环氧树脂

Curing kinetics for two kinds of isomeric compound different proportion BPF-epoxy resin/MeTHPA/DMP-30 system is studied by means of differential scanning calorimetryand the extreme value method.

利用差示扫描量热法和极值法对两种同分异构体分布不同的双酚F环氧树脂/甲基四氢苯酐/DMP-30体系固化动力学进行了研究，求得了体系的固化动力学参数，并对同分异构体分布与固化特性之间的关系进行了初步讨论。

Using Maxwell equation, Stoke' s law and penetration wave and reflected wave basic theory, research compound materials particle size, proportion of mixture and preview length and others.

再取混合后的粉末，将三种不同重量比的混合粉末与环氧树脂依重量百分率浓度5 wt%、10 wt%、15 wt%和20 wt%混合均匀成四种浓度的试片。我们归纳发现复合材料在粒径变化、混合比例、试片长度等…。

The paper dealt with the epoxy composite with the properties of high strength and low condensity, which were prepared with epoxy resin, hollow glass beads , coupling agent, curing agent,plastizer and other additives.

其结果表明：偶联剂和增韧剂对复合材料的力学性能影响较大，中空玻璃微珠填充环氧树脂赋予其轻质、高强、价廉等特性

In this paper, the effects of hydroxy-terminated butadiene-acrylonitrile copolymer on the toughness of epoxy resin were investigated.

本文研究了端羟基丁腈橡胶对环氧树脂的增韧作用。

In order to satisfy the user's demands ,O –cresol Formaldehyde Epoxy Resin was successfully synthesized by using component solvent of toluene to substitute for MIBK.

为满足用户，在实验室成功地使用了甲苯代替MIBK生产邻甲酚醛环氧树脂。

Two major constituents in molding material, cresol epoxy resin and phenolformaldehyde resin, typically used in microelectronics packaging have been characterized by time of flight secondary ion mass spectrometry together with silver cationization technique.

用飞行时间二次离子质谱结合银离化的方法研究了集成电路封装中常用的环氧模塑料的两种主要成分：邻甲酚环氧树脂和线型酚醛树脂。

In this dissertation, we studied various ratio of reaction system of epoxide / cyanate/Co caprilate.

本文研究了不同配比的环氧树脂/氰酸酯/异辛酸钴固化反应体系的性能。

The influence of catalyst on the copolymerization of epoxy and cyanate was investigated,and the mechanism of their copolymerization was discussed.

摘 要 研究了催化剂对环氧树脂与氰酸酯树脂的共聚固化反应行为的影响，并初步探索氰酸酯/环氧固化的反应历程。

In this study novel materials based on epoxy and cyanate ester containing siloxane and imide groups were investiged.

在这本篇论文研究中，我们发展出新型含矽氧烷及亚醯胺基环氧树脂和氰酸酯化合物。

Curing process of the binary blends consisting of different amount of cyanate ester and epoxy resin was studied by the means of differential scanning calorimetry and Fourier transform infrared analysis.

采用DSC和FTIR研究了氰酸酯树脂/环氧树脂共混体系的固化行为，考察了环氧树腊含量对体系的固化动力学参数的影响。

This one mode pays close attention to network credence foundation of the businessman very much.

这一模式非常关注商人的网络信用基础。

Cell morphology of bacterial ghost of Pasteurella multocida was observed by scanning electron microscopy and inactivation ratio was estimated by CFU analysi.

扫描电镜观察多杀性巴氏杆菌细菌幽灵和菌落形成单位评价遗传灭活率。