耐热玻璃

I want a kind of glass dish that resists heat.

我要一种耐热的玻璃盘。

P: paper-based epoxy resin copper-Park Ji-layer paper between phenolic resin and glass cloth epoxy resin substrate board of the electrical characteristics of the middle, humidity, and heat resistance, used in single-and double-sided printed circuit boards, the main purpose of which is the circuit used for a variety of power requirements of high-frequency characteristics of substrate and the color TV, VTR, etc. used in tuning, as well as the board, such as OA machines.

。P：纸质环氧树脂铜泊积层有介于纸质酚醛树脂基板及玻璃布环氧树脂机板中间之电气特性，耐湿性，耐热性，使用于单面及双面印刷电路板，主要的用途是用于各种电源回路用基板及要求高周波特性之彩色TV，VTR等之调谐器用，以及OA机器等机板。

The results showed that the m-PUE had better heat-resistant properties, lower glass transition temperature, higher thermal decomposition temperature and better damping property. The internal friction peak was changed from 10 ℃ to -10 ℃, while the tan δ was changed from 0.28 to 0.46. The hardness, tensile strength and tear strength of m-PUE decreased with the increase of the THEIC content. However, the swelling ratio of PUE was increased meaning a deteriorated solvent resistance property.

结果表明，引入IS环后，PUE的耐热性能有提高；IS改性的PUE的内耗峰比未改性的窄，峰位由10℃移到-10℃，且内耗峰值增大（tanδ由0.28增大到0.46），玻璃化温度降低，而阻尼性能得到提高；引入IS环的PUE的硬度和其它力学性能比未改性的PUE有所降低；随着固化剂中THEIC用量的增加，PUE的溶胀率增大，即IS改性PUE的耐溶剂性变差。

Do you know, i need you to come back

你知道吗，我需要你回来

Yang yinshu、Wang xiangsheng、Li decang,The first discovery of haemaphysalis conicinna.

1〕 杨银书，王祥生，李德昌。安徽省首次发现嗜群血蜱。