封装

The cured material has very low ionic contents with low outgassing, which is well suitable for use in electronic encapsulating, such as cover glass bonding of CCD/CMOS area image packages.

固化后材料具有很低的阳离子组成和低的排气率，因此该C- UV 4111非常适合于电子封装，例如玻璃基板上的 CCD/CMOS面元的封装。

If you are using LocalTalk , you have to use encapsulated TCP/IP; if you want to connect to the outside Internet world, you need a gateway box that unwraps the encapsulated data and sends it along to the outside.

如果使用LocalTalk，你只能采用封装型TCP/IP；如果与外部In-ternet世界相连，你需要一个网关盒将封装型数据包传送出。

An air-evacuation packaging mechanism is applicable to package a barrier bag and an inner filler material enclosed by the bag, and comprises an air-evacuation apparatus, a clamping apparatus and a thermal sealing apparatus.

一种真空封装机构系应用於一袋体及一置於该袋体内的芯材之封装，其包含一抽气装置、一压合装置及一热封装置。

Winding: winding on the φ 5mm bakelite bar with the winding machine (2) temperature seasoning: 48 hour in silicon oil, 1 hour in LN2,(3) coil sealing: polyester,(4) pressure seasoning: keeping 30 minutes in 8000 10000kg cm2,(5) firm fix of the pressure gauge.

线圈之缠绕：利用绕线机缠绕 5mm 电木棒，(2)温度季化： 48 小时於矽油中， 1 小时於液态氮中，(3)线圈封装：使用香乳胶封装线圈，(4)压力季化：加压一次 30 分钟到 8000 10000kg cm2 ，(5)固定压力计。

In addition, the stress/strain responses of lead-free Flip Chip on Board under packaging process and thermal cycling was simulated with finite element method.

利用有限元仿真的方法，模拟了无铅倒装封装器件封装的工艺及可靠性测试。

Photovoltaic raw materials: silicon material, silicon bulk/silicon briquet, silicon chip, sealing glass, sealing membrane, other materials.

光伏原材料：硅料，硅锭/硅块，硅片，封装玻璃，封装薄膜，其他原料。

DC to GND DC to BAT BAT, CHG, POK, USB to GND Operating Temperature Range Junction Temperature Range Storage Temperature Range Lead Temperature (soldering, 10s) Continuous Power Dissipation (TA =+70C) 5-Pin Thin SOT23 Derates above +70C 5-Pin Thin SOT23

直流接地直流英美烟草英美烟草，嗜铬粒蛋白2710 8860，USB到GND的工作温度范围结温度范围储存温度范围引线温度（焊接，10秒）连续功率耗散（电讯局长=+70℃）5引脚薄型SOT23封装Derates以上+ 70℃5引脚薄型SOT23封装

There are over 10 companies producing LED epitaxial wafer and tube core packaging in China now.

目前国内有十几家做LED外延芯片和芯片封装的公司，无论是上游的衬底、外延片生产，还是中下游的芯片制造、封装，都与国际大公司有一定的差距。

Two component epoxies and polyurethane potting materials are used in electronic device housings to improve vibration, shock, and water resistance of assemblies, increase mechanical strength, and provide electrical insulation.

双组分环氧树脂和聚氨酯封装材料，使用在电子设备的封装，防止震动，冲撞，水分的接触；提高机械强度，起到绝缘的效果。

Division I is a large car explosion-proof membrane packaging company, has its own packaging factory.

我司是大型的汽车防爆膜封装公司，有自己的封装厂。

On the other hand, the more important thing is because the urban housing is a kind of heterogeneity products.

另一方面，更重要的是由于城市住房是一种异质性产品。

Climate histogram is the fall that collects place measure calm value, cent serves as cross axle for a few equal interval, the area that the frequency that the value appears according to place is accumulated and becomes will be determined inside each interval, discharge the graph that rise with post, also be called histogram.

气候直方图是将所收集的降水量测定值，分为几个相等的区间作为横轴，并将各区间内所测定值依所出现的次数累积而成的面积，用柱子排起来的图形，也叫做柱状图。