晶片

Provide test and measurement solutions for device characterization and monitoring semiconductor wafer processing, including DC to RF Automated Parametric Test systems, Wafer Level Reliability systems, and I-V/C-V test systems.

我们的产品可用于半导体特性分析、参数测试、半导体晶片生产工艺监控，覆盖从DC到RF的自动参数测试系统，晶片可靠性系统和I-V/C-V测试系统。

The purpose of this thesis is to design a CMOS Image Sensor which can reduce the area of post-processing buffer memory, caused by pixel output order of raster scan and processing sequence of block-based image processing system does not match, to reduce cost and power consumption.

本论文的目的是设计一局部扫瞄式影像感测晶片，此晶片可以节省因为光栅式扫瞄的像素输出顺序与区块化影像处理系统的处理顺序不匹配而造成的后处理缓冲记忆体面积，以达到减少成本开销与降低功率消耗。

In this thesis, we present design and verification of the multimedia SoC platform. The platform design integrates the system bus, microprocessor, memory controller, peripheral I/O, 16-bit reverberator, 24-bit DSP, etc.

本论文中的多媒体系统晶片平台提出了一个FPGA的设计与验证方法，系统晶片设计部分包含了系统汇流排、微处理控制器、周边数位I/O、16位元空间回响器、及24位元适用於音讯系统之数位讯号处理器等。

In the result, there are two optimum orientations of optic axis with respect to the plate surface.

由此给出光轴相对晶片表面的两个优化取向，对石英晶片它们分别为18.712°和59.922°。

Because the TaAl alloy can't stand the high temperature (630℃) of thermal fusion bonding, this study carries out a low temperature (180℃) bonding method. The device fabricates successfully by using PDMS as the intermediate layer between two substrates.

在晶片制作过程中，因铝化钽合金无法承受热融合接合时的高温(约630℃)，然研究发现采用聚二甲基矽氧烷为中间层时，可成功於低温(约180℃)条件接合并制作出所需晶片。

Then, the Tyramine 4-(2-Aminoethylphenol-modified CdSe NPs that have positive charged amino groups on the particle surface are assembled onto Au NPs.

将黏有TMSPED的矽晶片浸泡在含有金奈米粒子的水溶液中，TMSPED的正电会吸引金奈米粒子表面的正电，进而将金奈米粒子黏在晶片上。

In this paper,based on phased array transducer,we excite one element of array and incept reflection by the others.Then we study the change rule of wave reflection groups of camber and plane.

模拟相控阵阵列探头，利用单个晶片依次激发、所有晶片接收的方法，研究平面和弧面反射波组的变化规律。

Thus, the secondary edge reflector heats the edge and reduces thermal gradients across the susceptor and the semiconductor wafer to inhibit slip dislocations in the wafer during epitaxial layer deposition.

这样，二次边缘反射器便可加热外边并减小横越衬托器和半导体晶片的热梯度，从而可在外延生长层沉积时阻止晶片内滑移位错的发生。

If the height of bump is higher, the radius of bump is smaller, and the thickness of wire , substrate and chip is thicker, the strain of package without underfill is smaller. If the height of bump is shorter, the radius of bump is bigger, the thickness of wire is thinner, and the thickness of substrate and chip is thicker, the strain of package with underfill is smaller.

在应变方面，较高的凸块高度，较小的凸块半径，较厚的线路、基板和晶片厚度将对未填胶构装体有较小的应变值；另外较矮的凸块高度，较大的凸块半径，较薄的线路，较厚的基板和晶片厚度将对填胶构装体有较小的应变值。

The novel device integrates two important microfluidic phenomena, including hydrodynamic focusing and valveless flow switching inside multi-ported micro-channels. In this study, a simple theoretical model based on "flow-rate-ratio" method is first proposed to predict the performance of the device. Based on these data, a pre-focused 1xN flow switch is designed and fabricated using micromachining techniques.

本专题中的微流体晶片同时涵括了以下两种很重要的微流体现象--(1)水力预集中（hydrodynamic pre-focused ）以及(2)无阀式开关的切换方式，并在同一平面上作流向控制，以便将相同样品注射至不同或相同之出口槽(output-port)以连接至不同的微流体分析晶片，以达成多功能连续式的样品进料功能。

The absorption and distribution of chromium were studied in ryeusing nutrient culture technique and pot experiment.

采用不同浓度K2CrO4(0，0.4，0.8和1.2 mmol/L)的Hoagland营养液处理黑麦幼苗，测定铬在黑麦体内的亚细胞分布、铬化学形态及不同部位的积累。

By analyzing theory foundation of mathematical morphology in the digital image processing, researching morphology arithmetic of the binary Image, discussing two basic forms for the least structure element: dilation and erosion.

通过分析数学形态学在图像中的理论基础，研究二值图像的形态分析算法，探讨最小结构元素的两种基本形态：膨胀和腐蚀；分析了数学形态学复杂算法的基本原理，把数学形态学的部分并行处理理念引入到家实际应用中。