封装

Consequently, the manganin sensing elements were "cleanly" encapsulated in inorganic solid matrix and the high-pressure shunt effect was eliminated radically.

实验采用高压绝缘性能优良的Al_2O_3作为锰铜敏感元件的封装材料，首次实现了敏感元件&清洁&的无机固态封装，从根本上消除了高压旁路电阻效应。

All models: 18 wheels standard, Bluetooth, HomeLink, leather armrest package, Storage Package, power top roadsters

所有型号： 18 轮毂标准，蓝牙， HomeLink ，皮革扶手封装，存储封装，电源顶端

ABSTRACT in the first part of this thesis, the interaction between cu-sn and ni-sn interfacial reactions in a soldering system has been studied by using a ni-sn3.5ag-cu sandwich structure. a layer of cu-sn intermetallic compound was observed at the interface of the ni foil after 30 seconds reflowing.

在电子元件高功率及及轻、薄、短、小化的要求下，热一直是造成电子元件失效的原因之一，BGA封装的主要失效原因是作为接点的锡铅共熔合金（63Sn-37Pb；或称锡球）的疲劳破裂，这是导因於封装体不同材料间热膨胀系数的差异所造成的热应变。

What's more, the company has many years of experience in the aspects of power MOSFET, radio frequency tube and driving power module, and it breaks through the international monopoly to apply its products in several fields, including IT, digital, communications, illumination, security, and automotive electronics, etc.

SMD封装事业部在国家民营企业中，率先引进美、日等国的半导体封装设备，生产半导体分立器件和被动元件，已拥有全自动生产线28条，年产SMD（二极管、三极管、集成电路、电容器）等无铅无卤环保产品50多亿只，特别在功率场效应管和射频以及驱动电源模块方面，集多年的技术经验，突破国际垄断，产品广泛应用于IT、数码、通讯、照明、消费类汽车电子等领域。

The integrated circuit and the magnet are configured into a sensor package, such that the magnetoresistive bridge components enable the detection of a target tooth when one half of the plurality of magnetoresistive bridge components come into proximity with an edge of a tooth before that of another half of the magnetoresistive bridge components as the tooth and an associated slot thereof pass by the sensor package.

将集成电路和磁体配置到传感器封装中，使得磁致电阻桥式组件在目标齿及其相关槽通过传感器封装期间，在多个磁致电阻桥式组件的一半在磁致电阻桥式组件的另一半之前靠近齿的边缘时，能够探测到目标齿。

The optical fiber sleeve encapsulation cover (3) and the optical fiber sleeve (4) have sliding fit.

其中，半导体激光器基座封装盖(1)与半导体激光器基座(2)组成球轴承，光纤套管封装盖(3)与光纤套管(4)为滑配合。

Therefore it has all-importment significance for the further study in the product packing common technologyAccording to the idiographic demand of some modules,the paper groped technology of the design of waveguide window and packing,material with high thermoconductivity,completed the study of the seal joint in waveguide window and in module seal joint components,settled the puzzle in production,the technology target attained GJB548A-96 provisions.

本文根据某型模块的具体要求，探索窗口设计与封装、高热导材料封装技术，完成了波导密封窗口和模块密封部件的研究，解决了生产中的难题，技术指标达到了GJB548A-96的相关规定的要求。

Lead oxide in seal frit used for making window assemblies for Argon and Krypton laser tubes.

封装氩和氪激光管防护窗组件封装玻壳所含铅氧化物。

When we operate all accessing databases in encapsulation at Data Access Layer by ActiveX DLL packages (DAL layer, Namely data access layer),and operate all business logic or transaction processings in encapsulations at Business Logic Layer ( BLL layer, namely business logic layer), ASP dynamic webpages are offered to the interface of user for Presentation Layer ( PL layer, Namely present layer).

使用ActiveX DLL组件将对数据库的存取操作全部封装在Data Access Layer层（简称DAL层，即数据存取层），将商业逻辑或事务处理全部封装在Business Logic Layer层（简称BLL层，即商业逻辑层），提供给使用者的界面就是Presentation Layer层的ASP动态网页。

The study introduced the subminiature and pint-size encapsulation CPLD, which was welded to the tailor-made seat of DIP encapsulation., and formed the integrated circuit that pending programmed.

该研究采用超小型或小型封装的可编程器件CPLD，焊接到特制的DIP封装的托座上，形成待编程的集成电路。

On the other hand, the more important thing is because the urban housing is a kind of heterogeneity products.

另一方面，更重要的是由于城市住房是一种异质性产品。

Climate histogram is the fall that collects place measure calm value, cent serves as cross axle for a few equal interval, the area that the frequency that the value appears according to place is accumulated and becomes will be determined inside each interval, discharge the graph that rise with post, also be called histogram.

气候直方图是将所收集的降水量测定值，分为几个相等的区间作为横轴，并将各区间内所测定值依所出现的次数累积而成的面积，用柱子排起来的图形，也叫做柱状图。