悬臂弹簧

The Air Ministry wanted a range of 2,150 kilometers (1,340 miles), and so to reduce weight, Arado proposed that the E370 would take off on a wheeled tricycle trolley that would be left behind after take-off, and land on skids at the end of the flight.

尽管U2采用了主起落架，但是机翼在起飞的时候是由一种在起飞后丢弃的，叫做"弹簧脚"的外翼悬臂支架支撑的，同时翼梢还是有用于着陆的滑轮。

The Air Ministry wanted a range of 2,150 kilometers (1,340 miles), and so to reduce weight, Arado proposed that the E370 would take off on a wheeled tricycle trolley that would be left behind after take-off, and land on skids at the end of the flight.

尽管U2采用了主起落架，但是机翼在起飞的时候是由一种在起飞后丢弃的，叫做&弹簧脚&的外翼悬臂支架支撑的，同时翼梢还是有用于着陆的滑轮。

Basically, an AFM is using the attractive or expulsive force between the atoms of the AFM probe and the sample. The force can be as small as at the order of N, in which any minute deviation may be fatal to the measurement.

基本上， AFM 是依据量测针尖与样品之原子间的吸引力或排斥力的大小不同，达到的量测与显像解析的目的，一般的探针大约可感测到 N 的力量大小，在如此微小的力量情况下，一个可靠有效的探针振荡悬臂梁之弹簧系数校正方法也就相形重要。

Last, Nano Indenter XP was used to measure the mechanical properties of the fabricated probe structures, the results show that the spring constants of cantilever type and simply supported beam type probe structures were 2556 Nm-1 and 26280 Nm-1 respectively, which were close to the designed values of 2838 Nm-1 and 23935 Nm-1 with the error of 9.94% and 8.92%. DC probes and HP 4194A Impedance/Gain-phase Analyzer were adopted to measure the electrical properties of the simply supported beam probe card. The contact resistance from the probe tip to the end of stripline was 0.6Ω. In the frequency range of 5 to 40 MHz, the characterized impedance between two probes was larger than 20 kΩ, and the capacitance was from 0.17 pF to 0.27 pF.

采用Nano Indenter XP纳米压痕仪对制备后的探卡结构进行力学性能测试，测得悬臂梁和简支梁的弹簧常数分别为2556 Nm-1和26280 Nm-1，与2838Nm-1和23935 Nm-1的理论设计值相差9.94%和8.92%；采用直流探针和HP 4194A阻抗分析仪对简支梁型探卡结构进行了电学性能测试，从简支梁探针到引线末端的直流接触电阻为0.6Ω，在5-40 MHz范围内，探针间特征阻抗大于20 kΩ，电容在0.17 pF至0.27 pF之间，测试结果表明探针的接触电阻小、射频隔离性能好。2。

This paper presents several kinds of IC Wafer testing probe card for Semiconductor Packaging and chip test.There are epoxy ring probe、vertical probe card micro spring probe card,and MEMS probe card.

本文简单介绍半导体产业集成电路芯片测试用探针卡，分为以悬臂梁方式的环氧探针、垂直探针和微弹簧丝探针，以及基于微机电系统的MEMS probe card。

But we don't care about Battlegrounds.

但我们并不在乎沙场中的显露。

Ah! don't mention it, the butcher's shop is a horror.

啊！不用提了。提到肉，真是糟透了。