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It is suitable to be used as filling material for oxygen-acetylene gas welding and carbon arc welding, and also for manual braze welding. It is the ideal material for welding of copper alloy, copper, gray cast iron and hard alloy knife and etc.

HS221 JIS ZYCusN 适用于氧-乙炔气焊及碳弧焊时作为填充材料,也可用于钎焊,是铜合金、钢、灰铸铁及硬质合金刀具等焊接材料中较为理想的焊接材料

In experimental education process, add through revealing model of in kind of oral cavity stuff to reach with multimedia realia, encourage a student inchoate contact is clinical, begin what content abounds to read books and newspaper to accuse, be helpful for enhancing education figure sex, help student understands the clinical application of material, develop student learning activity, raise oral cavity material to learn experimental education result thereby.

在实验教学过程中,通过展示口腔材料实物模型及加用多媒体教具,鼓励学生早期接触临床,开展内容丰富的读书报告,有利于增强教学形象性,帮助学生理解材料的临床应用,发挥学生学习能动性,从而提高口腔材料学实验教学效果。

Radar absorbing materials is the rapidest developing materials in stealth materials. It can reduce the possibility of being found by radar because it can minish the radar cross section of theaircrafts, missiles, naval ships and tanks.

雷达吸波材料是隐身材料中发展最快应用最为广泛的材料,它可以减小飞机、导弹、舰艇或坦克装甲车辆的雷达散射截面,从而降低被雷达发现的可能性。

CV indicated that the HOMO of DP1 is higher than that of DP2, which is resulted from the special effects of the pyrenes at C9 of the fluorene moieties, and the PL spectra of the two materials showed bright blue emission.

器件ITO/TCTA(8nm)/DP1 or DP2(30nm)/BCP(40nm)/Mg∶Ag都发出蓝光,但以DP1为发光材料的器件的性能远高于以DP2为发光材料的器件的性能,直流电压-电流曲线显示材料DP1有比DP2更高的载流子迁移率,芴9位的芘是造成这种结果的关键原因,并对这种原因进行了探讨。

With the surface treatment technology and material processing technology improve, there will the introduction of new cylinder plunger with the pump materials and surface treatment processes, then pay particular attention to the plunger and pump cylinder Optimal Matching Materials.

随着表面处理技术和材料加工工艺的提高,不断会推出新的柱塞与泵筒的材料和表面处理工艺,这时尤其要注意柱塞和泵筒的材料的优化匹配。

Super absorbent and poromeric compounded web nonwovens is made of hydro-entanglement specially polyesters and high absorbent and super white viscoses.

高吸湿高透气复合网新型水刺卫生材料由水刺专用涤纶和高湿模量增白粘胶纤维两种纤维混合制成,介绍了新材料的原料、工艺和新材料的特点以及用途。

AIDA sales in Japan of high-speed punch punch DOBBY full high-speed punch, punch surrounding equipment, materials leveling machine for heavy material plane terminal plane closed feeder feeder feeder wheel light aircraft NC roller feeder Materials Rack and leveling plate straightening machine rivet machine Machine desktop computer 3T 5T precision punch die point detection under the mold protection device microcomputer photoelectric hand smoke machine horizontal light control waste collection feeder surrounding equipment such as punch!

销售日本AIDA冲床 DOBBY高速冲床通力高速冲床,冲床周边设备,材料整平机重型材料架端子收料机平面送料机滚轮送料机轻型材料架 NC滚轮送料机料架兼整平机厚板矫正机铆钉机桌上型精密冲床3T 5T 电脑下死点检出微电脑模具保护装置光电护手吸废料机卧式光控收料机等冲床周边设备!

In order to fabricate high–silicon aluminum alloy electronic packaging materials, the oxidating processes in high temperature oxygenation was applied to the Al-30Si and Al-40Si high-silicon aluminum alloys which were prepared through extrusion process. Scanning electron microscope, optical microscopy, thermal physical tester and universal material testing machine were used to study the microstructure, density, hermeticity, coefficient of thermal expansion, thermal conductivity and compressive strength.

摘 要:针对应用广泛的高硅铝合金电子封装材料,采用高温充氧氧化工艺,对已挤压成形的Al-30Si及Al-40Si高硅铝合金材料进行后续处理,通过扫描电镜、金相显微镜、热物性测试仪及电子万能拉伸试验机等,对材料显微组织、密度、气密性、热膨胀系数、热导率及抗压强度进行了分析比较。

In order to fabricate high–silicon aluminum alloy electronic packaging materials,the oxidating processes in high temperature oxygenation was applied to the Al-30Si and Al-40Si high-silicon aluminum alloy s which were prepared through extrusion process.

针对应用广泛的高硅铝合金电子封装材料,采用高温充氧氧化工艺,对已挤压成形的Al-30Si及Al-40Si 高硅铝合金材料进行后续处理,通过扫描电镜、金相显微镜、热物性测试仪及电子万能拉伸试验机等,对材料显微组织、密度、气密性、热膨胀系数、热导率及抗压强度进行了分析比较。

In order to fabricate high–silicon aluminum alloy electronic packaging materials,the oxidating processes in high temperature oxygenation was applied to the Al-30Si and Al-40Si high-silicon aluminum alloys which were prepared through extrusion process.

针对应用广泛的高硅铝合金电子封装材料,采用高温充氧氧化工艺,对已挤压成形的Al-30Si及Al-40Si高硅铝合金材料进行后续处理,通过扫描电镜、金相显微镜、热物性测试仪及电子万能拉伸试验机等,对材料显微组织、密度、气密性、热膨胀系数、热导率及抗压强度进行了分析比较。

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