多元件

The metal nanocrystals memories come into notice as so many advantages. The advantages of metal nanocrystals over their semiconductor counterparts include low power consumption, higher density of states, smaller energy perturbation due to carrier confinement, stronger coupling with the channel, better size scalability, and the design freedom of engineering the work functions to optimize device characteristics.

然而金属的量子点记忆体在近年来受到瞩目，其相对於传统半导体材料用於量子点记忆体上，有诸多的优势，其优势包含低功率耗损、高密度的能阶、没有明显的量子局限效应、有效降低元件尺度、且可调变的空间大，因为随不同的金属有不同的功函数。

The company is now dabbling with much larger micromechanical elements, which Drexler has disparaged in his books.

这个公司目前正涉足于大得多的微型机械元件的研究制造。德莱克斯勒的书中对此事有所指贬。

With the electrical connections at the top and bottom side of the wafer-level IC packaging Lead-frame structure and composition of the surface-mount semiconductor package structure Multi-layer printed circuit board Antifuse and its formation method and with the anti-fuse non-volatile memory device unit cell Tandem electric signal processing circuit and electronic device Light-emitting diode packaging structure and encapsulation method Electronic Packaging Structure Flip-chip high-speed optoelectronic components and structure Pairs of piezoelectric friction side by side to promote the three-step device and scanning probe microscope Light-emitting diode and its manufacturing method, the production base of light-emitting diode method Three or four parallel advance of stepping piezoelectric device and scanning probe microscope lens body Silicon substrate and its manufacturing method Semiconductor device and voltage-divider A polysilicon layer and the microcrystalline silicon layer of the double-substrate active layer structure, methods and devices The edge of the thickness of silicon controlled Of a lateral semiconductor devices and high-voltage devices With a vertical-channel transistors semiconductor device Of a memory array and for the manufacture of a memory array method Read-only memory cell array structure Active-matrix substrate and display device High-voltage semiconductor integrated circuit devices, dielectric isolated type semiconductor device Image sensing devices Lens module and its manufacturing methods Solid-state imaging device and camera Injection angle for the trench isolation Organic Light-Emitting Display Device Organic light-emitting display device Bipolar transistor structure of the surface passivation Double-triggered silicon-controlled rectifier HFET Metal-oxide semiconductor transistors Self-aligned trench accumulation mode field effect transistor structure Thin-film transistors and Display Devices TFT Lead Diode Low-frequency, low noise, low-flashing diode Used for thin-film solar cells trap light structure Transparent sun solar cells Quaternary semiconductor heterojunction photovoltaic cells heat Si nano-pillar array heterojunction thin-film solar cells GaN-based micro-composite solar cells isotope Optical sensor Semiconductor by optical components Imaging Detector Transparent conductive oxide coating Silicon-based high-performance dual-junction solar cells Thin-film solar cells Alien LED Devices

非专业，不在行，求高手帮忙。谢谢！具有顶部及底部侧电连接的晶片级集成电路封装导线架结构及其构成的表面黏着型半导体封装结构多层印刷电路板反熔丝及其形成方法和具有该反熔丝的非易失性存储器件的单位单元串联用电式信号处理电路及电子装置发光二极管的封装结构及其封装方法电子封装结构高速光电组件及其芯片倒装结构双压电体并排推动的三摩擦力步进器与扫描探针显微镜发光二极管及其制作方法、发光二极管的底座的制作方法三或四压电体并行推进的步进器及其扫描探针显微镜镜体硅衬底及其制造方法半导体装置与分压电路具多晶硅层及微晶硅层的双底材主动层结构、方法及装置硅晶片的受控边缘厚度一种半导体横向器件和高压器件具有垂直沟道晶体管的半导体器件一种记忆体阵列及其用于制造一记忆体阵列的方法只读内存单元阵列结构有源矩阵基板和显示装置高耐压半导体集成电路装置、电介质分离型半导体装置图像感测装置透镜模块及其制造方法固态成像装置和照相机用于沟道隔离的斜角注入有机电致发光显示装置有机发光显示装置双极晶体管的表面钝化结构双触发型可控硅整流器异质结场效应晶体管金属氧化物半导体晶体管自对准沟槽累加模式场效应晶体管结构薄膜晶体管及显示器件薄膜晶体管无铅二极管低频、低噪音、低闪烁的二极管用于薄膜太阳电池的陷光结构透明遮阳太阳能电池片四元半导体的异质结热光伏电池硅基纳米柱阵列异质结薄膜太阳能电池氮化镓太阳能同位素复合型微电池光学传感器半导体受光元件成像探测器透明导电氧化物涂层硅基高效双结太阳能电池薄膜太阳能电池异形LED器件

Metazoan transcription regulation occurs through the concerted action of multiple transcription factors that bind co-operatively to cis-regulatory modules.

多细胞动物的转录调控通过协同的结合到顺式调控元件的多个转录因子的协同作用而发生。

Because the electric products trend to become lighter, thinner, smaller and multi-functional, semiconductor industry has to focus on IC chip scale-down. Meanwhile, IC packaging technology must also become more advanced to be compatible with this trend. Wires weep is one of the important issues in packaging technology.

现今电子产品多以朝向轻、薄、短、小与多功能趋势发展，使得IC元件薄小化成为必要的发展技术，除了IC制程技术突破，提供晶片保护并作为讯号传输媒介的IC封装技术也必须随之跟进，对於金线偏移的预测与控制便是一例。

The design concept is to utilize the current of the most easily turned-on center fingers to trigger the substrate of all the other fingers.

其原理为利用多指状N型金氧半电晶体中，在静电放电下最易先导通的中间之指状N型金氧半电晶体元件来对所有指状元件作基体触发，以促进多指状N型金氧半电晶体均匀导通。

CAAT box" and "TATA box, potential regulatory motifs from transcription, and conserved cis-acting regulator elements were discovered within LTRs in the great number of sequences using plantCARE sortware.6 The insertional polymorphism of LTR-10 element within the genome of 8 wild species and 28 cultivars of Mallus Mill. was studied by sequence-specific amplification polymorphism.

分析获得的Tyl-copia类逆转座子的LTRs，其中含有启动子的结构特征&CAAT box&和&TATA box&及受不同胁迫条件作用的调控元件。6、基于苹果Tyl-copia类逆转座子LTR-10的SSAP技术在苹果属8个野生种和28个栽培品种中表现出了丰富的遗传多态性，多态性片段比例为88.2％。

SMD-MC34119 Pinout: C Three External Clock Inputs, Two Multi-purpose I/O Pins per Channel C Double PWM Generation, Capture/Waveform Mode, Up/Down Capability One Four-channel 16-bit PWM Controller One Two-wire Interface C Master Mode Support Only, All Two-wire Atmel EEPROMs Supported One 8-channel 10-bit Analog-to-Digital Converter, Four Channels Multiplexed with Digital I/Os IEEE 1149.1 JTAG Boundary Scan on All Digital Pins 5V-tolerant I/Os, including Four High-current Drive I/O lines, Up to 16 mA Each Power Supplies C Embedded 1.8V Regulator, Drawing up to 100 mA for the Core and External Components C 3.3V VDDIO I/O Lines Power Supply, Independent 3.3V VDDFLASH Flash Power Supply C 1.8V VDDCORE Core Power Supply with Brownout Detector Fully Static Operation: Up to 55 MHz at 1.65V and 85C Worst Case Conditions Available in a 64-lead LQFP Package

SMD-MC34119引脚说明： C款三输入外部时钟，两个多用途I / O引脚每通道双PWM生成，捕获/波形模式，上/下能力的一个四通道16位PWM控制器一两线接口C中间模式支持，只有在所有两线Atmel公司的EEPROM支持的一个8通道10位模拟数字转换器，四通道复用数字I / O的IEEE 1149.1 JTAG边界扫描所有数字引脚5V容限I / O口，其中包括4大电流驱动I / O线，最多一六毫安C镶嵌每个电源1.8V的稳压器，绘图高达100的核心和外部元件 3.3 VDDIO毫安I / O的电源线，独立电源3.3V的VDDFLASH闪光 1.8 VDDCORE核心电源掉电检测与全静态工作：高达55兆赫和85℃时为1.65V最恶劣条件下以64引脚LQFP封装

The panel assembly further includes a plurality of stud pins embedded into the side-wall of the panel, a spring positioned between the shadow mask frame and the stud pins to interconnect them, and a vibration damping member for damping vibration of the shadow mask by converting mechanical stress applied to the shadow mask into electrical energy.

屏板组件还包括嵌在屏板侧壁内的多个销钉，置于荫罩框架和销钉之间以连接它们的多个弹簧，和通过把施加于荫罩上的机械应力转变为电能以阻止荫罩振动的振动阻尼元件。

This digital thermometer design uses the American DALLAS Semiconductor Company after DS1820 promotes one kind of advanced version intelligence temperature sensor DS18B20 takes the detecting element, the temperature measurement scope may amount to 0.0625 degree Celsius for the - 55--125 degree Celsius biggest resolution, may the direct readout measure the temperature to plant, moreover used the three-wire system and the monolithic integrated circuit is connected, reduced the exterior hardware circuit, has at the same time the characteristic which the low cost and easy to use it to have the microminiaturization, the low power loss, the high performance, the anti-jamming ability strong, easy to match merits and so on microprocessor, the especially qualify in constituted the multi-spot temperature observation system, might directly the temperature inversion serial digital signal for microcomputer processing, moreover each piece of DS1820 had onlyThe product number and may store in its ROM, in order to constitution large-scale temperature observation system time hangs on the single track meets willfully many DS1820 chips.

本数字温度计设计采用美国DALLAS半导体公司继DS1820之后推出的一种改进型智能温度传感器DS18B20作为检测元件，测温范围为-55——125摄氏度最大分辨率可达0.0625摄氏度，可以直接读出被测温度植，而且采用三线制与单片机相连，减少了外部的硬件电路，具有低成本和易使用的特点同时它具有微型化、低功耗、高性能、抗干拢能力强、易配微处理器等优点，特别适合于构成多点温度测控系统，可直接将温度转化成串行数字信号供微机处理，而且每片DS1820都有唯一的产品号并可存入其ROM中，以便在构成大型温度测控系统时在单线上挂接任意多个DS1820芯片。

The split between the two groups can hardly be papered over.

这两个团体间的分歧难以掩饰。

This approach not only encourages a greater number of responses, but minimizes the likelihood of stale groupthink.

这种做法不仅鼓励了更多的反应，而且减少跟风的可能性。