电镀

The recent development of Cr deposition, especially hexavalent chromium electrdeposition was introduced.

摘要介绍了近年来电镀铬，特别是六价铬电镀的新发展。

The pore distribution in the direction of coating thickness was self-existent and could not join to intercommunicating pore.The pore diameter was very tiny so that it could prevent hydrotropic solution entering into the pore.

机械镀锌的形层过程既没有热镀锌那样的高温冶金反应，也没有电镀锌那样的电沉积效应，镀层是常温常压下利用化学吸附沉积和机械碰撞使金属锌粉在工件表面镶嵌堆积而成[1]，所以人们认为机械镀锌镀层的致密性要低于电镀和热镀锌镀层，但机械镀锌镀层又表现出良好的耐腐蚀性能。

From the characteristics and its harmfulness of electroplating sludge containing heavy metals,the state of innoxious disposal and recycle of electroplating sludge at home and abroad are reviewed in this paper.

从电镀重金属污泥的特点及其危害性谈起，综述了目前国内外电镀污泥的无害化处置和资源化利用的各种技术及研究进展。

Effects of water,low-concentration calcium lignosulphonate and nitric acid pretreatments on electrokinetic processes of electroplating sludge were investigated.

以风干电镀污泥为电动处理试验材料，水为阳极电解液，柠檬酸-柠檬酸铵缓冲液为阴极电解液，施加25 V直流电压条件下电动运行5 d，研究了水、低浓度木钙和硝酸等预处理对电镀污泥电动过程的影响。

The lab findings show, the no-blemish copper deposition can be realized through selective copper deposition in trench. In the process of electro-plating, via and crevice come into being due to the misproportion of the current density inside and outside the trench.

在电镀的条件下，凹槽电镀铜产生空洞和缝隙原因是凹槽内外电流密度分布不均匀，使凹槽内外镀层生长速度不一致，最终导致空洞和缝隙形成。

Which has substituted such traditional technologies as Zinc electroplating, Chromium electroplating, Zinc hot-dipping , Zinc hot spraying, phosphorize etc

取代了电镀锌、电镀镉、热浸锌、热喷锌、磷化等传统工艺技术

Electroplating mold complex shapes can be achieved punctate or linear electroplating.

电镀模具可做到复杂形状的点状或线状电镀。

By contrasting plating technologies,it was proved that sulfamate nickel plating technology can be performed at high current density and high speed.

通过电镀工艺对比，证实了氨基磺酸盐镀镍工艺可以实现大电流快速电镀。

In the study, nanocomposite Co/Al2O3 layers were fabricated by composite electrodeposition. Plating bath composition include cobalt sulfamate (CoSO4), cobalt chloride(CoCl2), boric acid(H3BO3), sodium chloride and nanosized Al2O3 powder with different volume concentration. Co ions and Al2O3 can codeposition of Cu substratum by DC current.

本研究以复合电镀方式制备Co/Al2O3复合镀层，所使用的电镀液内的成分有硫酸钴、氯化亚钴、氯化钠、硼酸，其中加入不同体积浓度的奈米级Al2O3粉末，使得Co离子和Al2O3粉末共沈积在Cu基材上而形成复合镀膜。

A kind of high speed sulphamate nickel-based electrolyte is chosen as basal electrolyte, the influences of plating process parameters on the micro-hardness of the nickel deposit have been studied by orthogonal experiments. It is concluded that the main influence factors on the micro-hardness of the nickel deposit are sulphamate concentration and electrolyte temperature, the deposition rate and quality in single-pulse mode are higher than that in DC power and double-pulse mode.

选择以氨磺酸型高速镀镍液作为基础镀液，通过正交试验研究了电镀工艺规范对镀层显微硬度的影响关系，试验结果表明：镀液主盐氨基磺酸镍浓度和镀液温度是影响镀层硬度的显著因素，单脉冲供电模式下的电镀沉积速率和镀层质量优于直流和双脉冲模式。

This one mode pays close attention to network credence foundation of the businessman very much.

这一模式非常关注商人的网络信用基础。

Cell morphology of bacterial ghost of Pasteurella multocida was observed by scanning electron microscopy and inactivation ratio was estimated by CFU analysi.

扫描电镜观察多杀性巴氏杆菌细菌幽灵和菌落形成单位评价遗传灭活率。