电镀层

These parameters include cathode current density, flow velocity of plating solution and thickness of galvanization coating.

摘 要：利用自制的模拟重力高速电镀槽，考察了在硫酸盐镀锌过程中，阴极电流密度、镀液流速、镀层厚度3个主要电镀工艺参数对所得锌层的粗糙度的影响。

The polarization processes of cathode under different additive concentration were analyzed by LCV and CP while the additives' effects on morphology of copper pulse deposits were measured by SEM.

采用电化学方法LCV和CP，分析了不同添加剂浓度下电镀过程的极化情况；用SEM表征了三种添加剂对脉冲电镀铜的镀层结构形貌的影响。

Thus the alkaline zincate continuous zinc plating technology for steel sheet was investigated, with the emphasis being placed on the effects of the bath composition and process conditions on the current efficiency. The throwing power of the plating solution was tested using Hull's cell 8 points thickness method, and the adhesion strength of the coating was examined by heating and shock cooling test.

为此，研究了用于薄钢板连续电镀的锌酸盐镀锌工艺，重点研究了镀液成分及工艺条件对电流效率的影响，用Hull槽8点法测试了镀液的均镀能力；用加热骤冷法测试了镀层的结合力，并对薄钢板连续电镀锌的前后处理工艺作了探讨。

The lab findings show, the no-blemish copper deposition can be realized through selective copper deposition in trench. In the process of electro-plating, via and crevice come into being due to the misproportion of the current density inside and outside the trench.

在电镀的条件下，凹槽电镀铜产生空洞和缝隙原因是凹槽内外电流密度分布不均匀，使凹槽内外镀层生长速度不一致，最终导致空洞和缝隙形成。

In the study, nanocomposite Co/Al2O3 layers were fabricated by composite electrodeposition. Plating bath composition include cobalt sulfamate (CoSO4), cobalt chloride(CoCl2), boric acid(H3BO3), sodium chloride and nanosized Al2O3 powder with different volume concentration. Co ions and Al2O3 can codeposition of Cu substratum by DC current.

本研究以复合电镀方式制备Co/Al2O3复合镀层，所使用的电镀液内的成分有硫酸钴、氯化亚钴、氯化钠、硼酸，其中加入不同体积浓度的奈米级Al2O3粉末，使得Co离子和Al2O3粉末共沈积在Cu基材上而形成复合镀膜。

The anodic behavior of electrolytic nickel anode in nickel sulfamate plating Solution was investigated,using anodic polarization curves,metallographic observation of cross-sections of nickel deposits,Hull Cell tests with solutions with and without Cl-,F-,bending tests with five solutions of different compositions,and sulfur content analysis in nickel deposit with mass spectrometry.

采用极化曲线、金相观察、赫尔槽电镀试验、弯曲试验和质谱分析方法，研究了氨基磺酸盐镀镍的阳极行为，证明了当在氨基磺酸盐镀液中使用电解镍阳极时，其活化峰值电流和镀液组成有很大的相关性，当镀液中不含F-和Cl-时其阳极活化峰值电流小，阳极处于极化状态，或相当大面积处于极化状态，使氨基磺酸根在极化的阳极表面氧化，从而使含硫化合物夹附于镀镍层，形成镀层内应力，并使镀层成为层状结构，并出现半光亮的外观。

One practical package of technological formula and parameter about electroplating tinting for ABS plastic are provided, including stress riddance, unoil, coarsing, sensitization, activating, revive treatment, and five-colored electroplating tinting .

介绍(丙烯腈/丁二烯/苯乙烯)共聚物制品的表面预处理、化学镀铜、电镀光亮铜和镀铜层着色等工艺，提供了一整套ABS 电镀着色的实用配方和工艺参数，包括去应力、除油、粗化、敏化、活化、还原处理及镀铜层五色系实用着色等。

25 Kinds of the weldable Tin and Tin-base alloys electroplating processes in the nearest 10 years in China were rewiewed systematically and completely.

系统而又比较全面地总结了我国近10年来电镀可焊性锡及锡基合金工艺25种，并指出了每种工艺的镀液性能和镀层质量的优劣，最后提出了可焊性电镀的发展趋势。

The new bath can plate directly on steel, copper, brass, zincated aluminum and most high quality properly prepared zinc diecastings in both rack and barrel installations. The copper deposit which plates must be fine grained, smooth, dense and ductile.

该工艺要求能够在钢铁、铜、黄铜、锌合金以及铝合金上面能直接电镀而得到细致、均匀、韧性好、结合力强的铜镀层，而且镀液也必须能适合挂镀、滚镀等多种电镀方式的需要。

Thus the process for the electroplating of aluminum on NdFeB permanent magnetic material in the molten salt electrolyte at room temperature was investigated.

探讨了NdFeB永磁材料在室温熔盐中电镀铝的可行性、熔盐配比和芳香化合物对电镀铝层组织形态的影响，同时对镀层形成的机理进行了初步探讨。

This one mode pays close attention to network credence foundation of the businessman very much.

这一模式非常关注商人的网络信用基础。

Cell morphology of bacterial ghost of Pasteurella multocida was observed by scanning electron microscopy and inactivation ratio was estimated by CFU analysi.

扫描电镜观察多杀性巴氏杆菌细菌幽灵和菌落形成单位评价遗传灭活率。