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Amukhin et al.,and convert it into an effective1D chain with particular distribution of equivalent coupling bonds.Then we use the single-electron Schrodinger equation to calculatewave functions of electrons in the chain by transfer matrix method,without using the assumption of Samukhin et al.On variable hoppingmechanism and critical percolation condition.From this calculationwe obtain the dc conductance directly from Landauer-Buttikarformula.

mukhin提出的多层次等级分形结构模型,将其简化为耦合键强度t具有特殊分布的等效一维链,舍弃前人假设的变程跳跃机制与临界渗流条件,从单电子薛定谔方程出发,用转移矩阵方法计算一维链的透射系数,再利用Landauer-Buttickar公式直接求出直流电导。

Don't let the sins of your past creep back into your life...

不要让你的捷联惯导系统在过去的蠕变返回到您的生活。。。

Then, using the derivatives of the two dimensional normal cumulative distribution function with respect to its variables of parameters, the sensitivity measure of the failure probability of the parallel system or the unconditional up-crossing rate of the combined process can be determined.

最后利用经典的时不变可靠性分析方法确定并联系统的失效概率,并利用二维正态分布函数的导数特性确定失效概率的敏度。

A left null factor of derivative matrix is introduced, and the sliding surface and the control's parameterization can be obtained by sloving strict LMI.

引入导数矩阵的左零因子,使得滑模曲面及控制器参数的求解可经过求解严格线性矩阵不等式获得,在一定程度上简化了LMI方法在奇异系统变结构控制器设计计算中的计算复杂性。

The simulation results prove that the new structure can reduce the turn-off time by more than 75%compared with the normal one under the same breakdown voltage and on-state performance.

理论分析和模拟结果证明,该结构在击穿电压、导通损耗不变的情况下,能将关断时间减少75%以上。应用这样的结构只需增加两个分压比一定的分压电阻。

Using the product effect of electrostrain and piezopermeability, a novel and heterotypic composite of magnet/ferroelectrics has been developed and its electromagnetic coupling has been investigated.

利用应力变磁导与电致伸缩效应的乘积效应,设计和制备了一种新型的异型磁体/铁电复合材料,并研究了该材料的电磁耦合特性。

In electronic engineering, we usually have to bond a micro-strip board to a metalcarrier in order to provide proper stiffness, thermal conductivity and electrical conductivity, thus to make general handling,solder stencilling, pick and place of components be easier, and prevent the warping or distortion of the board during soldering.

林伟成,微带板与金属载体间的大面积焊接及胶接方法工程中常常需要把微带板和金属载体焊接或胶接起来,以获得合适的刚性、电导率和热导率,从而使丝网印刷、元器件贴装等工艺过程变得更加容易。并防止焊接过程中微带板的翘曲和变形。

Changing the Photo resist stacking sequence combined with the shift exposure method, the small gate footprint with field modulation plate been fabricated simultaneously.

藉由改变光阻堆叠次序并佐以曝光位移法,即可同时达到较小闸极线宽及产生场调变电极板,以达到更高的崩溃电压及更高的转导值。

Derived the material derivative (time rate of change following the flow in an Eulerian context).

推导随体导数(在欧拉架构下的流体的时间变率)。

We find that the localized waveguide transmission peak redshifts and becomes broader along with the layer distance D increasing.

本工作发现随着板间距D 的增大,局域波导共振峰发生红移,同时峰的宽度明显变宽。

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你知道吗,我需要你回来

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第三章汉藏语&的&字结构的类型划分。