芯片集

VTT, sometimes referred to in the Basic Input/Output System as the FSB Termination Voltage, provides the low level signaling bias needed for the processors, chipsets, and all other devices on the bus to communicate.

VTT，有时在基本输入/输出系统中被称为FSB终结电压，提供处理器、芯片集以及所有其他总线设备通信所必须的低级别信号偏移。

BF533, the fixed-point chip of the Blackfin series product by American Analog Devices, Inc., has high speed clock, unique hardware architecture and high collateral instruction set,which makes it possible to implement MPEG-4 ACC encoder on single DSP chip.

美国模拟器件公司的Blackfin 系列定点BF533芯片具有高速的时钟，独特的硬件结构和高度并行化的指令集，使得在单片DSP 上实现MPEG-4 AAC 编码器成为可能。

The system also adopts 16-bit conversion chip ADS8364 of TI company which realizes transformation of multi-channel signals simultaneously and guarantees the isochronism of data collected.

根据系统设计的基本要求，系统中采用三星公司的S3C44BOX，该芯片具有高速度、低功耗、低成本、功能强、特有16／32位双指令集等诸多优异的性能，成为系统的主控制器。

The methods of fabricating Lucite chemical chip were researched, and techniques of fabricating microconduits and sealing were obtained.

研究了有机玻璃制作化学微芯片的方法，优化出一条集微管道印刻、微管道密封的技术路线，该方法简单、所需设施简易，适合于大多数普通实验室的制作。

The design of a nonmental ultrasonic detector was introduced. The detector was based on EP2C20 series FPGA chip,through adding NiosII soft processor and other interfaces to FPGA ,equipped with high precision data collection system and TFT LCD module and so on.The system was constituted.It including ultrasonic eradiating,receive sychronously,audio parameter detecting automatically,data analyse and process,display result timely,data storage and data output circuits.For the developing of imaging,intelligent and automation of ultrasonictesting ,a very good foundation is established by the system.

介绍了非金属超声检测仪的软硬件设计方法该仪器以EP2C20系列FPGA芯片为核心，通过在FPGA中加载NiosII软核处理器和其他外围接口电路，配合高精度数据采集系统TFT液晶显示模块等设计而成该仪器集超声波发射同步接收声参量自动检测数据分析处理结果实时显示数据存储与输出等功能于一身，为数据的进一步分析处理和实现超声检测的图像化智能化自动化奠定了良好的基础

Figure 1 is a simplified diagram illustrating standard bus topology. V can represent any number of devices, such as a second processor die, as is the case with Kentsfield, and in all cases, the chipset.

图1展示了标准总线拓扑的简图。V可以表示任意数量的设备，例如第二个处理器晶粒、Kentsfield处理器的情形、以及所有情形下的芯片集。

I will bind thee to the Windows Platform with cunning arti fices and with devious schemes.

我要用诡计和孤僻的设计把你们束缚在Windows平台下，我要用混沌的代码和劣质的程序接口把你们捆绑在Intel芯片集上。

I will bind thee to the Windows Platform with cunning artifices and with devious schemes.

我要用诡计和孤僻的设计把你们束缚在Windows平台下，我要用混沌的代码和劣质的程序接口把你们捆绑在Intel芯片集上。

I willbind thee to the Windows Platform with cunning artifices and withdevious schemes.

我要用诡计和孤僻的设计把你们束缚在 Windows 平台下，我要用混沌的代码和劣质的程序接口把你们捆绑在 Intel 芯片集上。

The chip market with fire compositive force and reference design the union of chip of as blue as CSR company tooth, offerred a low cost, high quality for MP3 manufacturer and the product that needs dissimilation highly.

炬力集成的芯片集和参考设计与CSR公司蓝牙芯片的连系，为MP3制造商供给了一款低本钱、高品质且高度差别化的产物。

The split between the two groups can hardly be papered over.

这两个团体间的分歧难以掩饰。

This approach not only encourages a greater number of responses, but minimizes the likelihood of stale groupthink.

这种做法不仅鼓励了更多的反应，而且减少跟风的可能性。