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With the electrical connections at the top and bottom side of the wafer-level IC packaging Lead-frame structure and composition of the surface-mount semiconductor package structure Multi-layer printed circuit board Antifuse and its formation method and with the anti-fuse non-volatile memory device unit cell Tandem electric signal processing circuit and electronic device Light-emitting diode packaging structure and encapsulation method Electronic Packaging Structure Flip-chip high-speed optoelectronic components and structure Pairs of piezoelectric friction side by side to promote the three-step device and scanning probe microscope Light-emitting diode and its manufacturing method, the production base of light-emitting diode method Three or four parallel advance of stepping piezoelectric device and scanning probe microscope lens body Silicon substrate and its manufacturing method Semiconductor device and voltage-divider A polysilicon layer and the microcrystalline silicon layer of the double-substrate active layer structure, methods and devices The edge of the thickness of silicon controlled Of a lateral semiconductor devices and high-voltage devices With a vertical-channel transistors semiconductor device Of a memory array and for the manufacture of a memory array method Read-only memory cell array structure Active-matrix substrate and display device High-voltage semiconductor integrated circuit devices, dielectric isolated type semiconductor device Image sensing devices Lens module and its manufacturing methods Solid-state imaging device and camera Injection angle for the trench isolation Organic Light-Emitting Display Device Organic light-emitting display device Bipolar transistor structure of the surface passivation Double-triggered silicon-controlled rectifier HFET Metal-oxide semiconductor transistors Self-aligned trench accumulation mode field effect transistor structure Thin-film transistors and Display Devices TFT Lead Diode Low-frequency, low noise, low-flashing diode Used for thin-film solar cells trap light structure Transparent sun solar cells Quaternary semiconductor heterojunction photovoltaic cells heat Si nano-pillar array heterojunction thin-film solar cells GaN-based micro-composite solar cells isotope Optical sensor Semiconductor by optical components Imaging Detector Transparent conductive oxide coating Silicon-based high-performance dual-junction solar cells Thin-film solar cells Alien LED Devices

非专业,不在行,求高手帮忙。谢谢!具有顶部及底部侧电连接的晶片级集成电路封装导线架结构及其构成的表面黏着型半导体封装结构多层印刷电路板反熔丝及其形成方法和具有该反熔丝的非易失性存储器件的单位单元串联用电式信号处理电路及电子装置发光二极管的封装结构及其封装方法电子封装结构高速光电组件及其芯片倒装结构双压电体并排推动的三摩擦力步进器与扫描探针显微镜发光二极管及其制作方法、发光二极管的底座的制作方法三或四压电体并行推进的步进器及其扫描探针显微镜镜体硅衬底及其制造方法半导体装置与分压电路具多晶硅层及微晶硅层的双底材主动层结构、方法及装置硅晶片的受控边缘厚度一种半导体横向器件和高压器件具有垂直沟道晶体管的半导体器件一种记忆体阵列及其用于制造一记忆体阵列的方法只读内存单元阵列结构有源矩阵基板和显示装置高耐压半导体集成电路装置、电介质分离型半导体装置图像感测装置透镜模块及其制造方法固态成像装置和照相机用于沟道隔离的斜角注入有机电致发光显示装置有机发光显示装置双极晶体管的表面钝化结构双触发型可控硅整流器异质结场效应晶体管金属氧化物半导体晶体管自对准沟槽累加模式场效应晶体管结构薄膜晶体管及显示器件薄膜晶体管无铅二极管低频、低噪音、低闪烁的二极管用于薄膜太阳电池的陷光结构透明遮阳太阳能电池片四元半导体的异质结热光伏电池硅基纳米柱阵列异质结薄膜太阳能电池氮化镓太阳能同位素复合型微电池光学传感器半导体受光元件成像探测器透明导电氧化物涂层硅基高效双结太阳能电池薄膜太阳能电池异形LED器件

For this reason, it is mounting fibre-optic cables straight onto the chips that direct the traffic between a supercomputer's multiple processors.

因此,越来越多的光纤电缆直接应用到芯片上以建立超级计算机多处理器间的直接通信。

This thesis is main to make use of the representative chip TI company′s TMS320LF2407A DSP which is used for the control of motor to complete the control of the speed,direction parameter and other parameters of DC motor.

本论文主要利用用于电动机控制的代表性芯片TI公司的TMS320LF2407A完成对直流电动机的速度、方向等参数的控制。

SRD has the both advantages that asynchronism motor frequency conversion dirve and direct current motor dirve have.Using TMS320LF2407 DSP for motor control, made in TI CO.

本文以TI公司的TMS320LF2407型号电机控制专用DSP芯片为主控制核心,研究设计了一套3KW开关磁阻电动机调速系统,并进行理论和实验分析。

Cache hard disk controller is a piece of memory chips, with fast access speed, it is the internal hard disk storage and buffer between the outside interface.

缓存是硬盘控制器上的一块内存芯片,具有极快的存取速度,它是硬盘内部存储和外界接口之间的缓冲器。

This platform has an Intel PXA270 processor core, with a lot of peripherals, such as USB device controller and hard disk.

系统采用了Netchip公司的NET2272芯片作为USB 2.0设备控制器,并设计实现了硬件电路。

A control system of stepmotor that enable operator to control displacement and adjust velocity discretionarily was designed, using the TMS320LF2407 chip and the step motor drive. This control system can control step motors.

论文从工程应用的角度出发,以TMS320LF2407A DSP芯片作为控制核心,结合专用步进电动机驱动器,设计了一套可控制的电动机,且具有位移控制和多级调速功能的步进电动机控制系统。

A control system of step motor that enable operator to control displacement and adjust velocity discretionarily was designed, using the TMS320LF2407 chip and the step motor drive.

本文从工程应用的角度出发,以TMS320LF2407 DSP芯片作为控制核心,结合专用步进电机驱动器,设计了一套可同时控制8个电机,且具有位移控制和多级调速功能的步进电机控制系统。

The power dissipation is 108 mW with the area of 475 μm×578 μm.

功耗仅为108 mW,芯片面积为475 μm×578 μm。

PCI sound card is one of the advantages of the use of advanced DLS technology, the sound wave table stored in the hard disk through the sound card chip processing, in the play transferred to the memory when MIDI.

PCI声卡的优势之一是可使用先进的DLS技术,将波表音色储存于硬盘中,通过声卡芯片处理,在播放MIDI时调入内存。

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