晶片

The conoscopic interference pattern of wafer with optical axis parallel to the surface of a crystal is sensitive to the crystal birefractive index.

光轴平行表面的晶片的会聚偏光干涉对晶体的双折射率非常敏感。

Backplane Transceiver Logic is a signaling standard that was invented and first introduced by National Semicon- ductor, then developed by the IEEE to enhance the perfor- mance of backplane buses.

背板收发器逻辑的是一个信号标准，这是首次由国家发明和半导体，矽晶片介绍，然后由IEEE开发，以提高perfor -背板巴士曼斯。

The companies will create a joint verture that will manufacture and sell dynamis random-access memory chips using IBM technology.

这些电脑公司将要合资设立一家公司，利用IBM的技术，来制造及贩卖动态随机访问存储器晶片。

The soft circuit board has an inner-cling body, a flectional body and an external body; the line layer of the soft circuit board has even numbers of contact fingers located on the external body; the inner-cling body clings to the glass substrate; width and rigidity of the flectional body are both smaller than those of the external body, thus the sensing region of the image-sensing wafer can be relatively moveable to the contact fingers.

该软性电路板具有一内贴部、一可弯曲部以及一外接部，该软性电路板的线路层具有复数个位于该外接部的接触指，该内贴部是贴附于该玻璃基板，并且该可弯曲部的宽度与刚性是均小于该外接部的宽度与刚性，以使该影像感测晶片的该感测区相对可动于该些接触指。

Provided is a wafer level CSP semiconductor device with the same size as a semiconductor substrate, in which the orientation of a semiconductor device cut into individual pieces and product information can be identified by a mark, indicating the orientation and the product information formable, irrespective of the size, shape and the number of terminals of the device without increasing the number of manufacturing processes, and its manufacturing method.

本发明提供一种在与半导体衬底尺寸相同的晶片级CSP半导体器件领域中，能够利用表示半导体器件的方向及产品信息的标记，来识别被切成单个的半导体器件的方向及产品信息的半导体器件及其制造方法，其中，该标记能够在与半导体器件尺寸、形状及端子数目无关，且在不增加制造工序数目的情况下形成。

Genesee strives to establish its core product pipelines in antibodies and recombinant antigens to meet the needs of a wide variety of diagnostic techniques, such as latex agglutination assay, capture ELISA, double antigen ELISA, double antigen-mediated lateral flow immuno-chromatograph, chemoluminescence, multiplex microsphere assay.

公司致力于抗体和重组蛋白两种核心原材料产品的开发，以满足各种诊断技术的需求，如乳胶凝集试验法，间接法ELISA，双抗原ELISA，双抗原介导的胶体金快速诊断，化学发光法，蛋白液体晶片多重诊断技术。

Mobile communication devices such as PDA and cellular phone will be inalterable and credible by installing the PTD.

PDA、手机等行动装置加装此安全模组晶片将成为可信赖之防窜改装置，即个人信赖装置。

"TSMC is the first foundry to deliver on the commitment of providing more design accuracy by proactively working with multiple EDA vendors to create and qualify interoperability between SPICE simulation technologies and the foundry's most advanced processes technologies," said S.T. Juang, senior director, Design Infrastructure Marketing at TSMC.

台积公司设计建构行销处资深处长庄少特表示：「台积公司领先专业积体电路制造服务领域，主动与多家EDA厂商合作，建立了一个整合SPICE模拟技术及最先进制程技术的跨平台运作机制，此一机制已经通过验证，能够成功提升晶片设计的精确度。

The theory and experiment results all has verified that the melting point of polymer isdetermined by the lamellar thickness.

由于理论和实验都证明了高分子结晶的熔点是取决于晶片厚度的。

This allows imaging the chip to identify open conductors and voltage levels without damage, although it does not operate through metalization layers.

这使影像晶片识别开而不损害导体和电压水平，虽然没有通过金属层操作。

On the other hand, the more important thing is because the urban housing is a kind of heterogeneity products.

另一方面，更重要的是由于城市住房是一种异质性产品。

Climate histogram is the fall that collects place measure calm value, cent serves as cross axle for a few equal interval, the area that the frequency that the value appears according to place is accumulated and becomes will be determined inside each interval, discharge the graph that rise with post, also be called histogram.

气候直方图是将所收集的降水量测定值，分为几个相等的区间作为横轴，并将各区间内所测定值依所出现的次数累积而成的面积，用柱子排起来的图形，也叫做柱状图。