测高

The participants differentiate the bigger change of the contour map more correct by using the complete and stereo image.

全像立体影像对於变化愈大的等高线图，在辅助受测者判读的正确率上显著性越高。

And an evaluating method for coplanarity is adopted,which is based on least condition principle.

提出一种基于激光跟踪原理对空间点的坐标进行测量，采用"最小条件"法为基础的共面性评价方法，实现了对由多个非连续铅垂面形成大平面的平面度的高精度测量，实际测得共面度为0。

From the results of simulated and measured data, the higher drive current is presented and is due to strain-induced high mobility.

从模拟与量测的数据所呈现高的驱动电流是由於施加应力所引起电子迁移率增加。

The isogram of thickness and grade of the orebody suggests that theconnection line of the mineral concentration area is coinciding with thepitch direction of the orebody; and the appearing rate ofα—βpeak ofquartz decrepitation temperature has a distribution regulation, whichchanges from high to low with the depth of the orebody. This regulationsuggests that the deposit bellow the 180m bears a good prospectingperspective.

通过编制矿体厚度、品位等值线图，发现金矿化富集部位的连线同矿体的侧伏方向一致；研究发现石英矿物爆裂法测温的α—β相转变峰的出现率在矿体中具有一定的分布规律，从矿体浅部到深部α—β相转变峰出现率由高到低变化，据此规律预测矿床180m中段以下深部还具有很好的找矿前景。

Under such a condition, the division of finite dement grid is convenient and the forward and inverse operation is easy.

目前，激电数据的二维反演主要针对高密度激电数据，而对于常规的激电测深则很少涉及。

A novel amplitude sensitive optical heterodyne polarimeter with sourse of a Zeeman laser was setup. The aim was to measure the optical activity of a Quartz Cornu Depolarizer, OCD, and Twisted-Nematic Liquid Crystal, TN-LC, at high accuracy and of aqueous humor in rabbit, in vivo, compared with the test of the concentration of blood sugar, in vitro.

本实验利用极化光共路径光学外差干涉方式架设极化仪；此种光学架构特性在於其结构简单，光学外差共光路特性加上采用参考光得以大幅度的降低雷射以及环境所造成的杂讯，进而得到准确且高灵敏度的旋光性量测结果。

On the base of the single-diameter laser-scanned measuring technology, a double direction laser-scanned measuring system is presented. Which combinate the laser-scanned measuring technology with special optical system. In the system, the collimation semiconductor laser-scanned beam scanning two perpendiculars direct of one plane of the measured workpiece at the same time is made. The beams with the dimension information of two perpendiculars direct are processed by the scanning receive system, the high-speed photoelectric transition and electronic data process. Two measured results of the diametric directs and ellipse tolerance,etc, parameter, of the turning workpiece on the same plane are obtained by non-contact automatic measurement. The problem of non-contact measurement of two perpendiculars direct of one plane of turning workpiece is settled. It processes many peculiarities, such as high speed, high accuracy and non-contact automatic measurement, etc.

在单向激光扫描检测技术的基础之上，提出了一种双向激光扫描检测系统，其采用激光扫描检测技术与特殊光学系统相结合，用准直半导体激光扫描光束对被测工件径向某一截面的两个相互垂直方向同时扫描，经扫描接收光学系统、高速光电变换、电子学系统和微机数据处理系统，对将携带有垂直方向被测量信息的光束进行处理，实现了回转体工件同一截面两个垂直方向的径向尺寸和椭圆度等参数的非接触自动测量，解决了同时非接触测量回转体零件同一截面两个径向尺寸的难题，它具有高速，高精度和非接触自动测量等特点。

In the system , the collimation semiconductor laser - scanned beam scanning two perpendiculars direct of one plane of the measured workpiece at the same time is made . the beams with the dimension information of two perpendiculars direct are processed by the scanning receive system , the high - speed photoelectric transition and electronic data process . two measured results of the diametric directs and ellipse tolerance , etc , parameter , of the turning workpiece on the same plane are obtained by non - contact automatic measurement

在单向激光扫描检测技术的基础之上，提出了一种双向激光扫描检测系统，其采用激光扫描检测技术与特殊光学系统相结合，用准直半导体激光扫描光束对被测工件径向某一截面的两个相互垂直方向同时扫描，经扫描接收光学系统、高速光电变换、电子学系统和微机数据处理系统，对将携带有垂直方向被测量信息的光束进行处理，实现了回转体工件同一截面两个垂直方向的径向尺寸和椭圆度等参数的非接触自动测量，解决了同时非接触测量回转体零件同一截面两个径向尺寸的难题，它具有高速，高精度和非接触自动测量等特点。

With the electrical connections at the top and bottom side of the wafer-level IC packaging Lead-frame structure and composition of the surface-mount semiconductor package structure Multi-layer printed circuit board Antifuse and its formation method and with the anti-fuse non-volatile memory device unit cell Tandem electric signal processing circuit and electronic device Light-emitting diode packaging structure and encapsulation method Electronic Packaging Structure Flip-chip high-speed optoelectronic components and structure Pairs of piezoelectric friction side by side to promote the three-step device and scanning probe microscope Light-emitting diode and its manufacturing method, the production base of light-emitting diode method Three or four parallel advance of stepping piezoelectric device and scanning probe microscope lens body Silicon substrate and its manufacturing method Semiconductor device and voltage-divider A polysilicon layer and the microcrystalline silicon layer of the double-substrate active layer structure, methods and devices The edge of the thickness of silicon controlled Of a lateral semiconductor devices and high-voltage devices With a vertical-channel transistors semiconductor device Of a memory array and for the manufacture of a memory array method Read-only memory cell array structure Active-matrix substrate and display device High-voltage semiconductor integrated circuit devices, dielectric isolated type semiconductor device Image sensing devices Lens module and its manufacturing methods Solid-state imaging device and camera Injection angle for the trench isolation Organic Light-Emitting Display Device Organic light-emitting display device Bipolar transistor structure of the surface passivation Double-triggered silicon-controlled rectifier HFET Metal-oxide semiconductor transistors Self-aligned trench accumulation mode field effect transistor structure Thin-film transistors and Display Devices TFT Lead Diode Low-frequency, low noise, low-flashing diode Used for thin-film solar cells trap light structure Transparent sun solar cells Quaternary semiconductor heterojunction photovoltaic cells heat Si nano-pillar array heterojunction thin-film solar cells GaN-based micro-composite solar cells isotope Optical sensor Semiconductor by optical components Imaging Detector Transparent conductive oxide coating Silicon-based high-performance dual-junction solar cells Thin-film solar cells Alien LED Devices

非专业，不在行，求高手帮忙。谢谢！具有顶部及底部侧电连接的晶片级集成电路封装导线架结构及其构成的表面黏着型半导体封装结构多层印刷电路板反熔丝及其形成方法和具有该反熔丝的非易失性存储器件的单位单元串联用电式信号处理电路及电子装置发光二极管的封装结构及其封装方法电子封装结构高速光电组件及其芯片倒装结构双压电体并排推动的三摩擦力步进器与扫描探针显微镜发光二极管及其制作方法、发光二极管的底座的制作方法三或四压电体并行推进的步进器及其扫描探针显微镜镜体硅衬底及其制造方法半导体装置与分压电路具多晶硅层及微晶硅层的双底材主动层结构、方法及装置硅晶片的受控边缘厚度一种半导体横向器件和高压器件具有垂直沟道晶体管的半导体器件一种记忆体阵列及其用于制造一记忆体阵列的方法只读内存单元阵列结构有源矩阵基板和显示装置高耐压半导体集成电路装置、电介质分离型半导体装置图像感测装置透镜模块及其制造方法固态成像装置和照相机用于沟道隔离的斜角注入有机电致发光显示装置有机发光显示装置双极晶体管的表面钝化结构双触发型可控硅整流器异质结场效应晶体管金属氧化物半导体晶体管自对准沟槽累加模式场效应晶体管结构薄膜晶体管及显示器件薄膜晶体管无铅二极管低频、低噪音、低闪烁的二极管用于薄膜太阳电池的陷光结构透明遮阳太阳能电池片四元半导体的异质结热光伏电池硅基纳米柱阵列异质结薄膜太阳能电池氮化镓太阳能同位素复合型微电池光学传感器半导体受光元件成像探测器透明导电氧化物涂层硅基高效双结太阳能电池薄膜太阳能电池异形LED器件

The experiments prove that this optical structure can be used to measure the longitudinal displacement, which can arrive at a high accuracy.

实验表明，该光路结构能有效实现被测物的离面位移测量，并可获得高的测量精度。

Breath, muscle contraction of the buttocks; arch body, as far as possible to hold his head, right leg straight towards the ceiling (peg-leg knee in order to avoid muscle tension).

呼气，收缩臀部肌肉；拱起身体，尽量抬起头来，右腿伸直朝向天花板（膝微屈，以避免肌肉紧张）。

The cost of moving grain food products was unchanged from May, but year over year are up 8%.

粮食产品的运输费用与5月份相比没有变化，但却比去年同期高8％。