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硅片

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High-energy laser pulses are utilized to ablate the unpolished surface of silicon wafer and slide glass and morphology and nanomechanical properties of the sample surface are characterized.

采用高能量飞秒激光脉冲对硅片和载玻片的未抛光表面进行了烧蚀,对烧蚀后样品的表面形貌和纳米力学性能进行了检测。

AEI, a leading supplier of broadband communication, broadband networking and broadband application products that are cutting edge, innovative and affordable, is located in Sunnyvale, California,...

其主要业务是研发生产销售有机硅、聚合物、精细化学品、多晶硅和超纯硅片。瓦克在欧洲、美洲和亚洲拥有20多个制造工厂以及全球100余个销售办事处,雇佣了大约近20000名员工。亚洲的制。。。

Employees of large companies.(Such as IBM, General Electric and Hewlett Packard), also frequently break away and form their own small companies to develop, produce and market new advanced products, services and technologies, such as the gallium arsenide high-speed semi-conductor as a replacement for silicon.

像国际商用机器公司、通用电器公司和赫勒特-帕克特公司这些大公司的雇员也常常离开公司,成立他们自己的小公司,开发、生产和销售新的先进产品,提供服务和技术,如用砷化镓高速度半导体来代替硅片

Because the atomic lattice structure of gallium nitride is better matched to sapphire than it is to silicon, making LEDs on silicon without distortions has proved extremely tricky.

由于氮化镓的原子格栅结构能更好的与蓝宝石匹配,所以在硅片上不发生变形地制造发光二极管就特别难以把握。

The annihilation of the octahedron voids at the tips of FPDs was divided two processes:(1) The oxide on the void was removed by the out-diffusion of Oi in the shallow region , especially the Oi aroud the void and by the entry of the interstitial Si atomics .

FPDs端部八面体空洞的消失分为两个阶段:覆盖在空洞各个内壁上的氧化膜由于高温下硅片表面区域的间隙氧原子,尤其是空洞型缺陷周围的间隙氧原子的外扩散及自间隙硅原子的进入,而逐渐变薄直至最终消失。

About 90 percent area of SoC will be located with variety memory in 2010 year.

到2010年,约90%的硅片面积都将被不同功能的存储器所占据。

Constructed as a System in Package, this microelectromechanical system device contains a silicon based vibration device and a custom designed integrated circuit for the capacitive sensor circuitry.

构造一个系统级封装中,该微机电系统器件包含一个基于硅片振动的设备和设计的电容式传感器电路集成电路自定义。

As the surface charge density increased, the adsorbed BSA amount also increased.

随着硅片表面电荷密度增加,BSA吸附量增加。

This paper surveys robotic wafer handling system for integrate circuit manufacturing,and reviews the operating principle and research results of the main components of the system,i.

介绍了面向集成电路制造业的硅片机器人传输系统,综述了其主要组成部分——硅片机器人和预对准装置——的工作原理及国内外研究成果。

Generally, the hearing did not recovery to an availabel level in patients either with silastic film or cartilage slice implants.

再次手术取出植入物时发现,硅片常被包裹在纤维结缔组织形成的包囊中,其周围仍有广泛粘连;同种异体软骨片植入者一般无这种包囊,周围粘连亦较轻,但无论是硅片还是软骨片植入或其它方法手术,它们的术后听力一般都达不到应用水平,其远期疗效更差。

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呼气,收缩臀部肌肉;拱起身体,尽量抬起头来,右腿伸直朝向天花板(膝微屈,以避免肌肉紧张)。

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