封装

The characteristic of BMS silica mesostructure and the effect of various synthesis factor (including ammonia/silica molar ratio, composition concentration variation, surfactant alkyl chain length, auxiliary organic molecules such as trimethylbenzene, catalyst structure and properties, solvent and cosolvent volume and its polarity, aging and drying conditions and postsynthesis hydrothermal treatment and so on) on the resultant BMS silica structure and properties were assessed using a series of analytical techniques such as XRD, SEM, TEM,〓Si MAS NMR, TG-DTA and N〓 adsorption measurements.

结果显示BMS二氧化硅分子筛是由大量封装胶束的纳米二氧化硅颗粒（约为20-40nm）堆积形成的聚集体，其双介孔分布中较小的介孔起因于颗粒内部表面活性剂模板形成的介孔，我们称之为骨架介孔。它类似于我们在MCM-41中看到的介孔，可通过改变表面活性剂胶束的尺寸而在2.56-3.65nm的范围内进行调节。

According to her, the second generation of CMMB chips of Telepath will come out at the end of this year, and they will put out MCP solution that Tunner is packed with demodulator, except that Tuner comes from a third party.

她称，泰合志恒的第二代CMMB芯片将于年底推出，并且，他们也推出将Tuner与解调器封装在一起的MCP方案。只不过，Tuner是来自第三方。

LEDs of all colours are available in uncoloured packages which may be diffused or clear (often described as 'water clear').

发光二极管的所有颜色有uncoloured封装可分散或清除。

In addition, the impact of underfill properties on thermomechanical reliability of the FCOB assembly was addressed.

另外，还研究了下部填充料对倒装芯片封装热应力可靠性的影响。

It has been found that flip chip without and with underfill encapsulation has different corrosion modes. Possible failure mechanism was presented.

实验发现，倒装芯片封装在使用和不使用下部填充料的情况下具有完全不同的铝腐蚀模式，并阐述了可能的腐蚀机理。

Underfill technology has been used to minimize the mismatch of the Coefficient of Thermal Expansion in flip chip technology.

底层填充技术应用于倒装芯片热膨胀系数配合的最小化，它也被扩展应用到增加CSP(Chip Scale Package 芯片级封装)的机械强度。

Compatibility of flux and underfill material and processes is another problem.

分层出现与否取决于界面粘合强度和应力的竞争，因而由封装构型及材料特性决定。

Comparison between FEA and experiment highlights the importance of adhesion between underfill and chip to thermomechanical reliability of the FCOB assembly.

通过模拟和试验结果的比较，论证了下部填充料与芯片之间粘接力对倒装芯片封装热应力可靠性的重大影响。

Theoretic modes were built to study the interaction between infrared light and failures in underfill, and to explain the fringes and contrast in IR images.

2通过失效分析方法发现了一种热冲击试验中失效倒装芯片封装中的芯片边缘裂缝。

And research shows that high thermal conductivity composite can decrease the temperature difference of underfill between chip and substrate, so that it can improve the temperature distribution of the flip chip, decrease the thermal stress of underfill and increase packaging reliability.

表明高导热系数的底充胶可明显降低在芯片和基板之间的温度差，降低底充胶的热应力，进而提高电子封装的可靠性。

Breath, muscle contraction of the buttocks; arch body, as far as possible to hold his head, right leg straight towards the ceiling (peg-leg knee in order to avoid muscle tension).

呼气，收缩臀部肌肉；拱起身体，尽量抬起头来，右腿伸直朝向天花板（膝微屈，以避免肌肉紧张）。

The cost of moving grain food products was unchanged from May, but year over year are up 8%.

粮食产品的运输费用与5月份相比没有变化，但却比去年同期高8％。