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The traditional circuit boards, particularly early pachytene circuit boards, as requested details of the lines is not very high, it can use the network will be printed circuits printed on the inner layer substrates.

传统的电路板,尤指早期的粗线电路板,由于线路的细致要求并不是很高,因此可以用网印的方式将线路直接印在内层基板上。

Finally, the PEC-treated LEDs are packeted as the TO-Can and Lamp formal to measure the output power. The fabricated LEDs through the PEC process have 14.6% output power enhanced compared with the general LED at 20 mA operation current.

最后将基板磨薄切割劈裂成晶粒,并且以 TO-Can 与 Lamp 形式封装,量测电性资料与光学特性,发现表面结构的改变也影响发散角度,经过处理的晶粒有较大的发散角度,最终封装成 Lamp 形式的光输出功率增加14.6%。

In recent years, the demand for photodetector operating at wavelength, of 1300 nm and 1550 nm is growing rapidly, due to the need for optical fiber communication systems.

近几年来,由於光纤通讯市场之需求,操作在1300nm到1550nm波段之光侦测器有很广泛的应用价值,同时,将光与电元件整合在同一基板上是非常热门的研究。

Exposure energy will change with different CCL , thickness of ink and baking stage , so we must carry on experiment to confirm printing ink minimum surviving width , surface gloss and photosensitive degree on the back , then establish suitable condition .

曝光能量会因基板的材质及涂膜厚度烘干程度之不同而有差异,故需进行试验确认油墨最小残存宽度,表面光泽及背面感光程度后,再设定适宜的条件。

Exposure energy change with different thickness of ink,so we must carry on experiment to confirm printing ink minimum surviving width,surface blare and photosensitive degree on the back,then establish suitable condition

曝光量会因基板的材质,及涂膜厚度之不同而有差异,故需进行实验确认油墨最小残存宽度、表面光泽及背面感光程度后,再设定适宜之条件。

It consists of substrates preheater, intelligent proportion-integral-derivation controller and computer serial collecting and feedback control components.

该系统由基板预热器、智能比例微分积分控制器以及计算机串口温度采集反馈控制等3部分组成。

An insulating film is formed on a first principal surface of the substrate.

本发明在非线性光学材料组成的基板的第1主表面上形成绝缘膜。

A second advance that contributes to this expansion is the enclosed print head, which allows a wide variety of materials to be delivered through the stencil to the substrate.

扩展的第二个进步是附着印刷头,它允许大量的物料通过钢网到达基板上。

Compared with traditional thermal spraying, CGDS eliminates the negative effect of high temperature on the coating and the substrate. It also has many other merits such as avoiding oxidation, small residual stress, high efficiency of particles depositing, low porosity of the coating, coating material reclaimable and so on.

和传统的热喷涂相比,冷喷涂工艺消除了高温对涂层和基板的不利影响,具有避免氧化、残余应力小、沉积率高、涂层孔隙率低、涂料可以回收等诸多优点。

A new way to test the film electrical wire on VFD scaleboard is introduced in this article.The author compared the in-out capability of film electrical wire with singlechip.The system has been tested which indicates that the operating costs of VFD could be lowered.

摘 要:本文提出一种测试VFD基板导电线路的系统设计,利用单片机进行输入输出的比较,判定其导电线路的质量,通过实际应用表明,它能大幅度的降低VFD的生产成本。

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