封装

This paper use H.264/AVC video transmission, which defines a set of three Profiles. Applications of the Baseline Profile include video telephony, video conferencing; applications of the Main Profile include television broadcasting and video storage; and the Extended Profile may be particularly useful for streaming media applications. H.264 proposes the idea of Network Abstraction Layer. The output of the encoding process of VCL data will be packeted into NAL units. The NAL will give the NAL units corresponding header information according the contents of the units.

而本论文在采用的多媒体压缩技术－H.264/AVC，其定义了三种不同的Profile：Baseline Profile著重在视讯电话，视讯会议等偏重即时传输等服务类别，Main Profile重点则是电视的播放以及影像储存的应用，而Extension Profile则是在串流媒体的播放上提供了较多的技术支援。H.264/AVC并且率先提出了网路提取层的概念，影像在视讯编码层完成编码之后，移交到网路提取层中，而网路提取层会依视讯编码层产生的编码内容将其封装近NAL units，并给予应有的标头资讯。

PostScript language is Adobe, designed to work with to any support postScript language business card printing mechanism card file of the page description language.

封装的postScript格式。postScript语言是Adobe 公司设计用于向任何支持postScript语言的制卡机制卡文件的页面描述语言。

As an Encapsulated PostScript EPS format is Adobe, designed to work with to any support PostScript language your printer prints a page description language of the file.

EPS为封装的PostScript方法，是Adobe 公司撤计用于向任何撑持PostScript措辞的打印机打印文件的页背刻画措辞。

Aluminum nitride substrate has been recognized as one of ihe most promising electronic substrate as heating panel and packaging materials for its high thermal conductivity, fine electrical insulation, and close coefficient of thermal expansion to silicon semiconductor.

氮化铝材料具有较高的热导率和良好的介电性能，机械强度高，热膨胀系数与半导体硅材料相近，非常适于制造大功率或快速半导体器件的散热基片和封装材料。

These layers are covered with printed paperboard, which gives the packages their rigidity.

这些覆盖层的印刷纸板，这使他们的刚性封装。

This comprehensive standard defines all required aspects of 64Mb through 1Gb DDR SDRAMs with X4/X8/X16 data interfaces, including features, functionality, ac and dc parametrics, packages and pin assignments.

该标准定义了拥有 x4/x8/x16数据接口的64Mb 到1Gb DDR SDRAMS 的所有要求，包括引出端、地址、功能描述、特征、 AC 和 DC 参数、真值表和封装。

This comprehensive standard defines all required aspects of 256Mb through 4Gb DDR2 SDRAMs with x4/x8/x16 data interfaces, including pinout, addressing, functional description, features, ac and dc parametrics, truth tables, and packages.

该标准定义了拥有 x4/x8/x16数据接口的256Mb 到4Gb DDR2 SDRAMS 的所有要求，包括引出端、地址、功能描述、特征、 AC 和 DC 参数、真值表和封装。

At present the main problem that the power electronic integration technology is faced with is how to make volume of module smaller, cheaper and more density of power, better capability of cooling, less parasitical parameter and applied in more situations. One of the main problems is the cooling of integrated module.

目前混合封装电力电子集成技术面临的主要问题是如何将模块的体积做的更小，成本更低，功率密度更大，传热性能更好，寄生参数更小及满足更多的应用场合，而其中最主要的一个问题就是集成模块的散热问题。

At present the main problem that the power electronic integration technology is faced with is how to make volume of module smaller, cheaper and more density of power, better capability of cooling, less parasitical parameter and applied in more situations.

目前混合封装电力电子集成技术面临的主要问题是如何将模块的体积做的更小，成本更低，功率密度更大，传热性能更好，寄生参数更小及满足更多的应用场合，而其中最主要的一个问题就是集成模块的散热问题。

At the encapsulation phase of the proposed scheme, no paring computing and no MapToPoint hash function are required.

提出的实例方案在会话密钥封装阶段不需要进行对计算以及映射到点的Hash函数计算。

Breath, muscle contraction of the buttocks; arch body, as far as possible to hold his head, right leg straight towards the ceiling (peg-leg knee in order to avoid muscle tension).

呼气，收缩臀部肌肉；拱起身体，尽量抬起头来，右腿伸直朝向天花板（膝微屈，以避免肌肉紧张）。

The cost of moving grain food products was unchanged from May, but year over year are up 8%.

粮食产品的运输费用与5月份相比没有变化，但却比去年同期高8％。