组织形态学

There arose the question of how to get enough money.

问题出现了，不知道怎样来筹集足够的资金。

For several years now, technology leading compound semiconductor companies have introduced multi beam laser dicing to replace the conversional mechanical die separation technology such as sawing and scribe and break.

已有几年了，技术领先的复合半导体公司引进了多光束激光划片来替代常规的机械式冲模分离技术，比如锯开，划线器划开然后掰开。