未电镀的

Lead true Coplanarity, Spacing, offset, Skew and Standoff, Missing, Broken, Twisted, or Un-plated Leads.

引线正确共面，间隔，偏移量，歪斜的，缺少的，断掉的，扭曲，未电镀引线

Heat-sink and Package datum, Pad Spacing, Gap, Length, Width, Spread, Tweeze, Missing, Broken or Un-plated Pad.

吸热和封装数据，衬垫间距，裂口，长度，宽度，伸展，镊子除去，缺少的，断掉的，未电镀引线。

Lead Spacing, Offset, Tweeze, Spread, Lead Extension, Skew, Gap, Width and Sweep, Missing, Broken, Twisted or Un-plated Leads.

引线间隔，偏移量， Tweeze，伸展，引线延长，歪斜，裂口，宽度，扫描，缺少的，断掉的，扭曲，未电镀引线

Lead Spacing, Offset, Tweeze, Spread, Lead Extension, Skew, Gap, Width and Sweep, Missing, Broken, Twisted or Un-plated Leads.3 v!

引线间隔，偏移量， Tweeze，伸展，引线延长，歪斜，裂口，宽度，扫描，缺少的，断掉的，扭曲，未电镀引线

Bottom Pad Inspection底部衬垫检查 Heat-sink and Package datum, Pad Spacing, Gap, Length, Width, Spread, Tweeze, Missing, Broken or Un-plated Pad.

吸热和封装数据，衬垫间距，裂口，长度，宽度，伸展，镊子除去，缺少的，断掉的，未电镀引线。

To identify the non-uniform coating in a carbon fiber tow can be overcome by the pneumatic spreading process; two groups of spread and unspread carbon fiber tow coated with nickel by electroless plating were compared.

为了证明藉由气体展开制程可克服碳纤维纱束不均匀镀层的结果，将碳纤维纱束分为展开与未展开两组，比较无电镀镍后的结果。

Different surface treatments were taken on round gold surface, including no treatment, 50μm Al_2O_3 sand blasting, 110μm Al_2O_3 sand blasting, gold bonder applying after 50μm Al_2O_3 sand blasting, gold bonder applying after 110μm Al_2O_3 sand blasting, and the same nine Ni-Cr alloys were cast as contrast, the gold copings and Ni-Cr alloys were both received two layers of opaque and two layers of body porcelain. Shear tests were performed in a universal testing machine. After loading the sections were examined by SEM and EDS analysis.

第一部分金沉积基底不同表面处理对金瓷剪切强度的影响材料与方法：制作直径4.0 mm，高度为8.0 mm的圆柱形Ni-Cr合金试件45个，表面电镀形成金沉积帽状基底，随机平均分成5组，分别为表面未处理组、50μm、110μm Al_2O_3喷砂组、50μm Al_2O_3喷砂+金黏结剂组、110μm Al_2O_3喷砂+金黏结剂组；另铸造同样规格的Ni-Cr合金试件9个，作为对照。

This one mode pays close attention to network credence foundation of the businessman very much.

这一模式非常关注商人的网络信用基础。

Cell morphology of bacterial ghost of Pasteurella multocida was observed by scanning electron microscopy and inactivation ratio was estimated by CFU analysi.

扫描电镜观察多杀性巴氏杆菌细菌幽灵和菌落形成单位评价遗传灭活率。