负担

Ompare the experimental results with analytical results and sum up the factors which affect the flow front of underfill to find the method which can control the flow front, reduce the chance of short shot and air trap; therefore, enhance the reliable of underfill process of Flip-Chip.

AE(Computer-Aided-Engineering)模流分析模拟其流动情况；在完成实验与分析模拟之后，进行实验与模拟结果比较，归纳出影响底部充填波前形状的因素，并寻求控制底部充填流动波前形状的方法，降低短射与包风的发生，提高覆晶底部充填制程的可靠度。

We are supplying solutions to measuring-technical tasks in all industrial areas for more than 26 years.

我们在为各行业的测量技术领域提供解决方案已有26年的经验。