芯片

TMS320C6201 DSP is taken as an example, and DMA controller characteristic is introduced.

以TI公司的TMS320C6201DSP芯片为例，介绍了DMA控制器的特点。

DMD chip is the core device of digital mask technology, and it has such advantages as high resolve, gray level, and so on.

数字掩模技术的核心器件是数字微镜芯片，它具有较高的分辨率和灰度等级等优点。

So what are their future DMI chipsets likely to look like?

那么他们所具有的特色 DMI 芯片将会是什么样呢？

It further disclosed that DMI will be replacing conventional FSB to connect Pineview Atom core to IO chip respectively.

它进一步透露，怎样将取代传统前端总线连接Pineview原子核心的IO芯片分别。

However, DOM on a chip does not work very well.

然而，在一个芯片上DOM不很好地工作。

It is an extremely important semiconductor; doped with boron , phosphorus, or arsenic, it is used in various electronic circuit and switching devices, including computer chips, transistors, and diodes.

硅是一种非常重要的半导体；掺入硼、磷或砷后，可用于各种电子电路和开关器件，包括计算机芯片、晶体管和二极管。

It is an extremely important semiconductor; doped with boron, phosphorus, or arsenic, it is used in various electronic circuit and switching devices, including computer chips, transistor s, and diodes.

硅是一种非常重要的半导体；掺入硼、磷或砷后，可用于各种电子电路和开关器件，包括计算机芯片、晶体管和二极管。

Five novel torsion-mirror optical actuators including double-beam thickness differential structure with single torsional axis, double flexible folded-beam structure with single torsional axis, double-beam vertical torsion comb structure with single torsion axis, four-beam differential compound-micromirror structure with double torsional axis and the combined structure of the four basis forms above, are brought forward. All of these devices could be fabricated by the same silicon micromachining process we have developed. The deformation compensation design with local enhancement for the thin torsional beam which is the key structure of these devices is also put forward to improve the reliability. The three-dimension solid model and two-dimension reduced order model of the torsion-mirror optical actuator are established and then the numerical simulations for evaluating the device characteristics of the statics, dynamics, electrostatic field, mechanical and electrostatic coupling, fluid and solid coupling are carried out to optimize the structure design. Furthermore, three optical fibre clamping structures which could be integrated monolithicly are designed and analyzed to improve the optical coupling capability. 4. Three flexible process flows combined with bulk silicon micromachining and surface silicon micromachining are brought forward to fabricate these novel single-crystal silicon or polysilicon torsion-mirror optical actuators by using the same lithography masks for both SOI wafer and regular silicon wafer. A series of important process experiments are carried out to optimize the process parameters and the process flows. Some novel and typical process phenomena which occurred during the microfabrication are analyzed and then the corresponding solutions are put forward. 5. A MEMS dynamic testing system which exploit blur image synthetic technique, stroboscopic image matching technique, stroboscopic mirau microscopic interferometry technique and microscopic laser dopper vibrometer technique is set up to measure three-dimension and six-freedom micro motions of any MEMS devices with nanometer resolution.

在对硅微机械扭转镜光致动器的光机电特性系统地理论研究的基础上提出了硅微机械扭转镜光致动器的结构设计准则。3、提出了单轴双梁厚度差分结构、单轴双柔性折叠梁结构、单轴双梁垂直扭转梳齿结构、双轴四梁差动复合微镜结构以及以上四种基本结构组合后的衍生结构等五种工艺加工技术兼容的新型的硅微机械扭转镜光致动器，对器件关键结构薄厚度、高耐疲劳扭转梁进行了局部加强的变形补偿设计，建立了器件的三维实体模型以及两维降阶模型，对提出的新结构硅微机械扭转镜光致动器进行了系统的静力学、动力学、静电场、力电耦合和流体固体耦合的建模仿真与优化设计，同时设计并分析了三种可实现单芯片集成的弹性光纤定位夹紧结构。4、提出了组合体硅微加工技术与表面硅微加工技术、兼容同一套光刻版图、可分别基于SOI 晶片和普通Si 晶片、适应于制造提出的各种新结构单晶硅和多晶硅硅微机械扭转镜光致动器的三套柔性加工工艺流程，开展了一系列重要工艺步骤的单项工艺试验，对工艺流程与工艺参数进行了优化，针对加工过程中出现的具有普遍意义的典型工艺问题进行了讨论和分析，并提出了解决方法。5、创新性地将模糊图像合成技术、频闪图像匹配技术、频闪Mirau 显微干涉技术与显微激光多普勒测振技术有机结合，建立起了一套周期运动测量与瞬态运动测量相结合、单点运动测量与全视场运动测量相结合、满足不同MEMS 器件各种动态测试要求的集成的MEMS 三维六自由度微运动精密测量系统。

Notebook vendor Dell leaked the details of the new chips on its Web site following Intel's Dothan launch event in May.

笔记本厂商戴尔在自己的网站上泄露了这些新芯片的详细资料。

In the first section of hardware circuits part, the design principle, project and application of the data transmission board based on the normal electrical chips are discussed in detail. The data transmission board is used to the way of synchronizing transmission that is a particularly novel way in the Real-time SAR Image Data Process and Transmission System and can nearly double the transmission ratio.

在硬件电路设计方面，本文首先讨论了基于普通芯片的专用数据传输接口板的设计和实现，该接口板采用同步传输的工作方式，比原系统中接口板的传输速率提高了近一倍，并且具有单机调试的能力，已用于"九五"灾害监测子系统中地面数据接收站和高速图形处理工作站之间的数据传输。

The split between the two groups can hardly be papered over.

这两个团体间的分歧难以掩饰。

This approach not only encourages a greater number of responses, but minimizes the likelihood of stale groupthink.

这种做法不仅鼓励了更多的反应，而且减少跟风的可能性。