封装

This paper consists of three parts:(1) application of Nano Indenter Ⅱ on new types of electronic encapsulation materials;(2) measurement of micro-scale plastic equation of state with Nano Indenter Ⅱ;(3) variation of micro-scale plastic equation of state after boiler tubes used over a long period of time.

论文有以下三部分内容：（1）纳米力学探针在发展新型电子封装材料中的应用；（2）用纳米力学探针压入法测定材料的微区塑性力学方程；（3）电厂锅炉管长期使用后微区塑性力学方程的变化。

GE Fanuc's leadership in systems based on this industry standard architecture and in technologies such as multi-core processors and FPGA were clearly a key factor in our ability to secure this project,

GE Fanuc在系统领域内的领导地位取决于行业标准架构以及像多核处理器和FPGA这样的封装技术，它们是我们确保项目成功的关键。

Dynamic Viscoelastic and Thermal Properties of Flame-Retardant Epoxy Encapsulants Owing to excellent heat, solvent and chemicalresistance, good adhesion and inexpensiveness, epoxy resin has been widely employed in the encapsulation of microelectronic devices.

viscoelastic动态特性和热火阻燃环氧树脂encapsulants 由于出色的热、溶剂和chemicalresistance、善意与廉、环氧树脂已广泛应用于微电子封装的装置。

Organic light-emiting devices are extremely sensitive to vapor and oxygen. The influence of inleakage of oxygen and vapor on OLED's lifetime was serious. Thus, encapsulation is very important to an OLED device. Research status of encapsulation technology of OLED on different substrate and cover.

有机电致发光二极管对水汽和氧气非常敏感，渗入发光二极管器件内部的水汽和氧气会对器件寿命产生严重的影响，因此OLED的封装是制造OLED的关键技术之一。

24LC01 Pinout: 2 pA Input Bias Current Characterized From TA = C55C to 125C Available in MSOP and SOT-23 Packages Micropower Shutdown Mode ...

24LC01引脚说明： 2 PA的输入偏置电流为特征由TA = C55C至125℃采用MSOP和SOT - 23封装微功率停机模式下可用。。。

A new type of high-resolution X-ray image intensifier is introduced.

提出一种新型高分辨率X射线像增强器，它是线路板检测和芯片封装检测装置中的核心器件之一，其极限分辨率制约着X射线检测装置的发展。

Consisting of an intercooler, 3-inch exhaust, sports catalyst and reprogrammed electronics, the package boosts the engine's output from 220 hp (162 kW) to 295 hp (216 kW) and 420 Nm of torque.

组成的中间， 3英寸的排气，体育催化剂和重新电子封装提高了发动机的输出从220马力（ 162千瓦）至295马力（ 216千瓦）和420 Nm的扭矩。

The interfacial reactions and reliability of lead-free solder joints are systematically investigated in this thesis.

本文对无铅电子封装中的界面反应和焊点可靠性进行了系统的研究。

The Intel Xeon Processor with a 400 MHz Front Side Bus is packaged in the 603-pin OLGA On Interposer package.

MHz 前端总线的英特尔至强处理器采用 603 针 OLGA On Interposer 封装类型。

The invention is directed a patterned contact sheet and to a method of bonding a cover wafer to an interposer wafer using the patterned contact sheet having a waffle-like pattern of a plurality of ridges and plurality of wells to form a cover/interposer combination or unit that can be bonded to a substrate having a MEMs device thereon, the cover wafer, interposer wafer and substrate together forming a protective packaging for the MEMS.

本发明涉及在制造过程中保护临界表面的形成有图案的接触片材以及一种使用形成有图案的接触片材将盖子片粘合到插入物片上以形成盖子/插入物组合或单元的方法，所述接触片材具有华夫饼干状图案的许多脊和许多井，所述盖子/插入物组合或单元可粘合到具有MEM设备的基材上，所述盖子片、插入物片和基材一起形成MEM用的保护性封装。

Breath, muscle contraction of the buttocks; arch body, as far as possible to hold his head, right leg straight towards the ceiling (peg-leg knee in order to avoid muscle tension).

呼气，收缩臀部肌肉；拱起身体，尽量抬起头来，右腿伸直朝向天花板（膝微屈，以避免肌肉紧张）。

The cost of moving grain food products was unchanged from May, but year over year are up 8%.

粮食产品的运输费用与5月份相比没有变化，但却比去年同期高8％。