涂层

Tool's abrasion and dilapidation mechanism of dry milling high-strength steel were investigated.

采用硬质合金刀片和涂层刀片进行了高强度钢的干铣削试验研究；根据这两种刀片在不同切削用量条件下的磨破损情况，利用扫描电镜和能谱分析的结果，分析了这两种刀片的磨破损机理。

Based on these, the method for analysing the thermal-mechanical problems during the film depositon is proposed, and some mechanical problems are studied which include the asympototic analysis of the stress and deformation in a nonhomogeneous material layer on a substrate and the weight function method for interface crack problems as well as the mechanics of an interface toughening induced by the dilatant transformation.

本文对这些方面的研究及其成果进行了较全面的评述，并在考察了一个薄膜-基底系统（等离子喷涂ZrO〓陶瓷涂层的工艺研究）的生产研究的全过程的基础上，对薄膜沉积过程中的热-力学分析方法和包括表面异质层中应力变形的渐近分析方法、界面裂纹问题中的权函数方法、相变引起的界面增韧的力学分析方法等在内的一些薄膜-界面-基底系统的力学问题进行了研究。

With the electrical connections at the top and bottom side of the wafer-level IC packaging Lead-frame structure and composition of the surface-mount semiconductor package structure Multi-layer printed circuit board Antifuse and its formation method and with the anti-fuse non-volatile memory device unit cell Tandem electric signal processing circuit and electronic device Light-emitting diode packaging structure and encapsulation method Electronic Packaging Structure Flip-chip high-speed optoelectronic components and structure Pairs of piezoelectric friction side by side to promote the three-step device and scanning probe microscope Light-emitting diode and its manufacturing method, the production base of light-emitting diode method Three or four parallel advance of stepping piezoelectric device and scanning probe microscope lens body Silicon substrate and its manufacturing method Semiconductor device and voltage-divider A polysilicon layer and the microcrystalline silicon layer of the double-substrate active layer structure, methods and devices The edge of the thickness of silicon controlled Of a lateral semiconductor devices and high-voltage devices With a vertical-channel transistors semiconductor device Of a memory array and for the manufacture of a memory array method Read-only memory cell array structure Active-matrix substrate and display device High-voltage semiconductor integrated circuit devices, dielectric isolated type semiconductor device Image sensing devices Lens module and its manufacturing methods Solid-state imaging device and camera Injection angle for the trench isolation Organic Light-Emitting Display Device Organic light-emitting display device Bipolar transistor structure of the surface passivation Double-triggered silicon-controlled rectifier HFET Metal-oxide semiconductor transistors Self-aligned trench accumulation mode field effect transistor structure Thin-film transistors and Display Devices TFT Lead Diode Low-frequency, low noise, low-flashing diode Used for thin-film solar cells trap light structure Transparent sun solar cells Quaternary semiconductor heterojunction photovoltaic cells heat Si nano-pillar array heterojunction thin-film solar cells GaN-based micro-composite solar cells isotope Optical sensor Semiconductor by optical components Imaging Detector Transparent conductive oxide coating Silicon-based high-performance dual-junction solar cells Thin-film solar cells Alien LED Devices

非专业，不在行，求高手帮忙。谢谢！具有顶部及底部侧电连接的晶片级集成电路封装导线架结构及其构成的表面黏着型半导体封装结构多层印刷电路板反熔丝及其形成方法和具有该反熔丝的非易失性存储器件的单位单元串联用电式信号处理电路及电子装置发光二极管的封装结构及其封装方法电子封装结构高速光电组件及其芯片倒装结构双压电体并排推动的三摩擦力步进器与扫描探针显微镜发光二极管及其制作方法、发光二极管的底座的制作方法三或四压电体并行推进的步进器及其扫描探针显微镜镜体硅衬底及其制造方法半导体装置与分压电路具多晶硅层及微晶硅层的双底材主动层结构、方法及装置硅晶片的受控边缘厚度一种半导体横向器件和高压器件具有垂直沟道晶体管的半导体器件一种记忆体阵列及其用于制造一记忆体阵列的方法只读内存单元阵列结构有源矩阵基板和显示装置高耐压半导体集成电路装置、电介质分离型半导体装置图像感测装置透镜模块及其制造方法固态成像装置和照相机用于沟道隔离的斜角注入有机电致发光显示装置有机发光显示装置双极晶体管的表面钝化结构双触发型可控硅整流器异质结场效应晶体管金属氧化物半导体晶体管自对准沟槽累加模式场效应晶体管结构薄膜晶体管及显示器件薄膜晶体管无铅二极管低频、低噪音、低闪烁的二极管用于薄膜太阳电池的陷光结构透明遮阳太阳能电池片四元半导体的异质结热光伏电池硅基纳米柱阵列异质结薄膜太阳能电池氮化镓太阳能同位素复合型微电池光学传感器半导体受光元件成像探测器透明导电氧化物涂层硅基高效双结太阳能电池薄膜太阳能电池异形LED器件

A In direct thermal printing an image is created within the heat sensitive surface coating on the label.

什么是热敏打印？一个在直接热敏打印的图像在创建标签上的热敏感的表面涂层。

The theoretical solution of a concentrated force acting on the free surface of coating materials with two same thickness layers has been deduced by introducing mirror point method and Dirichlet uniqueness theorem.

利用镜像点法和Dirichlet等值性原理，本文推导了等厚双层薄膜涂层材料受表面集中力作用的平面问题理论解。

A porous lanthanum-doped hydroxyapatite coating on commercially pure titanium was prepared by micro-arc oxidation in electrolytic solution containing calcium acetate,β-glycerol phosphate disodium salt pentahydrate and lanthanum nitrate.

采用微弧氧化法在含有乙酸钙、β-甘油磷酸钙、硝酸镧的电解液中在纯钛金属表面原位生成了多孔含La羟基磷灰石的生物涂层。

The nano- grains with an average size of 46 nm were homogenously dispersed in an amorphous phase matrix .

结果表明：涂层的组织主要由非晶相和α相纳米晶组成；平均尺寸为46nm的α相纳米晶均匀分布于非晶基体内。

This option is a control package to automatically maintain paste level behind each doctor blade at constant preset levels.

这个选项是自动保持每个刀片后面的涂层厚度在一个预设的水平上的一个控制包。

A stainless steel back dam and two nylon side dams contain the paste upstream of the doctor blade.

一个不锈钢回坝和两个尼龙的边坝包含了刀片上游的涂层。

Electrical oscillations in a metallic "sending coil" radiate inductive photons toward one or more "energy-magnifying coils" comprised of a photoconductor or doped semiconductor coating a metallic conductor, or comprised of a superconductor.

电气振荡的一个金属"发送线圈"辐射感应光子对一个或一个以上的"能源-放大镜线圈"组成的一个光导体或掺杂半导体涂层的金属导体，或组成的超导。

The basic concept of FOP can be summarized as to further optimize effective prescription according to the standard of curative effects and with the aid of modern science and technology and theories of traditional Chinese medicine.

其基本内涵可概括为：以确有疗效的中药复方为研究对象，以现代科学技术和传统中医药理论为技术支持，以该复方所治病证的药效响应为评价标准，以优化重组疗效更优的新复方为研究目的。

Ever since our world has been a world, native forests have been indiscriminately exploited by man.

自从我们的世界一直是世界原生森林被任意剥削人。