焊的

The principles of selecting materials and the methods of reducing potential difference and contact resistance are...

指出提高焊机使用中的可靠性是确保产品焊接质量、延长焊机使用寿命的重要途径。

Advanced wave soldering, reflow soldering equipment and plug-ins, assembly production lines, and advanced computer testing equipment.

拥有先进的波峰焊、回流焊设备和插件、装配生产流水线，及先进的电脑测试设备。

SnPb eutectic solder reflow on BGA pad metallized with Au/Ni to form solder bump with induction self excite heat under alternate electromagnetic radiation is performed, and impacts of induction self excite heat and solid state aging on interfacial reaction between SnPb eutectic solder and Au/Ni metallization are investigated.

进行了交变电磁辐射下附Au/Ni镀层BGA焊盘上SnPb共晶钎料球感应自发热重熔形成钎料凸台的实验，并分析了感应自发热重熔以及固态老化对SnPb共晶钎料与Au/Ni镀层焊盘界面反应的影响。

The optimization design of solder ball is important content of the reliability research on it.

对焊点的优化设计是焊点可靠性研究的重要内容。

It is possible that shunt currents flowing through a previously made spot weld will take welding current away from the second second spot weld to be made.

有可能通过前一个完成焊点的分路电流将使电流远离将要操作的第二个焊点。

Has characteristics of spot weld controlling accurately, fine electrode following character, and is widely used in car fittings and so on mechanical parts, to multiple projection welding and spot welding of .

具有焊点控制精确，电极随动性好的特点，广泛应用在汽配等机械零部件的多点凸焊和点焊上。

The paper introduces the analysis of 500MW steam turbine low pressure cylinder clapboard s cracks and introduces the way to settle it.

对某发电厂500MW汽轮机低压缸40级隔板中分面出现的裂纹进行了分析，并介绍了处理情况，确定了正确合理的补焊方案及工艺，供铸铁件补焊修复缺陷时参考。

This paper help develop Steam locomotive repair plant in order to ensure the quality of design and manufacture of special breathing tube cutting and welding allwelder.

为了保证蒸汽机车厂修质量，设计制造了烟管切割与焊接专用的切焊机，阐述了切焊机的结构、工作原理及应用效果。

WEEE and RoHS was put out in 2003. In order to meet that ,the encapsulation of IC must adopt the technology of lead free. So that Epoxy molding compound must be no stibium and no halogen, and high reliability under the condition of high temperature.

2003年WEEE、RoHS法规的颁布，对于IC封装过程而言，在回流焊过程中要避免使用铅焊接，对于塑封料而言则要无卤无锑阻燃，且要满足较高回流温度条件的耐焊性考核。

WEEE and RoHS was put out in 2003. In order to meet the requirment of the WEEE and RoHs ,the encapsulation of IC must adopt the technology of lead free. Epoxy molding compound should be no stibium and no halogen, and have high reliability under the condition of high temperature.

2003年WEEE、RoHS法规的颁布，对于IC封装过程而言，在回流焊过程中要避免使用铅焊接，对于塑封料而言则要无卤无锑阻燃，且要满足较高回流温度条件的耐焊性考核。

Plunder melds and run with this jewel!

掠夺melds和运行与此宝石！

My dream is to be a crazy growing tree and extend at the edge between the city and the forest.

此刻，也许正是在通往天国的路上，我体验着这白色的晕旋。