氮化的

Some factors affecting the result of removal of ammonium and phosphate, such as pH, molar ratio, reaction time,stirring speed,precipitation time were discussed.

研究了pH值、反应物摩尔比、搅拌速度、反应时间、陈化时间等因素对磷酸盐去除效果和氨氮残留量的影响。

Leading products for a wide range of uses of sodium azide.

主导产品为用途广泛的叠氮化钠。

BARIUM AZIDE, WETTED with notless than 50% water, by mass

叠氮化钡，湿的，按重量含水不低于

You must know how to CURE A SLICE OR A HOOK , how to PREVENT A REVERSE WEIGHT SHIFT , how to G AIN HEIGHT and ACHIEVE BACKSPIN.

你必须知道如何治理一片或一个钩子，如何防止反向重量转移，如何与g 氮化铝的高度和实现逆向。

Then we used boron nitride as additive of lube after surface modification.

将合成的纳米氮化硼材料进行了表面改性，然后作为润滑油添加剂，并用该润滑油进行了摩擦磨损实验研究。

Using first-principles method, we have studied the structure transition of two-dimensional hexagonal boron nitride under large uniaxial strain.

采用第一性原理计算我们研究了二维六角氮化硼（2D h-BN）在单向大应变下的结构变化。

By taking diamond and cubic boron nitride as model compounds, this paper presents a systematic description on applications of high-pressure technique in inorganic synthesis.

本文以金刚石、立方氮化硼和一些典型化合物为例，系统地介绍了高压技术在无机合成中的应用。

Energy dispersive spectrometer shows that TiN are uniformly dispersed in cordierite matrix.

能谱分析表明：复合粉体中的氮化钛分布均匀。

Moreover,quickly cooling process facilitates the ｛300｝ and ｛220｝ crystal planes of Sm_2Fe_(17) phase to...

氮化后Sm2Fe17晶格膨胀形成Sm2Fe17Nx主相，而-αFe的X射线特征峰未见明显移动。

With the electrical connections at the top and bottom side of the wafer-level IC packaging Lead-frame structure and composition of the surface-mount semiconductor package structure Multi-layer printed circuit board Antifuse and its formation method and with the anti-fuse non-volatile memory device unit cell Tandem electric signal processing circuit and electronic device Light-emitting diode packaging structure and encapsulation method Electronic Packaging Structure Flip-chip high-speed optoelectronic components and structure Pairs of piezoelectric friction side by side to promote the three-step device and scanning probe microscope Light-emitting diode and its manufacturing method, the production base of light-emitting diode method Three or four parallel advance of stepping piezoelectric device and scanning probe microscope lens body Silicon substrate and its manufacturing method Semiconductor device and voltage-divider A polysilicon layer and the microcrystalline silicon layer of the double-substrate active layer structure, methods and devices The edge of the thickness of silicon controlled Of a lateral semiconductor devices and high-voltage devices With a vertical-channel transistors semiconductor device Of a memory array and for the manufacture of a memory array method Read-only memory cell array structure Active-matrix substrate and display device High-voltage semiconductor integrated circuit devices, dielectric isolated type semiconductor device Image sensing devices Lens module and its manufacturing methods Solid-state imaging device and camera Injection angle for the trench isolation Organic Light-Emitting Display Device Organic light-emitting display device Bipolar transistor structure of the surface passivation Double-triggered silicon-controlled rectifier HFET Metal-oxide semiconductor transistors Self-aligned trench accumulation mode field effect transistor structure Thin-film transistors and Display Devices TFT Lead Diode Low-frequency, low noise, low-flashing diode Used for thin-film solar cells trap light structure Transparent sun solar cells Quaternary semiconductor heterojunction photovoltaic cells heat Si nano-pillar array heterojunction thin-film solar cells GaN-based micro-composite solar cells isotope Optical sensor Semiconductor by optical components Imaging Detector Transparent conductive oxide coating Silicon-based high-performance dual-junction solar cells Thin-film solar cells Alien LED Devices

非专业，不在行，求高手帮忙。谢谢！具有顶部及底部侧电连接的晶片级集成电路封装导线架结构及其构成的表面黏着型半导体封装结构多层印刷电路板反熔丝及其形成方法和具有该反熔丝的非易失性存储器件的单位单元串联用电式信号处理电路及电子装置发光二极管的封装结构及其封装方法电子封装结构高速光电组件及其芯片倒装结构双压电体并排推动的三摩擦力步进器与扫描探针显微镜发光二极管及其制作方法、发光二极管的底座的制作方法三或四压电体并行推进的步进器及其扫描探针显微镜镜体硅衬底及其制造方法半导体装置与分压电路具多晶硅层及微晶硅层的双底材主动层结构、方法及装置硅晶片的受控边缘厚度一种半导体横向器件和高压器件具有垂直沟道晶体管的半导体器件一种记忆体阵列及其用于制造一记忆体阵列的方法只读内存单元阵列结构有源矩阵基板和显示装置高耐压半导体集成电路装置、电介质分离型半导体装置图像感测装置透镜模块及其制造方法固态成像装置和照相机用于沟道隔离的斜角注入有机电致发光显示装置有机发光显示装置双极晶体管的表面钝化结构双触发型可控硅整流器异质结场效应晶体管金属氧化物半导体晶体管自对准沟槽累加模式场效应晶体管结构薄膜晶体管及显示器件薄膜晶体管无铅二极管低频、低噪音、低闪烁的二极管用于薄膜太阳电池的陷光结构透明遮阳太阳能电池片四元半导体的异质结热光伏电池硅基纳米柱阵列异质结薄膜太阳能电池氮化镓太阳能同位素复合型微电池光学传感器半导体受光元件成像探测器透明导电氧化物涂层硅基高效双结太阳能电池薄膜太阳能电池异形LED器件

Do you know, i need you to come back

你知道吗，我需要你回来

Yang yinshu、Wang xiangsheng、Li decang,The first discovery of haemaphysalis conicinna.

1〕 杨银书，王祥生，李德昌。安徽省首次发现嗜群血蜱。