在背面

Good printing and punching properties combined with solid overall economy has had me choosing Korsn?s year after year. Before Christmas 2009, we will take things even further and print on the back, says Claes.

良好的印刷和与整体经济的结合冲压性能，我不得不选择年复一年科什奈斯年。2009年圣诞节前，我们会采取进一步的东西，并在背面印刷，克拉斯说。

Explain "counterpoint" or write your name on the reverse of the paper.

请解释「对位」，或把名字写在背面也行

The hair is plaited into a bun at the back of the crown, with snail curls around the brow and at the sides of the head.

头发被编成一个髻在背面的皇冠，与周围的额头蜗牛卷曲，并在头的两侧的。

Perianth segments with a winglike appendage in fruit (at early anthesis slightly thickened abaxially).

花被片与一翅状附属物一起在果期(在背面尽快开花期稍加厚)。

Spikelets laterally compressed, with 2 to several florets, disarticulating above glumes and between florets; rachilla villous; glumes longer than lowest lemma, sometimes as long as spikelet, narrow, membranous, 1-veined; floret callus linear, hairy; lemmas lanceolate to ovate, hyaline, 3–7-veined, villous on back, entire or 2-dentate, awnless or with a terminal awn; palea glabrous or sometimes pilose; female plants with sterile anthers present.

小穗侧面压扁，具到数枚小花，脱节上述颖片和在之间小花；小穗轴具长柔毛；颖片长于最低的外稃，有时倍于小穗，狭窄，膜质，1脉；小花结茧线，有毛；外稃披针形到卵形，透明，3-7－脉，具长柔毛在背面，具牙齿的全缘或2上，或具顶生芒；无毛和有时具柔毛的内稃；雌株具不育花药宿存。

Donor feathers from the same species can be splinted back on , or the damaged feathers can be removed under anesthetic and regrowth will commence immediately .

从同一物种捐助羽毛可以在背面使用夹板，或者损坏的羽毛可以在麻醉和再生下将立即开始。

Take your place in the back of the formation at the right to start the briefing.

採取您的位置在背面的形成，在適當的啟動發布會。

Always bend the knees when bending or lifting; always hollow the back when kneeling; when carrying, distribute weight evenly; when standing for long periods stand with your feet slightly apart; when pushing or pulling try to keep your back straight and take the strain on your arms.

膝盖弯曲时总是弯或取消；始终跪在背面空心；当携带重量平均分配；当你站在站太久脚稍微遥远；当你推或者拉回到直尽量采取应变你武器。

Even in aerobic activity the thermo-formed and ergonomically adjusted contact surfaces enable the free flow of air on the back.

即使在有氧运动的热形成和变化，符合人体工程学的接触面，使空气在背面自由流通。

After back side grinding, the wafer thickness may be reduced, for example, to a thickness in the range of approximately 50 to approximately 100 micrometers.

在背面打磨之后，可将晶片的厚度减少到例如在大约50到大约100微米之间的厚度范围。

The split between the two groups can hardly be papered over.

这两个团体间的分歧难以掩饰。

This approach not only encourages a greater number of responses, but minimizes the likelihood of stale groupthink.

这种做法不仅鼓励了更多的反应，而且减少跟风的可能性。