基板

This study proposes to coat these CIGS thin film bases under the non-vacuum. In this process, synthesis nano-sized alloy powder is turned into trihydric compound paste of CIS by using Sol-Gel in the first step. An array of CIGS thin film absorbing layer was produced on Soda Lime glass through screen-printing.

中文摘要本文提出以非真空制程的涂布方法制备CIGS薄膜吸收层，将具备奈米等级的多元合金粉末利用溶胶-凝胶制备三元化合物的CIS前驱层浆料，以网版印刷式於钠玻璃基板上制作CIGS薄膜吸收层。

Aim to the application purpose of all-solid state electrochromic device and electronic link materials, which are prepared on flexible substrate. The tungstenic acid sols doped with PEO, MoO_3 and the PEO6000 nano-sized composite Ni_2 sols were prepared by ionic- changing and alcohol salt hydrolyzing technology of sol-gel method.

本论文以全固态的电致变色显示器件和柔性基板电子墨水显示材料为应用目标，采用溶胶-凝胶技术中的离子交换法和醇盐水解法分别制备了PEO、MoO_3掺杂的钨酸溶胶和PEO掺杂Ni_2的复合溶胶体系。

And research shows that high thermal conductivity composite can decrease the temperature difference of underfill between chip and substrate, so that it can improve the temperature distribution of the flip chip, decrease the thermal stress of underfill and increase packaging reliability.

表明高导热系数的底充胶可明显降低在芯片和基板之间的温度差，降低底充胶的热应力，进而提高电子封装的可靠性。

On the basis of the summarization of MCM-Cs main features and its assembly and packaging technologies, the paper puts stress on relatively deepgoing studies in practically advanced MCM-C assembly process technologies as gold ball wire bonding, IC chip gold ball stud bump making, IC flip chip bonding and underfilling, in high reliability MCM-C packaging process technologies as integral LTCC substrate packaging, hermetically metal sealing, and also in the basic technological process of MCM-C assembly and packaging. Later on, it presents the effectively engineering development of two high level actual module products--a high-density monolithic processor system MCM-C , a high-speed data collecting and processing system MCM-C. Lastly, it briefly introduces various common methods of quality inspection and reliability test of MCM-C assembly and packaging in engineering practice.

论文在综述MCM-C的主要特点及其组装封装技术的基础上，重点对金丝球引线键合、IC芯片金球凸点制作、IC芯片倒装焊与下填充等实用先进MCM-C组装工艺技术和LTCC基板与外壳及PGA引线的一体化封装、气密性金属封装等高可靠MCM-C封装工艺技术以及MCM-C组装封装基本工艺流程展开了较深入的研究，有效完成了高密度单片机系统MCM-C和高速数据采集控制系统MCM-C等两种高水平实际产品的工程化研制工作，扼要介绍了工程实践中MCM-C组装封装工艺常用的质量检验方法和可靠性试验方法。

Using the molecular field approximation, liquid crystal film s on the unrubbed substrates are studied by Lebwohl-Lasher model.

采用分子场近似。通过Lebwohl—Lasher模型研究无摩擦基板上的液晶薄层。

Using the molecular field approximation, liquid crystal films on the unrubbed substrate s are studied by Lebwohl-Lasher model.

采用分子场近似。通过Lebwohl—Lasher模型研究无摩擦基板上的液晶薄层。

The components and surface microstructure of the oxide film is analyzed by X-ray and SEM. Its power insulated is measured. The results show that oxidation film is composed of noncrystal Al_2O_3 and a little of crystal γ-Al_2O_3, it shows i...

结果表明，所获得的氧化膜是由非晶态的Al2O3以及少量晶态-γAl2O3组成，呈致密的网状结构，其电学性能满足基板的要求。

After the rest of the components are built up layer by layer, the mesh is excavated from the strata, and once it is exposed, a gas plasma etches the silicon substrate under it, creating a cavity that allows the now released structure to vibrate freely.

在其他元件一层层制造完成之后，便将线路从该层挖出来，镂空后，再以气体电浆在底下的矽基板上蚀刻出空洞，让元件可以自由地振动。

When solder bumps (22) on the die are reflowed, the fluxing agent acts to remove any oxides present on the solderable surfaces of the substrate or the die.

当管芯上的焊料突点（22）被回流时，该助焊剂的作用是清除基板或管芯的可焊接表面上存在的任何氧化物。

The metal foils were 26 mm x 26 mm so that they slightly over hanged the substrates.

金属箔为26毫米× 26毫米，使他们略高于绞死的基板。

She gently rebuff ed him, but agreed that they could be friends

她婉言拒绝了，但同意作为朋友相处。

If in the penal farm, you were sure to be criticized.

要是在劳改农场，你等着挨绳子吧！