0.0 software. The models were assembled when simulated total hip arthroplasty after total hip joint prosthetic and ischiofemoral ligament model had been constructured. Analysis was done on von Mises stress distribution and amount of total hip component when simulated seated leg-crossing manuver. The bone and metal components were meshed as rigid bodies, composed of three-dimensional, all-quadrilateral rigid body elements, and hip joint capsule ligament was fully three-dimensional, hexahedral continuum elements representations. Results The current form of this ischiofemoral ligament's reconstruction finite element model provided for multi-body contact, large displacement interfacial sliding, large deformation capsule ligament representation, and clearly reflected the real ischiofemoral ligansent's anatomy and biomechanical behavior. The maximum on Mises stresses at the joint interface was more than that fur an otherwise identical hardware-only construct.

选择成人尸体髋关节行CT成像得到髋关节每层横截面图像，提取边界坐标，利用有限元分析软件Unigraphics NX 2.0和Solid-Works 2006 SP0.0构建出髋关节三维有限元模型及人工髋关节假体，并模拟全髋置换术进行装配，将坐股韧带按其术中重建位置进行构建骨骼与金属模型采用三维十节点四面体实体单元进行网格划分，关节囊六面体连接单元划分，模拟坐位腿交叉动作载荷获取假体撞击过程的角活动度和相应的von Mises应力分布情况结果所构建的多体连接、大界面划移、大变形的坐股韧带重建有限元模型，客观反映坐股韧带真实解剖形态及生物力学行为，增加坐股韧带重建的模型其关节面的最大主应力值大于仅有金属的模型。

There are also two types of IPTligands in crystal 2. With two bidentate carboxylates, one acts as bridging ligandconnecting neighboring 〓 tetrahedral core along c axia to form ladderlike long chain.

且间苯二甲酸根配体可以分为两类：第一类配体中每个羧酸根连接四核锌四面体结构中的四条边并沿c轴方向连接邻近的四面体结构单元形成梯形长链。

AWG, DIAMETER 12,34mm Tension joints Repair sleeves Vibration dampers, Stockbridge type Vibration dampers, loop type Complete Suspension Assemblies, including electrical connection to tower body, dwg Complete Dead End Assemblies, including electrical connection to tower body, dwg.

6特设工作组，直径12，34毫米张力关节修复袖子振动阻尼器，斯托克型振动阻尼器，环型全部中止大会，包括电气连接，以塔体， DWG格式完成死胡同大会，包括电气连接，以塔体， DWG格式。

The experimental goal is to use SOPC-NIOSII EDA / SOPC system platform for real-time moving object detection system in this paper. After the inputs of image penetrated the CMOS Sensor to receive the data of the image makes the RGB form the transformation. The CPU processes operation of image detects. After the processed of image deliveres to VGA displayed output of real-time image. We use example programs of DE2 platfrom to achieve entire hardware on experiment board of SOPC-NIOSII EDA / SOPC System platform. On system of dectect image we divided into two parts : hardware and software. We use Verrilog of HDL to modify code in hardware. To use Custom IP of SOPC Builder produced IP of our need. We need a interface to connect in the COMS Sensor to FPGA and FPGA to VGA among. The code synthesize to create a programming file of *.S by Quartus II. Then, to use USB BLASTER of SOPC-NIOSII EDA/SOPC System platform programmed on FPGA. We use NIOS II IDE to assign DMA address in sofaware. We use SOPC-NIOSII EDA / SOPC System platform of Hum-Heng Technology co.

中文摘要本论文实验目标是在於利用SOPC-NIOSII EDA/SOPC系统平台来实现即时移动物体侦测的系统，影像输入透过CMOS Sensor接收影像的资料经过RGB格式的转换，再经过处理器处理影像侦测的运算，最后再将处里后的影像资料传送给VGA做即时的影像输出，我们使用DE2平台的测试范例程式转换在SOPC-NIOSII EDA/SOPC系统平台实验板来实现整个的硬体，我们将影像侦测系统分为硬体和软体二部份，硬体部分我们使用Verilog硬体描述语言修改撰写，利用SOPC Builder的自订IP产生我们所需的IP ，在COMS Sensor到FPGA跟FPGA到VGA中间我们需要一个interface来进行连接，经由Quartus II来合成产生*。sof的烧入档，然后利用SOPC-NIOSII EDA/SOPC系统平台专用的USB BLASTER来烧入到FPGA上，软体部分我们使用NIOSII IDE来定址我们DMA位址，主板我们采用华亨科技公司的SOPC-NIOSII EDA/SOPC系统平台。

It is necessary to study the connecting technique between the drill cutter and placenta, because the connecting quantity affects the working life of drill.

钻头切削齿与胎体的连接质量关系到钻头的使用寿命，因此有必要对切削齿与胎体的连接技术进行探讨。

A systematic analysis of the icosahedral hierarchic structure in the 3D icosahedral quasicrystal and its approximants have been made. There is an icosahedron at the center surrounded by 12 icosahedra. If two neighboring icosahedra are vertex-sharing, the multi-shell Mackay cluster consisting of 127 atoms will form. If two neighboring icosahedra penetrate into each other, the multi-shell Samson-Bergman-Pauling cluster consisting of 137 atoms will form.

系统地分析了三维二十面体准晶的近似晶体相中具有二十面体对称的等级结构，中心1个二十面体，周边12个二十面体，如两个相邻二十面体共顶点连接，得出的是由127个原子构成的Mackay球形原子簇；如两个二十面体互相穿插，得出的是由137个原子构成的Samson-Bergman-Pauling球形原子簇。

In other words,under the same reaction conditions,the larger the particle size of theprecursor mixed powder,the higher the temperature at which Zn_2TiO_4 starts to appear.There are structure similarity phenomena in ZnO-TiO_2 system,i.e.,the connectionmanner of TiO6 octahedra in the structure of ZnTiO_3 is similar with the one of rutile,andthe connection manner of TiO6 octahedra in the structure of Zn_2TiO_4 and Zn_2Ti_3O_8 issimilar with the one of anatase.

ZnO-TiO_2系统中存在一种类构现象，即：ZnTiO_3结构中的氧八面体的连接方式和金红石TiO_2的相似，而Zn_2TiO_4和Zn_2Ti_3O_8结构中的氧八面体的连接方式则和锐钛矿TiO_2的相似，并由此衍生出一个类构效应理论，即：ZnO和金红石TiO_2的反应产物中不应该出现Zn_2TiO_4和Zn_2Ti_3O_8当然，反应温度应低于ZnTiO_3的起始分解温度。

Neither the killing of Mr Zarqawi nor any breakthrough on the political front will stop the insurgency and the fratricidal murders in their tracks.

在对危险的南部地区访问时，他斥责什叶派民兵领导人对中央集权的挑衅行为。

In fact,I've got him on the satellite mobile right now.

实际上 我们已接通卫星可视电话了