封装

Finite element analysis is used to compare temperature differences between low and high thermal conductivity of composites.

利用有限元方法对电子封装倒装焊中不同导热系数的底充胶材料对温度场的影响进行了分析比较。

Finally, the application of infrared thermography technology to microwave cubic module was discussed.

完成了三维立体微波电路封装技术的研究。

And by improving the manufacturing process and packaging technology, the performance of thin-film batteries will also be continuously improved and enhanced.

并通过改进生产工艺和封装技术，薄膜电池的性能也将不断改善和提高。

Korea put the company at electric power control device - the general type STR (thyratron thyristor power controller) CPU upgrade to system memory type, and early in 2003 to develop cutting-edge new product type constant current, constant voltage type collectively referred to as STR (may silicon-controlled thyristor power controller) the inherent brand. In 2000 to develop the motor starting device - soft starter motor new products and the inherent SMC brand available at the area of power control both at home and abroad alike. Market in 2000 and 2002 patent SSC (packaged solid-state thyratron power controller), as well as sales from the company since its inception back filter with Pulse Timer and other products in the same trade firmly occupy The largest market. Also in 2002 the development of the supply of silicon wafer characterization equipment and sub-Plasma Ion Plating with the most cutting-edge power supply devices and so on, so if the company has high-speed development.

本公司在韩国把电炉电力控制装置-一般型STR升级为CPU系统内存型，与2003年初新开发的尖端产品恒电流型、恒电压型统称为STR 这一固有品牌。2000年开发电动机启动装置-电动机软启动器新产品并以SMC这一固有品牌面市，在电力控制领域受到国内外的一致好评。2000年面市并2002年取得专利的SSC(封装固态闸流功率控制器)，还有从公司创立初期销售至今的 back filter 用 Pulse Timer等产品在同行业中牢牢占据着最大的市场。2002年又开发供应硅wafer分段定性装备及Plasma Ion Plating用最尖端动力供应装置等，因此公司具备了高速发展的依据。

It uses an API call, but the example has been put tidily into a subroutine.

它使用了一个API调用，但例子中已经将它封装在一个子例程中。

C Supports both Firmware Hub and LPC Memory Read and Write Cycles Auto-detection of FWH and LPC Memory Cycles C Can Be Used as FWH for Intel 8xx, E7xxx, and E8xxx Series Chipsets C Can Be Used as LPC Flash for Non-Intel Chipsets Flexible, Optimized Sectoring for BIOS Applications C 16-Kbyte Top Boot Sector, Two 8-Kbyte Sectors, One 32-Kbyte Sector, Three 64-Kbyte Sectors C Or Memory Array Can Be Divided Into Four Uniform 64-Kbyte Sectors for Erasing Two Configurable Interfaces C FWH/LPC Interface for In-System Operation C Address/Address Multiplexed Interface for Programming during Manufacturing FWH/LPC Interface C Operates with the 33 MHz PCI Bus Clock C 5-signal Communication Interface Supporting Byte Reads and Writes C Two Hardware Write Protect Pins: TBL for Top Boot Sector and WP for All Other Sectors C Five General-purpose Input Pins for System Design Flexibility C Identification Pins for Multiple Device Selection C Sector Locking Registers for Individual Sector Read and Write Protection A/A Mux Interface C 11-pin Multiplexed Address and 8-pin Data Interface C Facilitates Fast In-System or Out-of-System Programming Single Voltage Operation C 3.0V to 3.6V Supply Voltage for Read and Write Operations Industry-Standard Package Options C 32-lead PLCC C 40-lead TSOP

0第0页，本页显示记录0-0，共0条记录分0页显示C支持两种固件中心和LPC内存读取和写入周期自动的FWH和LPC的记忆圈C检测可以用于英特尔8xx系列，E7xxx，E8xxx系列芯片组和C可以用作FWH与至于非英特尔芯片组的BIOS应用柔性优化扇区开放16字节热门引导扇区，两个8 - Kbyte的，一个32字节部门，3个64 - Kbyte的C或存储阵列，线性预测编码闪光可分为四个统一为两个可配置的接口擦除的FWH / LPC接口为64 - Kbyte的行业，系统运行C地址/地址多路复用在制造过程中用于编程接口的FWH /线性预测编码界面C与33 MHz的PCI总线时钟 5信号通信接口进行操作，支持字节读取和写入引导扇区的顶部和WP C两硬件写保护引脚：任务型为所有其他部门 5个通用输入的系统设计的灵活性识别的多种设备选型部门登记销锁定为个别部门读取和写保护的A /阿复用界面C 11引脚复用引脚地址和8引脚的数据界面C促进快速系统内或外的系统编程的单电压3.0V至3.6V的操作供应的读取和写入操作业界标准的封装选项电压 32 -引脚PLCC 40引脚的TSOP

Dispose the actual demand of IPsec VPN system in the star type topological network to what users put forward. We used GRE protocal encapsulate IPsec package method realized Hub-and-Spoke, and center node centralized management in the user s demands at the same time.

针对用户提出的在星型拓扑网络中部署IPsec VPN系统的实际需求，本文使用了GRE封装技术实现了中心辐射式的IPsec VPN，同时满足了中心节点集中管理的需求。

Note: All temperatures refer to topside of the package, measured on the package body surface

所有温度均为在封装本体上表面测得的温度。

In addition to the measurement of thermal resistance of the packaging, transient thermal response is investigated both theoretically and experimentally.

对扩展电阻温度传感器封装热阻的测量和瞬态热响应分别进行了理论和实验研究。

A transient heating response theory is also used to inspect the package structure of the devices.

还应用瞬态加热响应原理对功率管的封装结构进行了监测。

Breath, muscle contraction of the buttocks; arch body, as far as possible to hold his head, right leg straight towards the ceiling (peg-leg knee in order to avoid muscle tension).

呼气，收缩臀部肌肉；拱起身体，尽量抬起头来，右腿伸直朝向天花板（膝微屈，以避免肌肉紧张）。

The cost of moving grain food products was unchanged from May, but year over year are up 8%.

粮食产品的运输费用与5月份相比没有变化，但却比去年同期高8％。