磷化

This product is designed for high performance requirements of phosphating treatmen before cathodic electrophoretic coating.

本品是专门用于性能要求极高的阴极电泳涂装前磷化处理。

Indium phosphide-silica;photonic crystal;metallorganic chemical vapour deposition;solvent vaporization method

磷化锢一二氧化硅；光子晶体；金属有机化学气相沉积；溶剂蒸发法

The main contents are as follows: A series of MCM-41-supported nickel phosphide catalysts with initial Ni/P atomic ratio of 0.5 - 2 and loading level of 10 - 40 wt % in the oxidic precursors were prepared by an in-situ reduction method. Their catalytic performances were evaluated in the HDN of quinoline.

论文内容主要包括：用原位还原的方法制备了MCM-41负载的磷化镍催化剂，考察了不同Ni／P摩尔比和负载量对催化剂结构和喹啉HDN反应活性的影响。

This can make not only the outside, but also the inside of the panels be phosphated.

这样可以使钢地板的内外表面全部都得到磷化。

All parts with a specified hardness of HRC 32 or greater, which are acid cleaned (not to exceed 10 minutes) and phosphated to the requirements of PS-80 shall be held in the supplier's plant for 48 hours or baked for one (1) hour at 115 +/- 10 degrees C.

所有硬度等于或大于HRC 32的零件，酸洗（不超过10分钟）后再按PS-80标准进行磷化的，应在供应商的工厂内放置48小时，或在115±10℃温度下烘烤1小时（见表1及2.3条烘烤方法）。

After this, the experiment proved that why the natural fires occurred over 100 times is that the phosphoreted hydrogen burns itself and ignites the methane.

此后，经过实验证明，原来这是由于磷化氢自燃引燃甲烷所致。

Which has substituted such traditional technologies as Zinc electroplating, Chromium electroplating, Zinc hot-dipping , Zinc hot spraying, phosphorize etc

取代了电镀锌、电镀镉、热浸锌、热喷锌、磷化等传统工艺技术

The fracture reasons of high strength PC steel wire are analyzed, it's considered that center segregation, central cavitation, poriness and inclusion are the metallurgical reasons which lead to the facture of PC steel wire and in the rolling process, differential coping quality, microcrack caused by surface defect, abnormal microstructure caused by burnt and improper cooling velocity, the ears on the head of the wire, overlapping of the wire rod itself are the main reasons which lead to the facture of PC steel wire. At the same time, inappropriate pickling, differential phosphorization quality, the bad heat treatment quality, the generation of crack in the improper drawing and transverse crack caused by abnormal laying of the drawing die are also the reasons of the cracking of PC wire.

对高强度PC钢丝断裂原因进行了分析，认为连铸坯的中心偏析、中心缩孔、疏松和夹杂是导致PC钢丝断裂的冶金原因；轧制过程中，较差的修磨质量、表面缺陷导致的微裂纹，过烧以及不适当的冷却速度导致的非正常显微组织，盘条头部的耳子、盘条本身折叠是导致PC钢丝断裂的主要原因；同时，不恰当的酸洗、较差的磷化及热处理质量、不适当拉丝裂纹的产生、拉拔模具安放不正导致的横裂也是PC钢丝断裂的原因。

The RF and digital performance of InGaP/In0.22Ga0.78As pseudomorphic high electron mobility transistors with different doping profiles are investigated.

不同载子参杂方式的磷化铟镓高电子迁移率电晶体的高频与数位特性在此被研究。

There are two parts in this thesis. Part I focuses on the transient effect in InGaP/GaAs hetero-junction bipolar transistors. Part II focuses on the P memory effect and buffer-layer-quality determination using C-V measurement in AlGaAs/GaAs pseudomorphic high-electron-mobility transistors. The characterization of hydrogen passivation for InGaP HBTs grown on semi-insulating GaAs substrates is studied. The transient effect caused by hydrogen passivation results the current gain ?

本论文分两部分，第一部份讨论在磷化铟镓的异质接面双载子电晶体中，由於氢的包覆效应产生的特性之研究，由於氢在此种元件中所造成的载子包覆现象是引起电流增益增加的暂态现象的主要原因，本论文提出一个计算氢包覆比例的模型，并与SIMS量测的结果相比对，经过几次热回火处理，此种暂态效应可以被消除。

For a big chunk of credit-card losses; the number of filings (and thus charge-off rates) would be rising again, whether

年美国个人破产法的一个改动使得破产登记急速下降，而后引起了信用卡大规模的亏损。

Eph. 4:23 And that you be renewed in the spirit of your mind

弗四23 而在你们心思的灵里得以更新