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The reason is that on a number of extruded compound modification oilysludge, just one layer on the heatsealing layer blending, middle-tier also may be in a lower-cost.

原因是对多层共挤复合基材进行改性,只需在其一层热封层上进行共混改性,在中间层还可采用成本较低的树脂。

The experimental results show that:(1) LB films are uniform and solid, but it is easy to collapse at higher film pressure,(2) Multilayer LB films process sandwich structure and longspace orderliness, and the phenomenon of crystallization in the process of forming 〓 LB films,(3) The thickness of 〓 monolayer is about 50~60〓,(4) During the formation of 〓 multilayers, molecular arrangement is inclinable to the substrate, the angle is about 25°~30°.

采用小角X-射线散射对多层LB膜的结构进行了表征,发现LB膜具有层状结构的特点和长程有序特征,并对多层LB膜中分子排列的取向状态进行了初步推测,与AFM得到的结果一致。

In a comprehensive study of various macro-and micro-heterogeneous reservoir parameters on the basis of the reservoir quality, we launched a comprehensive evaluation to determine the evaluation criteria. The reservoir quality in 2+3 was divided into three types. The research shows that distribution of interlay and insulating layer is controlled by sedimentary microfacies. The developmental stages and the size of the sedimentary microfacies determine the plane and the vertical distribution of interlay and insulating layer.

本研究运用高分辨率层序地层学的原理和方法,从油田生产的实际需要开发,将双河油田Ⅶ下单元的14个小层,重新划分为31个;在综合研究各种储层宏观和微观非均质性参数对储层质量影响的基础上,开展了储层多参数综合评价,对Ⅶ下单元的隔夹层进行研究,绘制了各小层的平面分布图,并对Ⅶ下单元的31个活动单元划分为4种类型,在平面上画出了所有小层的评价图。

These categories are: Layer 2, Layer 2 with Layer 3 features, or multilayer.

这些类别分别是:2层,2层与3层的特点,或多层。

In this paper eighteen examples, which are designed strictly owning to currently Codefor seismic design of buildings of my country, are used to analyze the structure earthquakeresponse under the horizontal seismic load (nabla load distribution pattern) by Push-overanalytical method. The corresponding structural influencing coefficient, the displacementamplification factor, the overstength and ductility factors are analyzed taking into accountthe factors changing, such as level number, span length, span number.

本文严格按我国《建筑抗震设计规范》设计了18个多层钢框架,并以此为例,采用Push-over方法分析了结构在水平荷载作用下的地震反应,得出了多层钢框架的结构影响系数、结构延性和超强系数以及位移放大系数,并讨论了这些系数随着结构层数、跨度及跨数的变化规律。

The result indicated that the AlTiN multilayer coating deposited on high speed steel substrates with alternated nitrogen contents in layers. In each layer, AlTiN exhibited nanocomposites of nanocrystallites embedded into amorphous matrices despite of the nitrogen content. The difference between bilayers was that AlTiN layer with lower nitrogen content had a lower density of nanocrystallites. The AlCN coating deposited on Si (100) substrate appeared a strained layer on substrate in the ilm-substrate interface, which thickness was 3~5 atom layer.

结果表明:在高速钢基体上制备的AlTiN多层薄膜由两种氮含量交替变化的膜层构成,尽管交替的两层中氮含量不同,但每一单层都为纳米晶包含在非晶点阵中的纳米复合结构,不同之处是低氮含量层中纳米晶密度较小;生长在单晶硅基体(100)晶面上的非晶AlCN薄膜,在膜基界面处硅基体上出现应力畸变层,应力畸变层厚度很薄,约3~5个原子层。

Further more, a conforming interpolater modeled with one-layer solid elements is proposed, obtaining the same simulated result comparing to the one with solid continuum elements when interpolater is thinner than 30mm.

在此基础上,提出连续模面单层实体单元包覆垫层等效模型,当弹性垫层厚度小于30mm时,它和连续模面多层实体单元包覆垫层等效模型有相同的模拟效果。

The method includes the steps of forming a peelable resin layer on a silicon substrate, forming the wiring substrate on the peelable resin layer, mounting semiconductor chips on the wiring substrate, forming semiconductor devices by sealing the plurality of semiconductor chips by a sealing resin, individualizing the semiconductor devices by dicing the semiconductor devices from the sealing resin side but leaving the silicon substrate, peeling each of the individualized semiconductor devices from the silicon substrate between the silicon substrate and the peelable resin layer, and exposing terminals on the wiring substrate by forming openings through the peelable resin layer or by removing the peelable resin layer.

该方法包括以下步骤:在硅衬底上形成可剥离树脂层;在所述可剥离树脂层上形成布线衬底;将半导体芯片安装在所述布线衬底上;通过用密封树脂密封所述多个半导体芯片来形成半导体器件;通过从密封树脂侧将这些半导体器件切分但是保留硅衬底来使这些半导体器件个体化;将每个个体化半导体器件在所述硅衬底和可剥离树脂层之间从硅衬底上剥离;并且通过形成穿过可剥离树脂层的孔或者通过除去可剥离树脂层来使布线衬底上的端子暴露。

Thus, this method is not restricted by the thickness and the layers of the laminates. And, it provides an valuable research method to the analysis of the interlaminated stress and failure of the laminates .

因此,该方法不受层合板厚度和层数的限制,它为层合板(特别是多层复合材料厚板)的层间应力和层间破坏分析提供了一种有效的研究工具。

Disclosed are an adhesive composition for a metal foil which comprises a material wherein a tracking resistance test is carried out according to the IEC method by making a thickness of an adhesive layer 30 to 40 mum, using a copper foil pattern with a width of 4 mm and making a distance between electrodes 0.4 mm, then the adhesive layer dissolves out for the first time when 5 drops or more of an electrolyte are dropped thereon, an adhesive-coated metal foil, a metal-clad laminate, a wiring board, a multi-layer board and a multi-layer wiring board using the same.

本发明公开了一种用于金属薄片的粘合剂组合物,它含有一种材料,其中,抗电弧径迹测试是按照IEC方法进行的,粘合剂层的厚度被做成30至40μm,使用了具有4mm宽度的铜薄片图形,并使电极之间的距离为0.4mm,然后,当5滴或更多的电解液被滴加其上时,粘合剂层被首次溶解掉。使用它的一种粘合剂涂覆的金属薄片,一种金属包覆的层压板,一种多层板和多层电路板。

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