焊点

Numerical and experimental methods were employed to investigate the effect of the spot pitch on the stress and strain distribution and the joint strength.

采用数值分析和试验研究方法考察了焊点间距对两种胶焊中应力应变分布和接头强度的影响。

In surface mounting technology,soldered joint data information is the basis of process automation in partial reflow soldering .

在表面组装技术中，焊点信息数据是实现部分再流焊过程自动化的基础。

Equivalent stress nearby the spot weld is greater other placeand there is obvious stress concentration.

由应力分布情况得出，在焊点附近的等效应力较大，存在明显的应力集中现象，同时由于折流缝焊的存在，增加了波面传热板强度。

Under strict quality control of CQC, kaina lead-free solder is used in high-purity refined tin and advanced smelting technology, a unique anti-oxidant formula alloy, its taphole amount is very small, bright solder joints, reliable, good wetting, it is suitable in lead-free wave soldering and hot dip soldering

在CQC严密的质量监控下，凯纳无铅焊锡条采用高纯度精锡及先进的熔炼工艺，独特的抗氧化合金配方，其出渣量极少，焊点光亮、可靠，湿润性好，适用于无铅波峰焊和热浸焊。本企业供应58℃～145℃不同熔点温度的无铅低温焊锡条。

Compared with methods appeared in literatures, our algorithm, with high accuracy, sensitivity and correctness, complete adaptively the correct distinction between interferential fringes and backgrounds. In chapter four, methods for the computer operatable description of line and region features are discussed, which contains: Computation curve's curvature in quantity, Fringes' separation distance , Contour's smoothness of region, Similarity of varied curves.

在第三章中，本文研究的是以线条为直接目标的图象分割方法——条纹抽取，在研究分析了许多条纹抽取方法以后，针对激光全息焊点缺陷检测这一课题中的复杂数字光学图象LHII条纹抽取进行了多方面的研究，主要有：分别从点对应、邻域特性对应推导并提出了几个信息分离算法；结合光学图象形成方面的知识，提出了变周期余弦分割二值化方法；结合当前条纹走向、毗邻条纹走向及可靠条纹点约束条纹跟踪，在许多方面，改进并发展了常规的条纹跟踪算法，实现了无人-机交互的全自动条纹跟踪抽取。

The solder will be dull looking and, if the gold content in the solder exceeds about 5%, the solder joint will be brittle.

焊点外观将变得暗淡，此外，如果焊料中的金成分超过约5%时，焊点将会变脆。

Quality of flux must be able to remove the oxide layer PCB board, the welding of metal to maintain clean and moist to achieve good spot.

品质优良的助焊剂必须能除去PCB 板上的氧化层，保持金属焊接面清洁及湿润以达到优良的焊点。

A gap between the substrate and the electronic component is then filled with flux fill, and the electrode terminals of the substrate and the electronic component are bonded by reflowing the solder bumps.

然后，利用焊剂填充物来填充所述基板与所述电子组件之间的间隙，并且通过使所述焊点回流来接合所述基板的所述电极端子和所述电子组件的所述电极端子。

The continuing drive towards smaller ball pith and ball size in one end and larger die size on the other end is pushing reliability limits to an extreme, a reliability more and more not achievable without the use of a stress buffer redistribution layer.

在焊点间距和焊球尺寸进一步微型化、芯片面积进一步增大趋势的推动下，器件的可靠性也正在被推向尽头。以致不采用应力缓冲再分布层就越来越难以保障可靠性的实现。

For now check out the problem of pin VGA to VGA plug down to find the corresponding spot on the board PCB, found in open, re-repair welding on it.

对于检查出中现问题的VGA针脚，可以顺着VGA插头找到PCB板上的对应焊点，发现断路，重新补焊就可以了。

On the other hand, the more important thing is because the urban housing is a kind of heterogeneity products.

另一方面，更重要的是由于城市住房是一种异质性产品。

Climate histogram is the fall that collects place measure calm value, cent serves as cross axle for a few equal interval, the area that the frequency that the value appears according to place is accumulated and becomes will be determined inside each interval, discharge the graph that rise with post, also be called histogram.

气候直方图是将所收集的降水量测定值，分为几个相等的区间作为横轴，并将各区间内所测定值依所出现的次数累积而成的面积，用柱子排起来的图形，也叫做柱状图。