硅片

Then, based on the configuration and design principle of the wafer handing robot, the model of the wafer handing robot arm is established. The radial linear concertina motion of the wafer handing robot is analyzed, a type of mechanism that can implement the function is proposed, furthermore, the kinematics of the mechanism is analyzed.

其次，根据硅片传输机器人的构型与设计原则，建立了机器人手臂的模型，对硅片传输机器人的径向直线伸缩运动展开分析，提出了实现该运动的机构，并对机构进行了运动学分析。

An array of permalloy core solenoids is micromachined as microactuators on (100) silicon wafer. Then anisotropic etching of silicon in KOH solution forms the U-grooves beside the microactuators. The micromachining difficulties from the coexistence of 3-D MEMS devices and deep grooves on chip are overcome successfully. Then two fibers and permalloy piece are assembled onto the wafer together with the microstructures finishing the prototype of the new type MEMS VOA. Third, the inductance, resistance and Q value of the microfabricated solenoids are measured in the frequency range of 1-40 MHz.

第二，新开发了使用SU-85的正胶、负胶复合微加工工艺，在（100）硅片上加工了新型可变光衰减器的铁芯MEMS螺线管型电磁微执行器阵列；用KOH水溶液对（100）硅片进行湿法刻蚀，在电磁微执行器旁边微加工了V形槽结构组合，开发了单片集成三维MEMS器件和深槽的微加工关键技术；然后经过微装配制作出了电磁驱动的光纤偏移型MEMS可变光衰减器的样机。

The orbit of double-side grinding was analyzed,the orbit equation of point p in wheel to wafer was inferred.

分析了硅片双面磨削的运动轨迹，并给出了砂轮上P点相对于硅片的运动轨迹。

A common heating oxidation device(fig.1)is to place a silicon plate in a quartz crystal glass reaction chamber. In the reaction chamber, a electric resistant wire heating device heat up the chamber to a certain temperature(usually, the temperature is 900～1200℃. In a special condition, it can be descended to under 600℃). When oxygen or water vapour pass through the chamber(typical gas flow speed is 1cm/s). A chemical reaction is generated on surface of the silicon plate.

常用的热氧化装置（图1）将硅片置于用石英玻璃制成的反应管中，反应管用电阻丝加热炉加热一定温度(常用的温度为900～1200℃，在特殊条件下可降到600℃以下)，氧气或水汽通过反应管（典型的气流速度为1厘米/秒）时，在硅片表面发生化学反应

This circular visual trajectory thanmerges into the vision of celestial infinity portrayed in the upper part of thedial and symbolised by a silicium plate bearing the NGC 1300 nebula, along witha day/night disc rotating against a star-studded backdrop.

环形的视野消失于表盘上方无穷的天际，此处带有象征NGC 1300星云图案的硅片，硅片上还带有在星空背景下旋转的昼/夜显示盘。

A new mini spectrophotometer was developed by adopting micro-silicon-slit and micro-silicon-fixer, which are based on MEMS technology.

研制出了一种采用微硅片对准技术和微硅片狭缝的新型微型分光光度计。

E., monocrystalline process, cleanliness of silicon wafers before annealing, and eleanliness of annealer, affecting the lifetime and bulk metal contamination by way of the study with SPV method.

因为金属杂质可以通过热过程从硅片的表面扩散进内部，并成为非常有效的复合中心，大大促进载流子的复合，降低硅片寿命，进而影响器件的性能和可靠性。

Owing to electromagnetic field selective heating materials, the energy is first deposited in the gold portion and then the substrate is conductively and inductively heated.

选用垂直于其表面的射频磁场对镀金膜的硅片进行了感应加热，由于磁场对材料加热具有选择性，感应热量首先作用于硅片上的金膜内，硅片先被传导加热到一定温度，然后被感应加热。

MTB type automatic tiering silicon chip machine is a three-workstation tiering chip machine with water-bed sliding table which is designed and manufactured according to demands of silicon chip manufacturing enterprise; 75 silicon chips can be lined at one set up; special basket fixture can be used for fast changing of 6''/8'' silicon slice, it's easy to operate reliably.

MTB 型硅片自动排片机是根据太阳能硅片生产企业实际生产需要设计改进、制造的水床式三工位硅片排片机；一次排片75片。特有的花篮定位治具能适应6吋/8吋硅片的快速转换，操作简单，工作可靠。

Silicon wafer with low silicon steel sheet of 2.8% below the high-silicon-silicon content was 2.8%-4.8%, both in actual use there is no strict boundaries, commonly used to create large-scale high-silicon electrical.

矽钢片低硅片含硅2.8％以下，高硅片含硅量为2.8％-4.8％，两者在实际使用中并无严格界限，常用高硅片制造大型电机。

Breath, muscle contraction of the buttocks; arch body, as far as possible to hold his head, right leg straight towards the ceiling (peg-leg knee in order to avoid muscle tension).

呼气，收缩臀部肌肉；拱起身体，尽量抬起头来，右腿伸直朝向天花板（膝微屈，以避免肌肉紧张）。

The cost of moving grain food products was unchanged from May, but year over year are up 8%.

粮食产品的运输费用与5月份相比没有变化，但却比去年同期高8％。