电镀层

The problem that noxious chrome of sexavalence and trivalence is present in the galvanizing coat and passivating solution of the prior art is solved substantially by the passivating solution of the present invention.

本发明提供的无铬钝化液可以从根本上解决了现有的产品镀锌层及钝化液中含有有毒有害的六价铬和三价铬元素的问题，并可真正替代现有的含有六价铬和三价铬的铬酸盐钝化液，实现对电镀锌层和热镀锌层的钝化。

The results show that the technical parameters and the concentration of sodium molybdate have obvious effect on the composition of the alloy. The crystal grain size is from 6.2 to 12.7 nm and changes with current density, temperature and the pH value of the electrolyte.The crystalline growth of the alloy accords with the model of three-dimensional growth. The surface morphology is mainly determined by the rate competitions between the growing direction of vertical surface and the expanding direction along the surface towards circumambient. The results of the X-ray data show the presence of the multiphase containing solid solution and intermetallic compound in the deposits. The deposit phases alter from the FeNi and FeMo solid solution to the FeNi and MoNi4structure at 3 A/dm2. The deposits internal stress increases linearly with the decrease of the grain size. The lattice parameter of the deposits are slightly distorted

结果表明：工艺条件和钼酸钠浓度对合金组成的影响较大；所得合金晶粒尺寸为6.2~12.7 nm，并随电流密度、温度和电镀液的pH值的改变而变化；合金的晶体生长符合晶核三维生长模型，镀层表面形貌由平行和垂直于基体的生长速度的相对大小决定；镀层物相为固溶体和金属间化合物的多相结构，当电流密度为3 A/dm2时，镀层物相由FeNi和FeMo固溶相转化为FeNi和

Electroless Copper is a chemical metalization process intended to metallize the surface of dielectric material at the hole wall and institute electrical connection between all exposed copper surfaces.

化学沉铜：为了使孔壁上不导电的树脂及玻璃能够导电，进行化学沉铜，使孔壁与板面上沉上的一层很薄的铜层，只有大约75微英寸厚（0.5mil），再通过全板电镀，使板面和内层铜联接起来。

The possibility for preparing nanocrystalline materials by jet-electrodeposition technique is also analyzed. Corresponding the research in the article, a set of unsubmerged single circular jets equipment was designed. In chapter 2, jet-electrodeposition was carried out both under direct current condition and pulse current condition. A series of samples for nanocrystalline nickel coating were prepared under different deposition parameters.

在第二章中，采用喷射电沉积技术分别使用直流和脉冲两种波形的电流进行电沉积，改变电沉积工艺参数制备了一系列的纳米晶镍镀层样品，使用X射线衍射、扫描电镜、透射电镜、维氏硬度计等仪器对镀层微观结构和性能进行了分析和表征，主要考察了在直流喷射电沉积和脉冲喷射电沉积方式下，沉积参数如电流密度、电镀液喷射速度等对镀层微观结构和显微硬度的影响。

Electroplated diamond wire saw is a kind of linearity superhard material tool, which is prepared by electroplating a layer metal deposit on metal wire and concreting diamond in the deposited metal.

电镀金刚石线锯是用电镀的方法在金属丝上沉积一层金属，并在沉积的金属内固结金刚石磨料制成的一种线性超硬材料工具。

In this paper, we study effect of current density on throwing power and elongation, then investigate throwing power of high aspect ratio through-hole under different plating parameter, and research the reliability of PTH.

本文研究了不同电流密度下高厚径比镀通性及镀层延展性的变化趋势，在设备和药水条件基本固定的情况下，考察不同电镀参数组合对高厚径比通孔电镀的效果，并对不同参数下的孔铜作热应力测试对比。

The results show that compared with Cr coating, Cr plating possesses many advantages, such as high efficiency, high throwing power, high covering power, low toxicity. However, maintenance of the bath is complex and frequent.

结果表明：与六价铬电镀工艺相比，三价铬电镀工艺具有低毒性、常温施镀、电流效率高、生产效率高、镀层性能好等优点，但其调整维护相对频繁、复杂。

The company was established in 2001, covers an area of 16,000 square meters, are set production, sale and service of professional manufacturers, professional production·, chemical pure, pure electronics, industrial pure content specifications such as sulfuric acid, nitric acid, hydrochloric acid, sodium hydroxide, hydrogen peroxide, ammonia and other chemical raw materials and chemical reagents, as well as multi-layer circuit boards, flexible circuits board, semiconductor, electronic plating, chemical plating, wastewater treatment and a variety of electronic device manufacturers to provide supporting services.

公司成立于2001年，占地面积16000平方米，是集生产、销售、服务于一体的专业型厂商，专业生产分析纯、化学纯、电子纯、工业纯等各种规格含量的硫酸、硝酸、盐酸、氢氧化钠、双氧水、氨水等各种化工原料及化学试剂，并为多层电路板、软性电路板、半导体、电子电镀、化学电镀、废水处理及各种电子器件生产厂商提供配套服务。

By studying the effects of mole rate of AlCl3-MEIC and fragrant chemical compound and dewater agent, electroplating aluminium bath of AlCl3-MEIC room temperature melt salt was prepared, and silvery white metallic luster , pre-pressing smooth aluminium layer is electroplated on NdFeB magnet from this solution.

4研究了AlCl_3和MEIC的摩尔比、芳香化合物及除水剂对室温熔盐电镀的影响，制备了AlCl_3-MEIC室温熔盐电沉积铝溶液，并从该溶液中电镀出了具有银白色金属光泽、致密光滑的铝镀层。

In electroplating aluminum on NdFeB magnet with use of AlCl3-MEIC room temperature melt salt bath,said magnet is activated to improve deposit adhesion by carrying out.before plating,electrolysis on said magnet.and plating process was described as below:Toasting and degreasing ?Sand blasting Drying Electricity activating?ElectroplatingSolvent washing Water washing Drying

5利用室温熔盐电解质作活化液对钕铁硼磁体进行电活化处理，可以提高基体和镀层的结合力，并提出如F电镀工艺流程：烘烤除油→喷砂除锈→干燥→电活化→电镀→溶剂洗→水洗→干燥

This one mode pays close attention to network credence foundation of the businessman very much.

这一模式非常关注商人的网络信用基础。

Cell morphology of bacterial ghost of Pasteurella multocida was observed by scanning electron microscopy and inactivation ratio was estimated by CFU analysi.

扫描电镜观察多杀性巴氏杆菌细菌幽灵和菌落形成单位评价遗传灭活率。