电镀的

In this paper the quantitative method for citric acid in electropolishing solution by ion chromatography is described.

研究用离子色谱法对电镀抛光液中柠檬酸的测定方法，选择合适的分离条件，使电镀抛光液中磷酸、硫酸和柠檬酸得到很好的分离。

The technique of composite plating of nickel／diamond in ultrasonic field was researched and ultrasound-assisted electroplating technique for diamond bit manufacture was established.

研究了超声波作用下的钞金刚石复合电镀工艺，确定了超声波电镀金刚石钻头的制造工艺流程，并根据确定的工艺试制了Φ75.5／49绳索取心钻头进行野外钻进试验。

The electroplated ferronickel shutter is suspended by a silicon spring The shutter is fabricated by the nonsilicon surface micromachining techniques. The planar coil is fabricated by high-aspect-ratio photolithography and mask-plating processes. And the silicon spring and the fiber alignment components are fabricated by the reactive ion etching and by the silicon anisotropic etching process.

电镀铁镍制作的挡光片被固定在一个硅弹簧上，该挡光片采用非硅表面微加工工艺制作，平面电感线圈利用高深宽比的光刻工艺和掩蔽电镀工艺制作，硅弹簧和光纤对准元件采用反应离子刻蚀和硅的各向异性腐蚀工艺制作。

The device is fabricated by nonsilicon surface micro-machining, which uses the photoresist and the sputtered copper thin films as the scarificial layers, and the electroplated ferronickel as the structure layer to fabricate the optical MEMS components. The device consists of an electroplated ferronickel optical shutter interposed in a gap between two fiber alignment componets, an electroplated planar coil, a silicon spring, and two fiber alignment components with V-shaped grooves.

该衰减器利用非硅表面微加工工艺(这种工艺采用光致抗蚀剂和溅射铜薄膜作为牺牲层，电镀铁镍层作为结构层来制作MEMS元件)制作，由电镀铁镍层构成的一个插在两对准光纤空隙中的挡光片，一个平面电感线圈，一个硅弹簧和二个带有V型槽的光纤对准元件构成。

These parameters include cathode current density, flow velocity of plating solution and thickness of galvanization coating.

摘 要：利用自制的模拟重力高速电镀槽，考察了在硫酸盐镀锌过程中，阴极电流密度、镀液流速、镀层厚度3个主要电镀工艺参数对所得锌层的粗糙度的影响。

The polarization processes of cathode under different additive concentration were analyzed by LCV and CP while the additives' effects on morphology of copper pulse deposits were measured by SEM.

采用电化学方法LCV和CP，分析了不同添加剂浓度下电镀过程的极化情况；用SEM表征了三种添加剂对脉冲电镀铜的镀层结构形貌的影响。

The traditional chromium plating has carried through according to the technology of Sargent.

由于Sargent电镀铬工艺存在阴极电流效率低，分散能力和深镀能力差，以及六价铬离子带来的对操作工人身体的危害和严重的环境污染等问题，近年来发展了三价铬电镀工作。

From the characteristics and its harmfulness of electroplating sludge containing heavy metals,the state of innoxious disposal and recycle of electroplating sludge at home and abroad are reviewed in this paper.

从电镀重金属污泥的特点及其危害性谈起，综述了目前国内外电镀污泥的无害化处置和资源化利用的各种技术及研究进展。

In the study, nanocomposite Co/Al2O3 layers were fabricated by composite electrodeposition. Plating bath composition include cobalt sulfamate (CoSO4), cobalt chloride(CoCl2), boric acid(H3BO3), sodium chloride and nanosized Al2O3 powder with different volume concentration. Co ions and Al2O3 can codeposition of Cu substratum by DC current.

本研究以复合电镀方式制备Co/Al2O3复合镀层，所使用的电镀液内的成分有硫酸钴、氯化亚钴、氯化钠、硼酸，其中加入不同体积浓度的奈米级Al2O3粉末，使得Co离子和Al2O3粉末共沈积在Cu基材上而形成复合镀膜。

The company was established in 2001, covers an area of 16,000 square meters, are set production, sale and service of professional manufacturers, professional production·, chemical pure, pure electronics, industrial pure content specifications such as sulfuric acid, nitric acid, hydrochloric acid, sodium hydroxide, hydrogen peroxide, ammonia and other chemical raw materials and chemical reagents, as well as multi-layer circuit boards, flexible circuits board, semiconductor, electronic plating, chemical plating, wastewater treatment and a variety of electronic device manufacturers to provide supporting services.

公司成立于2001年，占地面积16000平方米，是集生产、销售、服务于一体的专业型厂商，专业生产分析纯、化学纯、电子纯、工业纯等各种规格含量的硫酸、硝酸、盐酸、氢氧化钠、双氧水、氨水等各种化工原料及化学试剂，并为多层电路板、软性电路板、半导体、电子电镀、化学电镀、废水处理及各种电子器件生产厂商提供配套服务。

The split between the two groups can hardly be papered over.

这两个团体间的分歧难以掩饰。

This approach not only encourages a greater number of responses, but minimizes the likelihood of stale groupthink.

这种做法不仅鼓励了更多的反应，而且减少跟风的可能性。