电镀层

The device is fabricated by nonsilicon surface micro-machining, which uses the photoresist and the sputtered copper thin films as the scarificial layers, and the electroplated ferronickel as the structure layer to fabricate the optical MEMS components. The device consists of an electroplated ferronickel optical shutter interposed in a gap between two fiber alignment componets, an electroplated planar coil, a silicon spring, and two fiber alignment components with V-shaped grooves.

该衰减器利用非硅表面微加工工艺(这种工艺采用光致抗蚀剂和溅射铜薄膜作为牺牲层，电镀铁镍层作为结构层来制作MEMS元件)制作，由电镀铁镍层构成的一个插在两对准光纤空隙中的挡光片，一个平面电感线圈，一个硅弹簧和二个带有V型槽的光纤对准元件构成。

Generally considering about the thermophysical performance parameters of the material and the heat reservoir of the laser, a rational numbered model of the laser remelted jet electroforming was build up by using finite element analysis software of ANSYS.

利用ANSYS有限元软件，综合考虑材料的热物理性能参数、激光的热源模型，建立了激光重熔喷射电镀层的数值模型。

Superadd, more than 8-12UM plating thicknessmeasure up and exceed the international standard, so we assure :"piece for piece eligible, one by one dependable""YADIDE" products can be used more than5-10 years never changer color and rusty phenomenon.

此外本公司的产品都经过先进科学、严格精细的品质检测，再加上产品的电镀层厚度达到8-12微米所以保证"个个达标、件件合格"，用户使用"雅帝德"牌系列高档卫浴产品5-10年都不会出现表面变色和生锈的情况。

An additive, ZFA was developed for zinc-iron alloy plating from alkaline zincate bath.

锌基合金电镀层由于具有优良的耐蚀性而受到人们的关注。

The pore distribution in the direction of coating thickness was self-existent and could not join to intercommunicating pore.The pore diameter was very tiny so that it could prevent hydrotropic solution entering into the pore.

机械镀锌的形层过程既没有热镀锌那样的高温冶金反应，也没有电镀锌那样的电沉积效应，镀层是常温常压下利用化学吸附沉积和机械碰撞使金属锌粉在工件表面镶嵌堆积而成[1]，所以人们认为机械镀锌镀层的致密性要低于电镀和热镀锌镀层，但机械镀锌镀层又表现出良好的耐腐蚀性能。

A kind of high speed sulphamate nickel-based electrolyte is chosen as basal electrolyte, the influences of plating process parameters on the micro-hardness of the nickel deposit have been studied by orthogonal experiments. It is concluded that the main influence factors on the micro-hardness of the nickel deposit are sulphamate concentration and electrolyte temperature, the deposition rate and quality in single-pulse mode are higher than that in DC power and double-pulse mode.

选择以氨磺酸型高速镀镍液作为基础镀液，通过正交试验研究了电镀工艺规范对镀层显微硬度的影响关系，试验结果表明：镀液主盐氨基磺酸镍浓度和镀液温度是影响镀层硬度的显著因素，单脉冲供电模式下的电镀沉积速率和镀层质量优于直流和双脉冲模式。

This article studied improved the ZrO2 suspending liquid disperser effect the method, and ZrO2 compound has plated the system relative disperser fluid; After the optimization of the galvanized parameter, surface Galvanizes a ZrO2 coating on the surface of the alloy K17 with Ni on the base heat-resisting, and compares the coating degree of hardness value which the system results in under the different craft; Surveys and calculates its oxidized dynamics curve after passes through 1000℃ carries on 100h the high-temperature oxidation experiment, and analyzes it to the organizational structure through the metallography microscope, the substrate bound state and so on the influence.

本文研究了改善ZrO2悬浮液分散效果的方法，并制得了相对分散均匀的ZrO2复合镀液；通过优化电镀各项参数后，在Ni基高温合金K17表面上电镀一层ZrO2 镀层，并比较在不同工艺下制得的镀层的硬度值；经过在1000℃进行100h的高温氧化实验后，测量并计算其氧化动力学曲线，分析氧化对组织结构、基体结合等状态的影响。

After employing many axle bush experts, we not only successively developed the entire automobile stop-pushing bush, which obtains the National New Products Certification and the complete independent intellectual property right, but also successively developed the materials by burning and the complete independent intellectual property right, but also successively developed the materials by burning and combining copper and lead powder, with quick precise electroplated nickel layer, three electroplated elements,and the electroplating technology of tin layer.

公司承诺&以人为本，求真务&的发展理念，不懈追求上规模，上档次，上质量，先后引进多名轴瓦业高级工程师，研制开发了享有自由知识产权的整体式汽车止推瓦，获国家新产品证书；成功开发了铜铅粉末烧结合金材料，并配以快速精密电镀镍栅层、铅锡铜电镀三元及闪锡层电镀等新科技，最近研制开发出具有国际领先的轴瓦&四元&电镀技术，形成数条铜基、铅基轴瓦生产线。

The effects of electroplated Ni layer and electroless plated Ni-P layer on the diffusion behavior in Sn-Ag/Cu solder joint were studied. The results by EPMA analysis showed that the electroless plated Ni-P layer acted as a good diffusion barrier between Sn-Ag solder and Cu substrate. However, the electroplated Ni layer can not hinder the inter-diffusion and reaction between molten Sn-Ag solder and Cu substrate when reflowing, and there was a layer of IMC (Cu6Sn5) at interface of Sn-Ag/C u solder joint.

摘 要：研究了电镀Ni层和化学镀Ni-P合金层对Sn-Ag/Cu焊点扩散行为的影响，电子探针分析表明：化学镀Ni-P合金层能很好地阻止Sn-Ag/Cu焊点在焊接过程中的Cu，Sn互扩散和相互反应；而电镀Ni层则不能阻止Sn-Ag/Cu焊点在焊接过程中的Cu，Sn互扩散和相互反应，界面反应产物仍以Cu6Sn5为主。

The system can scan stereoscopicly the internal tube of the measured object, the aim is to test the internal flaws of the inspected object, such as crazing, rust-eaten and dropping of electroplated coating.

该系统对被检测物体内表面进行立体扫描，可获得被检测物体内壁疵病信息，包括烧蚀面积，裂纹深度及电镀层脱落面积等。

This one mode pays close attention to network credence foundation of the businessman very much.

这一模式非常关注商人的网络信用基础。

Cell morphology of bacterial ghost of Pasteurella multocida was observed by scanning electron microscopy and inactivation ratio was estimated by CFU analysi.

扫描电镜观察多杀性巴氏杆菌细菌幽灵和菌落形成单位评价遗传灭活率。