基板

A switch unit and an LED are arranged on the substrate at locations adjacent to each other.

设置在基板上的开关单元和LED的位置彼此相邻。

A top loaded antenna is provided that is composed of a triangular-shaped resonator and a dielectric substrate.

一种顶端负载之类梯形平面天线，其中，顶端负载之类梯形平面天线形成在一基板表面，并藕接至一射频电路。

Encapsulant was driven by capillary force into the space between the chip and substrate. Underfill technique can protect the electrical device and prevent the device from destroying because of external force. Underfill has many defects including the fill time is too long, the situation of short shot and air trap are caused easily, the yield of product of Flip-Chip is not highest and the products are universal. Therefore, there are many factors being studied in this paper to sum up the influence of underfill of Flip-Chip process cause by model parameters.

覆晶接合技术为先进电子讯号连接技术中的一种，具有高I/O数、电子讯号路径短以及尺寸小等优点，而采用覆晶接合之电子元件大部分均以底部充填技术进行封装；底部充填是一种以毛细作用为驱动力在晶片与基板之间的间隙充填底胶的封装技术，可以确保晶片不受到外力的影响而损及封装体，但此技术具有充填时间长、容易产生短射与包风等缺点，使得覆晶封装制程良率不高，间接影响覆晶封装产品的普及率，因此本文将依各种可能之参数模型对覆晶封装底部充填制程的影响，以供业界参考。

We transfer the taken picture into binary form and separate scratches and dusts by calculating their areas.

取像后，使用二值化加强刮痕影像，再利用二值化图形中面积的大小进行刮痕与灰尘的分类，藉此来检测出玻璃基板上的刮痕。

The motivation of this thesis is to develop a novel process technique to overcome the above problems.

有鉴於此，本论文主要是发展一可符合现行薄膜电晶体制程且便宜的有机薄膜基板。

This paper presents conductive polymer molecular materials with insulating powder, mixed into the deployment of surge suppressors for low capacitance of paste, while the component design concept is based on the field of passive components, manufacturing process to make the basic theory to design the protective components, the main use of the existing ceramic substrate for the component body structure design, screen design in the body through the structure of the gap at the top of the printing layer of a different conductors, and then to learning to know the printing process technologies approach the low capacitance of the surge suppressor paste cover the gap in the two conductors, and by the resistance of plastic burning process technology, the temperature of sintering parts made of electrostatic protection element, and this protection through the external ESD components in bombardment tests, measurement of capacitance electrostatic discharge after bombardment, Trigger voltage and leakage current data, and the volume measured by the results of future discussion of the layout of this different style of work in the same area, different clearance, solid content and temperature than the next, for the attainment of performance components, a low capacitance ESD protection devices with low breakdown voltage requirements and to chip-based protection devices can be designed to integrate with the advanced Integrated Circuits or used independent of the electrostatic protection element in the system.

本文提出高分子导电分子材料搭配绝缘粉末，调配混合成适用於低电容突波抑制器之PASTE，而元件设计概念是以被动元件制程领域作基础理论去设计此防护元件，主体利用现有陶瓷基板为元件本体结构设计，在经由网版设计在本体结构上方印刷一层不同的间隙导体，再以习知印刷制程技术方式，将低电容突波抑制器之PASTE覆盖在两导体的间隙内，并经由电阻制程习知塑烧技术，将元件烧结适当温度制成静电防护元件；而此防护元件在经外加静电放电轰击测试后，量测静电放电轰击后的电容、Trigger voltage及漏电流相关数据，并藉由测结果讨此同的布局样式，在相同工作区面积、不同间隙、固含量与温度比下，对於元件效能是否达到静电防护元件低电容与低崩溃电压的需求，并藉此晶片型防护元件可设计整合於先进积体电或应用於独系统的静电防护元件中。

Surface temperature of board: 100℃ or less.

基板表面温度： 100℃以下。

Surface treatment of board has critical influence to complete optimal properties of wet film .

基板的表面处理对湿膜是否能够充分发挥其性能具有关键性影响。

Surface treatment of board has critical influence to full optimal properties of solder mask .

基板的表面处理对阻焊油墨是否能够充分发挥其性能具有关键性影响。

In the second half of the thesis, the basic theory and structure of switch are described. The 60GHz and 77GHz single-pole double-throw switches are designed in shunt configuration with PHEMT on GaAs substrate.

本论文后半部分介绍了开关设计的基本原理及架构，并利用并联型的架构，以PHEMT为电晶体，砷化镓为基板，设计频率工作在60GHz与77GHz的单刀双掷开关。

She gently rebuff ed him, but agreed that they could be friends

她婉言拒绝了，但同意作为朋友相处。

If in the penal farm, you were sure to be criticized.

要是在劳改农场，你等着挨绳子吧！