电镀层

The property of the coating is identical with electroplating Zn-Ni alloy coating in ammoniate.

其镀层性能和铵盐电镀锌－镍合金镀层相当。

Our process capability: Plates: FR4, High TG FR4, high CTI FR4, high frequency materials, halogen-free materials, aluminum and other low-rise Materials :2-20 layer of finished copper thickness :0.5-5 OZ finished thickness: 0.2 -6.0mm Minimum line width: 3mil Minimum line spacing: 3mil smallest shape tolerances:+/-0.1mm minimum finished diameter: 0.1mm maximum thickness aperture ratio: 12:1 wide minimum solder bridge: 4mil characters minimum line width: 5mil Minimum height of characters: 30mil Solder Mask Color: Green, black, blue, white, yellow, purple characters such as color: white, yellow, black and other surface processes: spray tin, lead-free HASL, Electroless gold plating Shuijin, OSP, chemical Shen tin, silver and other chemicals Shen Process: Goldfinger, blue gum, Blind-via/Buried-via, characteristic impedance control, rigid-flexible combination of reliability testing such as: Open / Short testing, impedance testing, solderability testing, thermal shock testing, metallographic analysis of micro-slice curvature Isoptera: 0.7% flame retardant Level: 94V-0

我们公司的制程能力：板材：FR4、高TG FR4、高CTI FR4、高频材料、无卤素材料、铝基材料等层数：2-20层成品铜厚：0.5-5 OZ成品板厚：0.2-6.0mm最小线宽：3mil最小线间距：3mil最小外形公差：+/-0.1mm最小成品孔径：0.1mm最大板厚孔径比：12：1最小阻焊桥宽：4mil最小字符线宽：5mil最小字符高度：30mil阻焊颜色：绿色、黑色、蓝色、白色、黄色、紫色等字符颜色：白色、黄色、黑色等表面工艺：喷锡，无铅喷锡、化学沉金、电镀水金、OSP、化学沉锡、化学沉银等其它工艺：金手指、蓝胶、盲埋孔、特性阻抗控制、刚柔结合等可靠性测试：开/短路测试、阻抗测试、可焊性测试、热冲击测试、金相微切片分析等翅曲度：≤0.7%阻燃等级：94V-0

By decreasing the current density in plating process, the width and depth of cracks of the electrodeposit are reduced and the corrosion resistance of the electrodeposit improves.

电镀工艺中减小电流密度可以减小镀层裂纹宽度和深度，从而提高镀层的耐蚀性。

The effects of electrodeposition parameters,such as morphology of membrane,temperature,thickness of the coating are investigated.

主要对AlCl3和LiAlH4溶于四氢呋喃有机体系镀层的表面形貌、电镀参数、温度以及镀层的厚度进行了研究。

Using Vegard's law to calculate the composition of the direct current plated Cu-Co solid solution was 89~96%. According to the result of XRD, the structure of Cu-Co alloy is mainly face-centered cubic phase.

在铜钴合金方面，利用Vegard式可以得到直流电镀的铜钴镀层所形成的固溶体，组成在89~96%之间，且由X光绕射得知钴镀层为面心立方的结构。

The optimized formula was gained by orthogonal test as follows: 80 g/L of meta-nitrobenzine sodium sulfonate,37.5 g/L of monoethanolamine,30 g/L of glycine,4.5 g/L of sodium thiosulfate and 0.03 g/L of lauryl sodium sulfate.

1前言尽管电镀技术愈来愈先进，但是出现不合格镀层总是难免的，因此，不合格镀层的退除和重新施镀，对资源的再生与合理应用具有重要意义。

The effects of pulse parameters such as pulse width Ton, pulse interval Toff, pulse frequency f, pulse current density J on the morphology ,grain size , hardness, internal stress and orientation of coating , and coherence of coating to sucbstrate have been examined .

研究了脉冲电镀参数：脉冲宽度Ton ，脉冲间隔Toff，脉冲频率f，脉冲电流密度 J对镀层微观形貌、颗粒大小、硬度、与基体结合力的影响，分析了镀层内应力、择优取向与脉冲参数的关系。

The surface state and electrochemistry properly platinum-plated on open-cell foamed titanium electrode was investigated and he compared with IrTi anode and platinum-plated titanium toil cathode. The results show that open-cell foamed titanium can uniformly coat with excellent bonding strength platinum-plated, thickness coating 2 μm. The cathode release hydrogen voltage of platinum-plated on open-cell loamed titanium electrode is fall. The anode release oxygen voltage of platinum-plated on open-cell foamed titanium electrode is higher than Irli anode in high current.

采用电镀技术在多孔钛表面沉积了均匀的铂金属层，分析了多孔钛镀铂后的表面状态及电化学性能，并与IrTi涂层阳极及镀铂钛网阴极进行比较，结果显示：多孔钛板开孔孔隙表面可均匀沉积结合力良好的铂层，镀层厚度为2μm；镀铂多孔钛阴极析氢电位比镀铂钛网高，且在大电流下，阳极析氧电位比IrTi涂层阳极高。

The surfaces of the silicon spiral are coated with highly conformal copper by electroless plating to reduce the resistive loss in the conductor,with thin nickel film plated on the surface of the copper layer for final surface passivation.

采用一种硅玻璃键合-深刻蚀成型释放工艺并结合无电镀技术制作该电感，形成厚约40μm的硅螺线，在硅螺线表面镀有高保形厚铜镀层，在铜镀层表面镀有起钝化保护作用的薄镍镀层。

The fiber is firstly coated with a thin copper or nickel plate with electroless plating method. Then, a thicker nickel plate is coated on the surface of the conductive layer.

提供了保护过程的技术细节，首先在光纤表面进行化学镀处理获得导电的薄镍层或铜层，然后在该导电层上进行电镀镍。

This one mode pays close attention to network credence foundation of the businessman very much.

这一模式非常关注商人的网络信用基础。

Cell morphology of bacterial ghost of Pasteurella multocida was observed by scanning electron microscopy and inactivation ratio was estimated by CFU analysi.

扫描电镜观察多杀性巴氏杆菌细菌幽灵和菌落形成单位评价遗传灭活率。