多形

Architecture A curvilinear, often lobelike figure or space formed between the cusps of intersecting arcs, found especially in Gothic tracery and Moorish ornament.

叶形饰：在尖顶的交叉拱门之间的一块曲线的、常为裂片状的空间，在哥特式的窗花格交织线条和马蹄型拱的装饰上尤为多见

By utilizing the basic theory of chaos and fractal,on the basis of reading a vast amount of literatureand summing up predecessors achievements,using the three methods of analysis,computation andexperiment,this paper research for the overlapping embedment topology distribution structure of thegeneralized M-J sets and chaos phenomenon in the multi-dimension determinate nonlinear system(such as the cardiac system of species of the different level of evolution,the two-dimensional nonlinearmap,etc).

本文利用混沌与分形的基本理论，在大量阅读文献，总结前人的成果的基础上，采用解析、计算和实验三种手段并用，主要研究了广义M-J集的嵌套拓扑分布结构和多维确定性非线性系统(如进化程度不同物种的心脏系统、二维非线性映射等)中的混沌现象，取得了以下方面的创新

From geometry and forming mechanism, five secondary styles of the extensional-type structural style, including tilted faulted-block, slide faulted-ramp, buried hill draping, gravitative antiform and diapir, were reported.

滑动断阶构主要发育在坳陷的陡坡带，底辟构造常见于坳陷的洼陷带，潜山披覆构造多发育在盆地四周隆起区与洼陷中的潜山带，而重力背形构造大多发育在主断层的下降盘。

One or more drive-units are mounted on the bottom surface of the dome-shaped top enclosure, and fire downward at a curved conical diffusor/reflector.

一个或多个驱动器单元安装在圆顶的底面形顶部外壳，消防向下弯曲的锥形扩压器/反射。

With the electrical connections at the top and bottom side of the wafer-level IC packaging Lead-frame structure and composition of the surface-mount semiconductor package structure Multi-layer printed circuit board Antifuse and its formation method and with the anti-fuse non-volatile memory device unit cell Tandem electric signal processing circuit and electronic device Light-emitting diode packaging structure and encapsulation method Electronic Packaging Structure Flip-chip high-speed optoelectronic components and structure Pairs of piezoelectric friction side by side to promote the three-step device and scanning probe microscope Light-emitting diode and its manufacturing method, the production base of light-emitting diode method Three or four parallel advance of stepping piezoelectric device and scanning probe microscope lens body Silicon substrate and its manufacturing method Semiconductor device and voltage-divider A polysilicon layer and the microcrystalline silicon layer of the double-substrate active layer structure, methods and devices The edge of the thickness of silicon controlled Of a lateral semiconductor devices and high-voltage devices With a vertical-channel transistors semiconductor device Of a memory array and for the manufacture of a memory array method Read-only memory cell array structure Active-matrix substrate and display device High-voltage semiconductor integrated circuit devices, dielectric isolated type semiconductor device Image sensing devices Lens module and its manufacturing methods Solid-state imaging device and camera Injection angle for the trench isolation Organic Light-Emitting Display Device Organic light-emitting display device Bipolar transistor structure of the surface passivation Double-triggered silicon-controlled rectifier HFET Metal-oxide semiconductor transistors Self-aligned trench accumulation mode field effect transistor structure Thin-film transistors and Display Devices TFT Lead Diode Low-frequency, low noise, low-flashing diode Used for thin-film solar cells trap light structure Transparent sun solar cells Quaternary semiconductor heterojunction photovoltaic cells heat Si nano-pillar array heterojunction thin-film solar cells GaN-based micro-composite solar cells isotope Optical sensor Semiconductor by optical components Imaging Detector Transparent conductive oxide coating Silicon-based high-performance dual-junction solar cells Thin-film solar cells Alien LED Devices

非专业，不在行，求高手帮忙。谢谢！具有顶部及底部侧电连接的晶片级集成电路封装导线架结构及其构成的表面黏着型半导体封装结构多层印刷电路板反熔丝及其形成方法和具有该反熔丝的非易失性存储器件的单位单元串联用电式信号处理电路及电子装置发光二极管的封装结构及其封装方法电子封装结构高速光电组件及其芯片倒装结构双压电体并排推动的三摩擦力步进器与扫描探针显微镜发光二极管及其制作方法、发光二极管的底座的制作方法三或四压电体并行推进的步进器及其扫描探针显微镜镜体硅衬底及其制造方法半导体装置与分压电路具多晶硅层及微晶硅层的双底材主动层结构、方法及装置硅晶片的受控边缘厚度一种半导体横向器件和高压器件具有垂直沟道晶体管的半导体器件一种记忆体阵列及其用于制造一记忆体阵列的方法只读内存单元阵列结构有源矩阵基板和显示装置高耐压半导体集成电路装置、电介质分离型半导体装置图像感测装置透镜模块及其制造方法固态成像装置和照相机用于沟道隔离的斜角注入有机电致发光显示装置有机发光显示装置双极晶体管的表面钝化结构双触发型可控硅整流器异质结场效应晶体管金属氧化物半导体晶体管自对准沟槽累加模式场效应晶体管结构薄膜晶体管及显示器件薄膜晶体管无铅二极管低频、低噪音、低闪烁的二极管用于薄膜太阳电池的陷光结构透明遮阳太阳能电池片四元半导体的异质结热光伏电池硅基纳米柱阵列异质结薄膜太阳能电池氮化镓太阳能同位素复合型微电池光学传感器半导体受光元件成像探测器透明导电氧化物涂层硅基高效双结太阳能电池薄膜太阳能电池异形LED器件

This month Boyun the chirp sends out diphthong, this time we duplicate him "the chirp" to make the response, and "converses" with lip shape must obviously and her.

这个月的柏妘会咿咿啊啊地发出双元音，此时我们多重复他的「咿咿啊啊」去做回应，并且用唇形要明显地和她「对话」。

You say that people cannot Apparate or Disapparate within Hogwarts and yet Dobby manages it, why is this?

你说人们不能在霍格沃茨幻影显形或幻影移形，但多比却能，这是为什么？

However, compared with double negative sentence and imperative sentence, it is much more complicated in formation, semantic and usage.

从语形、语义、语用等多方面考虑，"别不X"的情况较之二者，则复杂的多。

Powder metallurgy gears include: bevel gear, dual-gear, gear box gears, planetary gears, ring gear, rack, sector gears, bevel gears, spur gears, sun gear, helical gear, gear shaft, flat gears, spur gears, double layer gear, synchronous pulley, helical gear, sprocket, ratchet, multi-gears, micro-gear, small modulus gear, special gear, differential bevel gear, reducer gears, variable speed gear motor, all kinds of precision gears.

粉末冶金齿轮包括：伞齿轮、双联齿轮、齿轮箱齿轮、行星齿轮、齿圈、齿条、扇形齿轮、锥齿轮、直齿轮、太阳齿轮、斜齿轮、齿轴、平齿轮、正齿轮、双层齿轮、同步轮、皮带轮、螺旋齿轮、链轮、棘轮、多层齿轮、微型齿轮、小模数齿轮、异形齿轮、差速伞齿轮、减速机齿轮、变速电机齿轮、各类精密传动齿轮。

Enjoying chrysanthemum,inserting it on the hair and drinking the chrysanthemum liquor are the most important activities in the Double Ninth Festival, which stem from the antiquity psychology of avoiding disaster and evil and desiring immortality.

对菊花的艺术表现有一个从写形到写神的发展过程，表现出唐宋两个时期的不同美学追求，唐代注意写菊花的姿态美，具象化，而宋代追求清枯之美，多写枯菊、残菊。

Breath, muscle contraction of the buttocks; arch body, as far as possible to hold his head, right leg straight towards the ceiling (peg-leg knee in order to avoid muscle tension).

呼气，收缩臀部肌肉；拱起身体，尽量抬起头来，右腿伸直朝向天花板（膝微屈，以避免肌肉紧张）。

The cost of moving grain food products was unchanged from May, but year over year are up 8%.

粮食产品的运输费用与5月份相比没有变化，但却比去年同期高8％。