芯片

Underfill technology has been used to minimize the mismatch of the Coefficient of Thermal Expansion in flip chip technology.

底层填充技术应用于倒装芯片热膨胀系数配合的最小化，它也被扩展应用到增加CSP(Chip Scale Package 芯片级封装)的机械强度。

By way of answer Huang noted,"We use an industry standard process, how we manufacture the chip is identical to a lot of companies and this particular bump underfill material has been used to manufacture billions and billions of chips, not billions of chips."

他使用如下的陈述作为回答。&我们使用工业标准的工艺，我们生产芯片的方式与很多公司毫无二致，而出问题的填充材料也用来生产了数百亿，而不仅仅是数十亿的芯片&

Comparison between FEA and experiment highlights the importance of adhesion between underfill and chip to thermomechanical reliability of the FCOB assembly.

通过模拟和试验结果的比较，论证了下部填充料与芯片之间粘接力对倒装芯片封装热应力可靠性的重大影响。

Theoretic modes were built to study the interaction between infrared light and failures in underfill, and to explain the fringes and contrast in IR images.

2通过失效分析方法发现了一种热冲击试验中失效倒装芯片封装中的芯片边缘裂缝。

On the basis of the summarization of MCM-Cs main features and its assembly and packaging technologies, the paper puts stress on relatively deepgoing studies in practically advanced MCM-C assembly process technologies as gold ball wire bonding, IC chip gold ball stud bump making, IC flip chip bonding and underfilling, in high reliability MCM-C packaging process technologies as integral LTCC substrate packaging, hermetically metal sealing, and also in the basic technological process of MCM-C assembly and packaging. Later on, it presents the effectively engineering development of two high level actual module products--a high-density monolithic processor system MCM-C , a high-speed data collecting and processing system MCM-C. Lastly, it briefly introduces various common methods of quality inspection and reliability test of MCM-C assembly and packaging in engineering practice.

论文在综述MCM-C的主要特点及其组装封装技术的基础上，重点对金丝球引线键合、IC芯片金球凸点制作、IC芯片倒装焊与下填充等实用先进MCM-C组装工艺技术和LTCC基板与外壳及PGA引线的一体化封装、气密性金属封装等高可靠MCM-C封装工艺技术以及MCM-C组装封装基本工艺流程展开了较深入的研究，有效完成了高密度单片机系统MCM-C和高速数据采集控制系统MCM-C等两种高水平实际产品的工程化研制工作，扼要介绍了工程实践中MCM-C组装封装工艺常用的质量检验方法和可靠性试验方法。

The power consumption of etched and unetched sensors can be compared.

从而对有空气夹层的传感器芯片和没有空气夹层的传感器芯片的能耗做比较。

The standard curve was constructed by using gene chip after the methylated and unmethylated DNA were mixed at different ratio. Then treated samples of U266 cells were dotted on gene chip, obtained results were compared with standard curve to get the quantitative results.

采用基因芯片的方法，将完全未甲基化的DNA和完全甲基化的DNA混合后制成标准曲线，将U266细胞株样本处理后点在芯片上与标准曲线进行比较后得出定量检测的结果。

It can be acheived in both a modchip AND a non-modchip form so no doubt teams like WAB and others will have solutions for you in the coming weeks as the methods to achieve this are indeed known by others - we are simply confirming its very possible.

它可以在有芯片和没有芯片的两者情况下都获得成功，所以不要怀疑像WAB这样的小组已经拥有了类似的解决方案，并会在未来的几周内放出，同时也不要怀疑其他小组也拥有这样的解决方案，因为我们已经证实这是非常有可能的。。。。。。。。。。

The original PS3 used the Emotion Engine/Graphics Synthesiser to emulate PS2 titles. With the latest European specification we have removed the Emotion Engine, retaining the graphics chip.

原本的PS3有PS2的EE和图形芯片用于运行PS2的游戏，这次欧洲版本的改动仅仅是取消了EE而保留了图形芯片。

A method of arraying self-scanning light-emitting element array chips is provided, in which it is possible to remove defective chips completely.

提供一种可完全除去不良芯片的发光元件阵列芯片的布置方法。

But we don't care about Battlegrounds.

但我们并不在乎沙场中的显露。

Ah! don't mention it, the butcher's shop is a horror.

啊！不用提了。提到肉，真是糟透了。