电镀层
- 与 电镀层 相关的网络例句 [注:此内容来源于网络,仅供参考]
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They can be divided into 2 major categories, first printed circuit board chemicals including etchants, inner layer cleaners, desmear chemicals, electroless copper, stripper agents, etc. These products caters to process needs of both domestic and foreign PC board manufacturers.
主要的产品可分两部分,一为印刷电路板的化学药品,包括有蚀刻液、内层清洁液、去胶渣化学品、无电镀化学铜、黑棕化液和剥锡铅液等,提供国内外各PC主板公司生产流程所需的化学药品。
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By analyzing and comparing the above test results, the special demands for welding current and time and pressure in the spot welding of zinc-coated steels were put forward.
为了在需点焊加工的产品上推广使用镀锌钢板,并保证其焊接质量,本文对普通冷轧钢板、电镀锌钢板和两种不同锌层厚度的热镀锌钢板进行了一系列点焊工艺及力学性能试验,并通过对试验结果的数据处理和理论分析,找出了几种材料点焊工艺性能上的差异,得出了一套合适的点焊焊接规范范围。
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The relevant spot welding parameters for every kind of zinc-coated steels were proposed.
为了在需点焊加工的产品上推广使用镀锌钢板,并保证其焊接质量,本文对普通冷轧钢板、电镀锌钢板和两种不同锌层厚度的热镀锌钢板进行了一系列点焊工艺及力学性能试验,并通过对试验结果的数据处理和理论分析,找出了几种材料点焊工艺性能上的差异,得出了一套合适的点焊焊接规范范围。
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A series of spot welding technology and joint tensile-shear tests for uncoated low carbon, electroplated and two kinds of hot dipped zinc-coated steels were made to improve the quality of spot welding joint for zinc-coated steels. The test results were analyzed with computer regressive method. The effects of welding current or time on nugget diameter or joint tensile-shear strength and critical curves in splash generation for spot welding were obtained.
摘 要:为提高镀锌钢板点焊接头的质量,对普通冷轧钢板、电镀锌钢板和两种镀锌层厚度不同的热镀锌钢板进行了一组点焊工艺及接点强度试验,并对试验结果进行了计算机回归分析,分别得出了这几种材料在不同的焊接电流、焊接时间下的点焊熔核直径或接头拉剪强度变化曲线以及点焊飞溅临界曲线。
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On the basis of electroplating and immersion plating tin, and through large numbers of experiments, a new process of electroless plating tin in acid chloride bath solutions including SnCl2 2H2O, NaH2PO2 H2O, special complexing agent, additive agent, stabilizing agent and antioxidant, was established.
本文是在电镀锡、浸镀锡工艺配方的基础上,通过大量的试验,确立了一种以氯化亚锡、次亚磷酸钠和特定的络合剂、添加剂、稳定剂,抗氧化剂为基本镀液组成的酸性氯化物化学镀锡体系,成功地在铜上实现了锡的连续自催化沉积,获得了性能优异的半光亮银白色锡镀层。
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The elongation and throwing power are important target in PCB plating.
镀层延展性和深镀能力是评价PCB电镀能力的关键指标。
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The company's volume to volume Strip for automatic precision plating line is based on several decades of foreign advanced technology equipment, fully absorb the Netherlands, Switzerland, Japan, Hong Kong, Taiwan and other countries and regions of the characteristics of equipment, design of low-cost, A high degree of automation, the outstanding quality of the coating production lines, and large enterprises across the country in widespread use.
本公司的卷至卷带材连续自动精密电镀线是根据国外几十年的设备先进技术,充分吸收荷兰、瑞士、日本、香港、台湾等国家和地区的设备的特点,设计出的成本低、自动化程度高、镀层品质优秀的生产线,并在全国各地大型企业广泛使用。
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Cladding silver with tiny crystal grain and bright surface can be gained in the condition of plating solution with about 25℃,PH9.0, cathode current density between 0.3 and 0.4A·dm-2 .Uniform foamed silver can be made by burning in the temperature of 600℃and reduction sinter in the temperature of between 800 and 850℃in electrodeposited polyurethane.
研究了PH值、温度、时间、阴极电流密度等对电沉积银质量的影响,结果表明:电镀液温度为25℃左右,PH值为9.0左右,阴极电流密度为0.3~0.4A·dm~(-2),可获得晶粒细小、表面光亮的银镀层。
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As with series resonance, the greater the resistance in the circuit the lower the Q and, accordingly, the flatter and broader the resonance curve of either line current or circuit impedance.
黑色金属极易受到氧化或其他化学作用的侵蚀,因此必须用某种方式加以保护。一种常用的办法就是通过称为电镀的处理过程使金属表面覆上一层锌。
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We demonstrate a simple electrochemical method to synthesize red-colored colloidal gold aqueous suspension by using a two-electrode electrochemical system. This nanosynthetic system employs only cationic surfactants as the colloidal stabilizers and a small amount of acetone.
此项实验内容是以电解电镀的方式合成红色的奈米金悬浮溶液,除了亲自动手完成奈米材料的合成之外,实验过程亦可增加学生对於奈米科技更深一层的认识,同时可以利用讲解国二下第七章色光与颜色及增加学生对於胶体溶液的认识。
- 推荐网络例句
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This one mode pays close attention to network credence foundation of the businessman very much.
这一模式非常关注商人的网络信用基础。
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Cell morphology of bacterial ghost of Pasteurella multocida was observed by scanning electron microscopy and inactivation ratio was estimated by CFU analysi.
扫描电镜观察多杀性巴氏杆菌细菌幽灵和菌落形成单位评价遗传灭活率。
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There is no differences of cell proliferation vitality between labeled and unlabeled NSCs.
双标记神经干细胞的增殖、分化活力与未标记神经干细胞相比无改变。